Itheyiphu ye-PTFE yepayipi lamakhemikhali/isitsha sokunqanda ukugqwala, ukungagxili, nokuvikelwa kokuvala kudinga i-substrate ehambisanayo, isistimu yokunamathela, kanye nemidiya yamakhemikhali. I-Silicone PSA inconywa ku-200-260 ° C ngama-acids / alkali; I-acrylic PSA imelana nezinyibilikisi eziphilayo kodwa ikhawulela izinga lokushisa libe ngu-≤150°C. Ku-HF, ukubilisa >80% alkali, noma i-chlorine trifluoride, sebenzisa i-PTFE-only lining (akukho okunamathelayo okuphilayo). Okubalulekile: i-adhesive iyisixhumanisi esibuthakathaka, hhayi i-PTFE ngokwayo.

Amandla okubamba itheyiphu ye-PTFE athuthukiswa ngokugcotshwa kanye nokwenza ngcono inqubo yokwelapha. I-Coating: ungqimba lwe-primer (0.5-2μm silane primer ivimbela ukuxebuka kwe-adhesive), ukujiya kwe-adhesive 30-60μm (okulungele ukubamba amandla), i-vacuum defoaming, kanye nokuhlunga okungu-5-10μm. Ukwelapha: Ukushisa okuhamba kancane (80-100°C ukususwa kwe-solvent → 120-140°C shape → 150-220°C deep crosslinking), post-curing (40-60°C for 24-48h ukuze uphumuze ingcindezi), kanye nokudluliswa kwe-tension ephansi ukuvimbela ukucindezeleka kwangaphakathi ekuncipheni kwe-substrate. I-primer ibalulekile kumandla aphansi we-PTFE.

Itheyiphu ye-PTFE yokushisa okuphezulu isebenza njengento ebalulekile ekwenziweni kwe-semiconductor, hhayi into evamile esebenzisekayo. Izinhlelo zokusebenza ezibalulekile: ukuvikelwa kweleveli ye-wafer (i-plasma etching masking, ukuvikelwa kwe-CMP ngemuva, ukufihla i-CVD/PVD), izinqubo zokupakisha (ukulungiswa kwe-wire bonding, imaski e-soldering yama-PCB), nokugcinwa kwemishini (i-anti-static roller wrapping, ukumakwa kwegumbi lokuhlanza). Izidingo ezihlanzeke kakhulu: ama-halogen aphansi (avimbela ukugqwala kwephedi yebhondi), ama-siloxane aphansi (<500 ppm, avimbela ukwakheka kwezinhlayiyana ezivikelayo), ama-ion ensimbi aphansi (<1 ppm ngayinye), ukuhlukaniswa/ukupakisha kwegumbi le-ISO Class 4, 10⁶-10⁹ Ω ukumelana ne-TV ebusweni obuphansi, nokumelana ne-TV okuphansi.

Itheyiphu yokushisa ephezulu ye-PTFE yezinga lezokwelapha ihlanganisa i-biocompatible PTFE substrate ne-adhesive abicah elashwe ngeplatinamu. Izici ezibalulekile: I-ISO 10993 iyahambisana (ayikho i-cytotoxicity, ukuzwela, noma ukucasuka), imelana nokuvala inzalo okuphindaphindiwe (umusi/EO/gamma), ukumelana nokushisa okungu-260°C. Izinyathelo zokuqapha ezibucayi: ungeqi ku-260°C (intuthu enobuthi engaphezu kuka-300°C), i-gamma irradiation ingase ibangele i-embrittlement, iqinisekise izindlela zokuvala inzalo, futhi icele imibhalo yokuthobela ngokugcwele (imibiko ye-ISO 10993, i-MSDS, idatha yokuguga). Hhayi okwegazi eliqondile noma ukusetshenziswa kokufakelwa ngaphandle kokuthi kuqinisekiswe ngokuqondile.

Ukusebenziseka kabusha kwetheyiphu ye-PTFE kuncike ezicini ezine: ukwakheka kokunamathelayo (ukuminyana okuphezulu kwe-crosslink, ukufuduka kwe-silicone ephansi, isakhiwo se-microphase se-tack ekwazi ukubekeka kabusha), i-substrate anchoring (ukwenza kusebenze kobuso + i-primer ukuvimbela ukudluliswa okunamathelayo okugcwele), ukunamathela okungemuva (ukukhulula ungqimba ukuze kuvikelwe okunamathelayo ngesikhathi sokuqaqa), nokuphatha okufanele (indlela yokunamathisela ecwebileyo, indawo yokunamathisela ecwebileyo, ukugwema okulungile). Izinamatheliso eziguquliwe eziwasheka ngamanzi zingalulama > 90% itheki ngemuva kokuhlanza.

Itheyiphu ye-PTFE yobubanzi obubanzi bezinga lokushisa idinga i-silicone PSA egcina ukunamathela ukusuka -70°C kuya ku-260°C. Izakhi eziyinhloko zokuklama: ungqimba lwenguquko olunama-primer-anchored (lugwema i-delamination), i-sea-island microstructure (i-MQ resin Islands + i-polysiloxane isigaba esiqhubekayo), i-gradient crosslinking (ungqimba olungaphakathi olunomthamo omkhulu wokumelana nokukhasa, ungqimba lwangaphandle olunobukhulu obuphansi bokudonswa kwezinga lokushisa eliphansi), kanye nezigcwali ezizinzile ze-oxid oxide (i-oxid oxide). Amasegimenti e-phenyl-modified siloxane acindezela i-crystallization yezinga lokushisa eliphansi, evumela ukuguquguquka okungaphansi -100°C.

I-Aokai PTFE ikhiphe okokuqala ngohlelo lwayo oluphelele lomkhiqizo e-APFE Shanghai 2026 (Booth 6T602, Hall 6). Imikhiqizo efakiwe ihlanganisa amateyipu e-PTFE aqiniswe nge-fiberglass, amafilimu e-PTFE ahlanzekile, amamaki aphikisana ne-static, namabhande okuthutha asezingeni eliphezulu - amboza ukucubungula ukudla, i-PV lamination, amabhethri e-lithium, izinto zikagesi, nokupakishwa. Umbukiso uqhubeka kuze kube uJuni 26. Yonke imikhiqizo isekela ukucaciswa okungokwezifiso.

Ngesikhathi sokumbozwa kwetheyiphu ye-PTFE, izinga le-solvent volatilization ye-adhesive ezwela ukucindezela kwe-silicone iyipharamitha yenqubo ebalulekile. Kushesha kakhulu → ukuhlikihlwa kwesikhumba, ukungaleveli kahle, amaphinifa (i-solvent evalelekile), nama-craters (ukujiya noma okubangelwa ukungcola). Iyanensa kakhulu → ukuwohloka, imiphetho ewugqinsi, kanye nokumanzisa ku-PTFE yamandla aphansi. Isu elilungile: ukuvuthwa kancane kwasekuqaleni kokulinganisa nokuphunyuka kwebhamuza, bese kusheshiswa ukomiswa ukuze kubunjwe. Sebenzisa izincibilikisi ezixubile (i-toluene/xylene + ukomisa ngokushesha) nezinga lokushisa likahhavini we-gradient (eliphansi→elimaphakathi→phezulu).

Itheyiphu ye-PTFE yokushisa okuphezulu ilahlekelwa ukunamathela ngemva kokusetshenziswa okuphindaphindiwe ngenxa yokungcoliswa kwendawo (uthuli, uwoyela we-silicone), ukwehluleka kokunamathela okunamathelayo (insalela), noma ukubopha okubuthakathaka kwe-substrate. Izisombululo: i-silicone ye-high-crosslink i-PSA (ukufuduka okuphansi, i-balance tack/amandla okubamba), ukwelashwa kwe-primer ku-PTFE substrate, ukusekelwa kwe-fiberglass ecinene, nokubamba okufanele (indawo ehlanzekile, ikhasi elipholile, i-engeli engu-180°). Ukuhlolwa komthamo kuqinisekisa ukuthuthuka.

Itheyiphu ye-PTFE yokushisa ephezulu egcinwe ngaphansi kwezimo ezishiwo (10-25°C, 40-70% RH, kude ne-UV/ingcindezi enkulu) ineshalofu elijwayelekile lezinyanga ezingu-3-6 (amabanga eprimiyamu afika ezinyangeni eziyi-12). Imikhawulo eyinhloko yokuwohloka: amandla ekhasi akumele ehle ngaphansi kuka-70% yenani lokuqala; akukho zinsalela zokunamathela ngemva kokususwa kwezinga lokushisa eliphezulu; akukho carbonization noma ukuqhekeka ezingeni lokushisa elilinganiselwe. Ukuhlola okusheshayo: umuzwa wokuzikhulula mathupha, ukuhlolwa kwensalela engu-260°C, nokuhlolwa kokuncipha kwe-lamination.