PTFE ƒe dzoxɔxɔ gã ƒe kasɛt nyea nu vevi aɖe le semiconductor wɔwɔ me, ke menye nusi wozãna na nusianu o. Dɔwɔwɔ veviwo: wafer-level takpɔkpɔ (plasma etching masking, CMP megbe takpɔkpɔ, CVD / PVD masking), nubabla ƒe ɖoɖowo (wire bonding fixation, soldering mask na PCBs), kple dɔwɔnuwo dzadzraɖo (anti-static roller wrapping, cleanroom dzesi). Nudidi siwo le dzadzɛ ŋutɔ: halogen siwo mesɔ gbɔ o (xea mɔ na bond pad ƒe xɔxlɔ̃), siloxanes siwo mesɔ gbɔ o (<500 ppm, xea mɔ na insulating particle formation), ga ions siwo mesɔ gbɔ o (<1 ppm ɖesiaɖe), ISO Class 4 cleanroom slitting/packaging, 106-109 Ω surface resistivity, kple TVOC ƒe dodo si bɔbɔ.

Atikewɔwɔ-grade PTFE dzoxɔxɔ gã tape ƒoa biocompatible PTFE substrate kple platinum-cured silicone adhesive. Nu vevi siwo le eme: Ewɔ ɖeka kple ISO 10993 (si me lãmenugbagbeviwo ƒe aɖi, seselelãme, alo dzikudodo aɖeke mele eme o), ete ŋu nɔa te ɖe vidzidzi enuenu (steam/EO/gamma), dzoxɔxɔ si te ŋu nɔa te ɖe dzoxɔxɔ si nye 260°C nu. Kpɔ nyuie: mègawu 260°C (dzudzɔ si me aɖi le si wu 300°C), gamma keklẽ ate ŋu ana wòagbã, aɖo kpe vidzidzi ƒe mɔnuwo dzi, eye nàbia be woaŋlɔ sedziwɔwɔ ŋuti nuŋlɔɖi blibo (ISO 10993 ƒe nyatakakawo, MSDS, tsitsi ŋuti nyatakakawo). Menye na ʋudodo tẽ alo nusi wotsɔ dea lãme na ame zazã o negbe ɖe woda asi ɖe edzi koŋ hafi.

PTFE tape gbugbɔgazã nɔ te ɖe nu ene dzi: adhesive ƒe wɔwɔme (crosslink density si lolo, silicone ƒe ʋuʋu si bɔbɔ, microphase structure for repositionable tack), substrate anchoring (anyigbadzidɔwɔwɔ + primer be woaxe mɔ ɖe adhesive ƒe asitɔtrɔ blibo nu), megbedede (ɖe asi le ƒuƒoƒo ŋu be wòakpɔ adhesive ta le unwinding me), kple eŋudɔwɔwɔ nyuie (adhesive ƒe anyigba dzadzɛ, peeling mɔnu nyuitɔ, ƒo asa na dzoxɔxɔ si gbɔ eme). Atike siwo ŋu wotrɔ asi le siwo woate ŋu aklɔ kple tsi ate ŋu axɔ >90% ƒe tack le wo ŋu kɔklɔ vɔ megbe.

Fiberglass avɔ ƒe dzoxɔxɔ ƒe ʋuʋu nye nu vevitɔ si gbɔ PTFE tape ƒe didime ƒe malikenyenye tsona. Le PTFE sintering dzoxɔxɔ (360-400°C) me la, woɖea asi le avɔlɔlɔ̃ ƒe nuteɖeamedzi susɔea ŋu. Ne womexe mɔ ɖe enu o la, avɔa dzi ɖena kpɔtɔna; ne woxe mɔ ɖe enu la, wotua nuteɖeamedzi ɣaɣla la ɖe eme, si wɔnɛ be wòtsina emegbe le aŋenu ƒe dɔyɔyɔ (150-200°C) kple dzoxɔxɔ si wozãna mlɔeba me. Egbɔkpɔnu: zã fiberglass si woɖo do ŋgɔ na dzoxɔxɔ si ƒe ʋuʋu <0.5% le 400°C, si ɖe nuteɖeamedzi susɔea ɖa hafi nàtsyɔ edzi.

PTFE kasɛt si ƒe dzoxɔxɔ keke ta hiã silicone PSA si léa nuléle ɖe te tso -70°C va ɖo 260°C. Nu vevi siwo le aɖaŋuwɔwɔ me: primer-anchored transition layer (xea mɔ na delamination), atsiaƒu-ƒukpo microstructure (MQ resin ƒukpowo + polysiloxane continuous phase), gradient crosslinking (high-density ememe ƒuƒoƒo na creep tsitretsitsi, low-density gota ƒuƒoƒo na low-temp tack), kple dzoxɔxɔ-si li ke fillers (cerium oxide na oxidation tsitretsitsi). Siloxane ƒe akpa siwo ŋu wotrɔ asi le kple phenyl tea dzoxɔxɔ si mebɔ o ƒe kristalowɔwɔ ɖe to, si wɔnɛ be woate ŋu atrɔ ɖe nɔnɔmewo ŋu le -100°C te.

PTFE ƒe dzoxɔxɔ gã ƒe tepe ƒe nuwuwu mo ƒe wɔwɔme si wotso la kpɔa ŋusẽ ɖe adhesive oozing kple nugbɔ kɔkɔ dzi tẽ le etsɔtsɔ wɔe me. Gbegblẽ nyuie o (aŋutsrɔe siwo me mekɔ o, dzogoe si mesɔ o) wɔa aŋe ƒe ka, enaa nugbɔ ƒe nulénu ƒe ƒuƒoƒoa nɔa sue, eye wòɖea fiberglass burrs ɖe go – si wɔnɛ be tsi dona, kadodo si gbɔdzɔ, eye wòkɔna le dzoxɔxɔ alo teteɖeanyi te. Nuwuƒe mo siwo mesɔ o (siwo le ƒutsotsoewo me, siwo dona ɖe gota) hea nyaƒoɖeamenu ƒe mama si mesɔ o vɛ, si wɔnɛ be adhesive creep le edzraɖoɣi. Nuwuƒe mo nyuitɔ la le gbadzaa, le tsia dzi, eye megblẽa nu le eŋu o – ewɔa dɔ abe nutrenu si xea nulénu la eye wòkpɔa egbɔ be nugbɔ ƒe kadodo bliboe.

Le PTFE tape coating me la, solvent volatilization rate of silicone pressure-sensitive adhesive nye dɔwɔwɔ ƒe nɔnɔme vevi aɖe. Kabakaba akpa → ŋutigbalẽ ƒe ʋuʋu le anyigba dzi, eƒe anyigba ƒe ƒuƒuiƒe nyuie o, pinholes (trepped solvent), kple craters (condensation alo contaminant-induced). Blewu akpa → sagging, eƒe gowo le ɣie, kple dewetting le low-surface-energy PTFE dzi. Mɔnu nyuitɔ kekeake: blewu gbãtɔ ƒe dzoxɔxɔ hena dzidzenu kple bubble si, emegbe kabakaba ƒuƒu hena nɔnɔmewɔwɔ. Zã atike siwo wotsaka (toluene/xylene + esi ƒuna kabakaba) kple dzodoƒe ƒe dzoxɔxɔ si le tɔtrɔm (si le bɔbɔe→ti titina→kɔkɔ).

PTFE ƒe dzoxɔxɔ gã ƒe tape megaléna ɖe eŋu o le eŋudɔwɔwɔ enuenu megbe le ɖiƒoƒo si le anyigba dzi (ke, silicone ami), adhesive cohesive ƒe kpododonu (nu susɔe), alo substrate ƒe kadodo si gbɔdzɔ ta. Egbɔkpɔnuwo: high-crosslink silicone PSA (ʋuʋudedi si bɔbɔ, tack/holding ŋusẽ si da sɔ), primer ƒe atikewɔwɔ ɖe PTFE substrate dzi, dense fiberglass megbedede, kple eŋudɔwɔwɔ nyuie (anyigba siwo le dzadzɛ, peel fafɛ, 180° angle). Agbɔsɔsɔme dodokpɔ ɖoa ​​kpe ŋgɔyiyi dzi.

PTFE ƒe dzoxɔxɔ gã ƒe tape si wodzra ɖo le nɔnɔme aɖewo koŋ me (10-25°C, 40-70% RH, adzɔge tso UV/nyaƒoɖeamenu sesẽ gbɔ) ƒe agbenɔƒe si woɖo ɖi la nye ɣleti 3-6 (dzidzenu nyuitɔ vaseɖe ɣleti 12). Nu vevi siwo gblẽa nu le eŋu: mele be lãgbalẽ ƒe ŋusẽ naɖiɖi wu 70% le asixɔxɔ gbãtɔ me o; nusi léna ɖe nu ŋu ƒe akpa aɖeke meli le dzoxɔxɔ gã aɖe ɖeɖeɖa megbe o; carbonization alo cracking aɖeke mele dzoxɔxɔ si woɖo ɖi me o. Dodokpɔ kabakaba: asi ʋuʋu ƒe seselelãme, 260°C ƒe nugbagbevi susɔe dodokpɔ, kple lamination shrinkage dodokpɔ.

PTFE tape si woxatsa ate ŋu atu interlayer adhesion (blocking) kple adhesive transfer le ɣeyiɣi didi ƒe nudzraɖoƒe. Nusiwo gbɔ wòtso: PTFE film elastic memory kple silicone PSA creep le nyaƒoɖeamenu/dzoxɔxɔ te. Mɔxexe ɖe enu: gradient winding tension (gotagome sesẽ, ememe loose) le ewɔwɔ me, tsɔ kpe ɖe asiɖeɖe le nutsyɔnu ŋu le akpa si meléna ɖe nu ŋu o. Dzrae ɖo ɖe -15°C va ɖo 40°C, 30-70% RH, le tsia dzi le agbawo dzi, trɔ agbalẽ xatsaxatsawo le ɣleti etɔ̃ ɖesiaɖe me. Ne èdi be yeakpɔ nusiwo wotsɔna léa nu ɖe ​​nu ŋu ƒe hatsotso siwo le ɣie la, tsɔ pepa si ɖea asi le nu ŋu kpe ɖe eŋu le ƒuƒoƒoawo dome.