2026-06-24 khan a rawn thleng ang
Wide-temperature-range PTFE tape hian -70°C atanga 260°C thlenga adhesion vawng reng thei silicone PSA a mamawh a ni. Design element pawimawh tak takte: primer-anchored transition layer (delamination a veng), sea-island microstructure (MQ resin islands + polysiloxane continuous phase), gradient crosslinking (creep resistance atan high-density inner layer, low-temp tack atan low-density outer layer), leh heat-stabilized fillers (oxidation laka invenna atan cerium oxide). Phenyl-modified siloxane segments hian low-temperature crystallization a titawp a, -100°C hnuaiah flexibility a siam thei a ni.
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2026-06-18 chhungin a ni
PTFE high-temperature tape-a cut end face structure hian adhesive oozing leh edge lifting chu a hman laiin direct-in a nghawng a ni. Slitting tha lo (dull blades, angle dik lo) hian glue filaments a siam a, edge adhesive layer a ti thin a, fiberglass burrs a pholang bawk – chu chuan oozing, weak bonding, leh heat emaw tension hnuaia lifting a thlen thin. End face mumal lo (wavy, protruding) hian pressure distribution inang lo tak a siam a, dahkhawm laiin adhesive creep a tichhuak thin. End face tha ber chu a smooth, flush, leh damage-free a ni – seal angin a thawk a, adhesive chu a lock a, full edge bonding a tichiang bawk.
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2026-06-17 khan a lo thleng dawn a ni
PTFE tape coating lai hian silicone pressure-sensitive adhesive solvent volatilization rate hi process parameter pawimawh tak a ni. Rang lutuk → lei chung lam vun, leveling tha lo, pinholes (trapped solvent), leh craters (condensation emaw contaminant-induced) te a awm. Slow lutuk → sagging, thick edges, leh low-surface-energy PTFE-a dewetting. Strategy tha ber chu: leveling leh bubble escape atan initial volatilization slow, chutah shaping atan accelerated drying. Mixed solvents (toluene/xylene + fast-drying) leh gradient oven temperature (low→medium→high) hmang la.
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2026-06-15 chhungin a lo thleng ang
PTFE high-temperature tape hian a chunglam bawlhhlawh (dust, silicone oil), adhesive cohesive failure (residue), emaw substrate bonding chak lo vangin a hman nawn leh hnuah adhesion a hloh thin. A chinfel dan tur: high-crosslink silicone PSA (migration hniam, balanced tack/holding power), PTFE substrate-a primer treatment, fiberglass backing dense, leh hman dan dik (a chung thianghlim, peel lum, 180° angle). Quantitative testing hian hmasawnna a nemnghet a ni.
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2026-06-10 khan a rawn thleng ang
PTFE high-temperature tape roll form-a dah te hian interlayer adhesion (blocking) leh non-stick side-a adhesive transfer te an tuar thei a ni. A chhan bulpui ber: PTFE film elastic memory leh silicone PSA te hi pressure leh heat hnuaiah an creep thin. Solution: gradient winding tension – pawn lam layer-ah tight, chhung lam layer-ah loose – closed-loop tension control hmangin. Release coating, dahna dik (15-40°C, 30-70% RH), horizontal placement, leh quarterly roll rotation hmanga tihpun a ni.
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2026-06-09 khan a rawn thleng ang
Food contact-a hman tur PTFE high-temperature tape hian temperature limit khauh tak a zah tur a ni: hman chhunzawm zel tur chuan ≤260°C (hun bituk nei lo), minute 30 thleng chauh 260-300°C, leh >300°C khap a ni. Tape hi indirect contact atan chauh (tray liners, heat sealer covers) a ni a, direct food wrapping atan a ni lo. Food load (dry heating) tel lovin hnathawh ngai suh. A hring, a sen, a hring emaw a nih chuan thlak leh rawh.
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2026-06-08 khan a rawn thleng ang
PTFE high-temperature tape-a silicone pressure-sensitive adhesives (PSA) hi high-temperature aging performance-ah a inang lo hle. Methylphenyl silicone PSA hian 250°C/ni 7 hnuah pawh >85% peel strength a vawng reng a, standard methyl type erawh 50-70% ah a tlahniam thung. Addition-cured (hydrosilylation) system hian peroxide-cured aiin stability tha zawk a pe a ni. 200°C+ service chhunzawm zel tur chuan addition-cured high-phenyl grades thlang rawh.
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2026-06-08 khan a rawn thleng ang
Thermally conductive PTFE pressure-sensitive adhesive (PSA) tape te hian a sticky reng laiin heat conduct a ngai a ni. Fillers dah belh hian thermal conductivity a ti tha a, mahse adhesion a ti na thung. Optimal balance hian spherical coarse particles (conductive skeleton angin) fine particles nena blend (voids fill turin) a hmang a, total filler loading chu percolation threshold aia sang deuhah a awm reng a ni. Flakes leh fibers te hi pumpelh la; an kill tack.
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2026-06-05 khan a rawn thleng ang
PTFE high-temperature tape hian PV industry tan hna hrang hrang pahnih a thawk a, chungte chu process consumable (laminators-a EVA overflow adhesion a veng, solder mask) leh long-life insulation (busbar wrap, junction box fixation) te an ni. Internal hman reng tur chuan tape te hian IEC 61215: 1000-2000h damp heat, UV, thermal cycling (-40°C atanga +85°C), silicone PSA leh shrinkage <1% te a paltlang tur a ni.
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2026-06-04 khan a rawn thleng ang
PTFE high-temperature tape heat-sealing knives leh sealing strip-a hnawih hian core value pali a pe a, chungte chu: molten plastic adhesion a veng (downtime a titawp), sealing dies man to tak takte a humhim a, seal awm reng tur chuan heat/pressure a homogenize a, film friction a ti tlem bawk. Fiberglass-backed tape (0.13-0.25 mm) hmanga silicone PSA (≥260°C) dah a tha. Line chak tak tak tan anti-static black tape a awm.
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