PTFE high-temperature tape hian bending leh opening condition repeated hnuaiah a crack emaw fracture emaw thei. He thuziak hian substrate thlan dik (glass fiber reinforced), thickness tha ber (standard angin 0.18mm), silicone adhesive thlan, leh installation technique dik tak hmanga hei hi ven dan tur a sawifiah a ni.

Release paper emaw film substrate leh release agent thlan hian PTFE high-temperature tape storage stability leh peeling performance a nghawng nghal vek a ni. He article hian PET vs. kraft paper substrate leh silicone vs. fluorinated release agents te a khaikhin a, zero-residue peeling leh hun rei tak chhunga rintlakna atana combination tha ber a rawt a ni.

PTFE high-temperature tape hi electrical insulation atan hman a ni nasa hle a, mahse high-frequency leh high-voltage condition hian hlauhawm danglam tak a thlen a, chungte chu electrical breakdown, partial discharge, thermal aging, high-frequency signal loss, leh environment sensitivity te an ni. He thuziak hian risk tinte leh a pumpelh dan tur a sawifiah a ni.

PTFE high temperature fabrics siamtu professional a nih angin Jiangsu Aokai New Materials hian industry hriatna pawimawh tak tak a rawn share sak che a ni. PTFE high temperature tape-a edge warping leh falling off hi thil pakhat vang a ni tlem hle a, mahse tape thlan dik loh avanga lo awm a ni a,

PTFE high-temperature tape siamtu professional Jiangsu Aokai New Materials chuan zir belh turin a hruai che a ni. PTFE high-temperature fabrics atana release material thlan hunah PET release film, glassine release paper leh kraft release paper te hian storage stability-ah danglamna chiang tak an rawn keng tel a

PTFE high-temperature tape siamtu professional a nih angin Jiangsu Aokai New Materials hian chipchiar takin a sawifiah che a ni. Flexible Printed Circuit Boards (FPC) hot press lamination process-ah hian PTFE high-temperature tape hian chhiatna pawimawh pahnih — substrate wrinkling leh adhesive transfer — a chinfel sak a ni.