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FPC Hot Press Lamination chhiatna venna atan PTFE High-Temperature Tape hman a ni

Views: 0     Author: Site Editor A chhuah hun: 2026-04-29 A chhuahna: Hmun

Zawhna zawt rawh

PTFE high-temperature tape siamtu professional a nih angin Jiangsu Aokai New Materials hian chipchiar takin a sawifiah che a ni. Flexible Printed Circuit Boards (FPC) hot press lamination process-ah hian PTFE high-temperature tape hian chhiatna pawimawh pahnih — substrate wrinkling leh adhesive transfer — chu inherent material property (low surface energy, high dimensional stability) leh optimized processing technology (stacking structure design, parameter control) te combined effect hmangin a chinfel sak a ni. tha tak angin a thawk a ni Isolation layer thianghlim  leh pressure equalizing buffer layer .

3.11aokai.png tih a ni

I. Substrate Wrinkling leh Adhesive Transfer awm chhan

Substrate Wrinkling A bulpui ber chu lumna leh pressure insem dan inang loah a ni. FPC hi thil chi hrang hrang PI film, copper foil leh adhesives coefficient of thermal expansion (CTE) hrang hrang nei atanga siam a ni. Tin, circuit board design factors te bakah copper thickness inang lo leh stiffener step te hian pressure distribution inang lo tak tak a thlen dawn bawk. Non-uniform heat leh pressure hian internal material stress a thlen a, chu chuan wrinkling, warping leh delamination a thlen thin.

Adhesive Transfer (Residual Adhesive) Hei hi interface leh material chhiatna vang a ni ber. Lamination atana cover film-a semi-cured adhesive chu a hmin a, temperature sang takah a luang a, isolation materials chung lamah a innghat bawk. Hetihlai hian PTFE tape hnung lama silicone pressure-sensitive adhesive coated hian temperature resistance a nei tlem emaw, process parameter a inmil lo emaw a nih chuan temperature sang takah cohesive failure a awm ang a, FPC surface-ah partial adhesive transfer a awm ang.

II. PTFE High Temperature Tape hmanga chhiatna laka invenna atana hmanraw pawimawh ber berte

Substrate Wrinkling laka invenna

Thermal shock isolation & uniform pressure distribution Standard stacking structure-ah chuan: Hot plate → PTFE tape → silicone cushion → FPC → PTFE tape → Hot plate , PTFE tape hian release layer angin hna a thawk a. A thermal conductivity nghet tak chuan heat transfer inang tlang tak a siam a ni. Silicone buffer cushion nena thawkdunin, differential thermal expansion avanga stress awm chu a tiziaawm a, overall pressure a balance a, local stress concentration leh a hnu lama wrinkling a awm loh nan. High-precision production atan chuan dimensional stability sang zawk neih theih nan glass-fiber reinforced PTFE tape CTE hniam tak neih a tha.

Stable thermal processing window PTFE layer hian direct thermal impact a block thei a ni. Silicone cushion-a thermal hysteresis nen a inzawm chuan heat conduction chu a nem a, a nghet bawk. Adhesive gelling neih laiin ≤ 5~7 °C chhunga interlayer temperature danglamna a control a, steady adhesive curing hmain air exhaust kimchang a siam thei a, fundamentally chuan premature gelling leh delayed exhaust avanga wrinkling awm chu a ti bo bawk. Main temperature rise section-a heating rate chu 4.5~5.0 °C/min-a control a tha.

Adhesive Transfer tihbo a ni

Non-stick property with ultra-low surface energy PTFE hian surface energy hniam tak tak (18 mN/m) a nei a, molten resin leh adhesives aiin a hniam zawk hle. Non-stick cookware ang bawka non-stick performance tha tak a neih avangin lamination hnuah FPC substrate te scratch lovin emaw residual glue awm lovin awlsam takin a peel off theih a ni.

High-performance adhesive system thlan Tape chu self-adhesive transfer a nih loh nan PTFE tape, silicone pressure-sensitive adhesive quality sang tak hmanga siam chu hman tur a ni. Premium silicone adhesive hian 260 °C thlenga stable performance a vawng reng a, hun rei tak chhunga siam chhunzawm zelnaah zero residual glue a tichiang a ni. Temperature resistance grade hian process mamawh (210–260 °C) a tlin kim tur a ni.

Adhesives te Curing kimchang Aokai PTFE tape coating leh siam lai hian curing hun, temperature emaw running speed dik lo chuan adhesive curing tling lo a thlen ang a, hei hian a hnua hmannaah residual adhesive problem a thlen belh zel a ni.

A chunga kan tarlan te hi Jiangsu Aokai New Material Technology Co., Ltd.

Kan full product line atana product specification, application scenario leh customized solutions chungchang hriat belh i mamawh a nih chuan, PTFE high-temperature cloth, PTFE high-temperature tape, PTFE high-temperature mesh belt, seamless fusing machine belt, single-sided PTFE coated fabric, high-temperature resistant conveyor belt leh high-temperature resistant glass fiber cloth, min rawn biak theih reng e:

·  Hotline: Pu Guo +86 18944819998 zawhfiah theih a ni

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