Iteyiphu ye-PTFE yombhobho wekhemikhali / isitya sokuchasa umhlwa, ukungagugi, kunye nokhuseleko lokutywina lufuna i-substrate ehambelanayo, inkqubo yokuncamathelisa, kunye nemidiya yekhemikhali. I-Silicone PSA inconywa kwi-200-260 ° C kunye ne-acids / alkalis; I-acrylic PSA ixhathisa izinyibilikisi eziphilayo kodwa inciphisa ubushushu ukuya ku-≤150°C. Kwi-HF, ukubilisa >80% alkali, okanye i-chlorine trifluoride, sebenzisa i-PTFE-kuphela i-lining (ayikho i-organic adhesive). Okubalulekileyo: i-adhesive lelona khonkco libuthathaka, hayi i-PTFE ngokwayo.

I-PTFE tape yokubamba amandla aphuculwe ngokutyabeka kunye nokunyanga inkqubo yokwandisa. Ukwambathisa: umaleko primer (0.5-2μm silane primer kuthintela adhesive peeling), ukuncamathelisa ubukhulu 30-60μm (elona lifanelekileyo ukubamba amandla), vacuum defoaming, kunye 5-10μm filtration. Ukunyanga: ukufudumeza okuhamba ngamanyathelo (80-100 ° C ukususwa kwe-solvent → 120-140 ° C ukubunjwa → 150-220 ° C i-crosslinking enzulu), i-post-curing (40-60 ° C ye-24-48h yokuphumla uxinzelelo), kunye ne-low-tension conveyance ukukhusela uxinzelelo lwangaphakathi kwi-substrate shrinkage. I-primer ibalulekile kumandla asezantsi e-PTFE.

Iteyiphu ye-PTFE yobushushu obuphezulu isebenza njengesixhobo esibalulekileyo kwimveliso ye-semiconductor, hayi injongo esetyenziswayo ngokubanzi. Izicelo eziphambili: ukukhuselwa kwenqanaba le-wafer (i-plasma etching masking, i-CMP yokukhusela ngasemva, i-CVD / PVD masking), iinkqubo zokupakisha (ukulungiswa kwe-wire bonding, imaski ye-soldering ye-PCBs), kunye nokugcinwa kwezixhobo (i-anti-static roller wrapping, ukuphawula indawo yokucoca). Iimfuno ze-Ultra-clean: i-halogens ephantsi (ikhusela i-bond pad corrosion), i-siloxanes ephantsi (<500 ppm, inqanda ukubunjwa kwe-particle ye-insulating), i-ion yensimbi ephantsi (<1 ppm nganye), i-ISO Class 4 yokucoceka kwe-slitting / ukupakisha, i-10⁶ -10⁹ Ω ukukhutshwa kwendawo ye-TV ephantsi.

Iteyiphu yobushushu obuphezulu be-PTFE yonyango idibanisa i-biocompatible substrate ye-PTFE kunye ne-adhesive ye-silicone ephiliswe ngeplatinam. Iimpawu eziphambili: I-ISO 10993 ehambelanayo (ayikho i-cytotoxicity, i-sensitization, okanye irritation), imelana ne-sterilization ephindaphindiweyo (i-steam / EO / gamma), i-260 ° C yokumelana nokushisa. Amanyathelo okhuseleko abalulekileyo: ungadluli kwi-260 ° C (umsi oyityhefu ongaphezu kwe-300 ° C), i-gamma irradiation inokubangela u-embrittlement, uqinisekise iindlela zokuvala inzala, kwaye ucele amaxwebhu okuthobela ngokupheleleyo (iingxelo ze-ISO 10993, i-MSDS, idatha yokuguga). Ayilogazi elithe ngqo okanye ukusetyenziswa kofakelo ngaphandle kokuba kuqinisekiswe ngokuthe ngqo.

PTFE tape reusability ixhomekeke kwizinto ezine: ukwakhiwa kwencamathelisa (high crosslink density, low abicah migration, microphase structure for repositionable tack), substrate anchoring (ukusebenza komphezulu + primer ukuthintela ugqithiso oluncamathelayo olupheleleyo), umva wokwaleka (ukukhulula umaleko ukukhusela incatho ngexesha lokukhulula), kunye nokuphatha ngokufanelekileyo (i-adhesive ecocekileyo yokuncamathela, ukunqanda i-adhesive echanekileyo, i-adhesive echanekileyo). Izinto ezincamathelayo ezihlanjwayo ezihlanjwa ngamanzi zinokuphinda zifumane i>90% tack emva kokucoca.

Ubushushu obubanzi boluhlu lwe-PTFE tape ifuna i-silicone ye-PSA egcina ukunamathela ukusuka kwi-70°C ukuya kuma-260°C. Izinto eziphambili zoyilo: i-primer-anchored transition layer (ikhusela i-delamination), i-microstructure yesiqithi-selwandle (i-MQ resin islands + i-polysiloxane isigaba esiqhubekayo), i-gradient crosslinking (i-high-density layer yangaphakathi yokuxhathisa i-creep, i-low-density yangaphandle ye-low-temp tack), kunye ne-heat-stabilized fillers (i-oxid oxide). I-Phenyl-modified siloxane segments cinezela i-low-temperature crystallization, eyenza ukuguquguquka ngaphantsi kwe -100 °C.

I-Aokai PTFE yaqala imveliso yayo epheleleyo kwi-APFE Shanghai 2026 (Booth 6T602, Hall 6). Iimveliso ezifakiweyo ziquka iiteyiphu ze-PTFE ze-fiberglass, iifilimu ezicocekileyo ze-PTFE, amabakala achasene ne-static, kunye namabhanti okuhambisa obushushu obuphezulu - ukugubungela ukulungiswa kokutya, i-PV lamination, iibhetri ze-lithium, i-electronics, kunye nokupakishwa. Lo mboniso uqhuba ngoJuni 26. Zonke iimveliso zixhasa ukucaciswa kwesiko.

Ngexesha PTFE tape ukutyabeka, izinga volatilization ukunyibilika of abicah ngoxinzelelo-sensitive adhesive yinkqubo ebalulekileyo parameter. Ukukhawuleza kakhulu → ukusulwa komphezulu, ukungaphakami kakuhle, imingxunya (isinyibilikisi esivalekileyo), kunye nemingxuma (ukujiya okanye ungcoliseko). Ukucotha kakhulu → ukujiya, imiphetho eshinyeneyo, kunye nokumanzisa kwi-PTFE yamandla asezantsi. Elona qhinga lifanelekileyo: ukucotha kokuqala ukuguquguquka komgangatho kunye nokuphunyuka kweqamza, emva koko ukoma okukhawulezileyo ukubunjwa. Sebenzisa izinyibilikisi ezixubeneyo (i-toluene/ixylene + ukomisa ngokukhawuleza) kunye nobushushu be-oven yegradient (ephantsi →phakathi → phezulu).

I-PTFE i-tape yobushushu obuphezulu ilahlekelwa ukubambelela emva kokusetyenziswa ngokuphindaphindiweyo ngenxa yokungcoliswa komhlaba (uthuli, ioli ye-silicone), ukungaphumeleli kwe-adhesive cohesive (intsalela), okanye i-substrate bonding ebuthathaka. Izisombululo: i-silicone ye-high-crosslink ye-PSA (ukufuduka okuphantsi, ukulinganisa ukulinganisa / ukubamba amandla), unyango lwe-primer kwi-substrate ye-PTFE, i-dense fiberglass backing, kunye nokuphathwa ngokufanelekileyo (indawo ecocekileyo, i-peel epholileyo, i-angle ye-180 °). Uvavanyo lobungakanani luqinisekisa ukuphuculwa.

I-PTFE i-tape ephezulu yokushisa egcinwe phantsi kweemeko ezichaziweyo (10-25 ° C, 40-70% RH, kude ne-UV / uxinzelelo olunzima) inobomi beshelufu obuqhelekileyo beenyanga ezi-3-6 (amabakala e-premium ukuya kwiinyanga ezili-12). Imilinganiselo ephambili yokuthotywa: amandla e-peel kufuneka angawi phantsi kwe-70% yexabiso lokuqala; akukho ntsalela yokubambelela emva kokususwa kobushushu obuphezulu; akukho carbonization okanye ukuqhekeka kwiqondo lobushushu rated. Iitshekhi ezikhawulezayo: imvakalelo yokukhulula ngesandla, uvavanyo lwentsalela ye-260 ° C, kunye novavanyo lokuncipha kwe-lamination.