2026-05-25, di 2026
Fɔ pik di rayt PTFE ay-tɛmpracha tep fɔ wan 3D printa hot bed nid fɔ pe atɛnshɔn pan 4 ki indikɛtɔ dɛn: tɛmpracha rɛsistɛns (we go rich 260°C+), fayv glas-rɛinfɔs sabstret (0.18mm ideal), silikon adeziv bak wit nɔ-stik tɔp sɔfays, ɛn di rayt wit/tolɛreshɔn. Dis gayd de ɛp yu fɔ avɔyd fɔ wɔp, rɛsɛdyu, ɛn print fayl.
Rid Mɔ
2026-05-13, di 2026-05-13
Jiangsu Aokai Nyu Matirial, we na wan lida manifakta fɔ PTFE ay-tɛmpracha tep, de gi yu prɔfɛshɔnal tɛknikal analisis.Di polariti, sterik hindrance fɔ ɔrganik grup ɛn agregeshɔn strɔkchɔ fɔ mɔlikul chen dɛn na MQ silikon rɛsin na di kɔr faktɔ fɔ rigul di pefɔmɛns balans fɔ
Rid Mɔ