Itheyiphu ye-PTFE yepayipi lamakhemikhali/isitsha sokunqanda ukugqwala, ukungagxili, nokuvikelwa kokuvala kudinga i-substrate ehambisanayo, isistimu yokunamathela, kanye nemidiya yamakhemikhali. I-Silicone PSA inconywa ku-200-260 ° C ngama-acids / alkali; I-acrylic PSA imelana nezinyibilikisi eziphilayo kodwa ikhawulela izinga lokushisa libe ngu-≤150°C. Nge-HF, abilayo >80% alkali, noma i-chlorine trifluoride, sebenzisa i-PTFE-only lining (akukho okunamathelayo okuphilayo). Okubalulekile: i-adhesive iyisixhumanisi esibuthakathaka, hhayi i-PTFE ngokwayo.

Amandla okubamba itheyiphu ye-PTFE athuthukiswa ngokugcotshwa kanye nokwenza ngcono inqubo yokwelapha. I-Coating: ungqimba lwe-primer (0.5-2μm silane primer ivimbela ukuxebuka kwe-adhesive), ukujiya kwe-adhesive 30-60μm (okulungele ukubamba amandla), i-vacuum defoaming, kanye nokuhlunga okungu-5-10μm. Ukwelapha: Ukushisa okuhamba kancane (80-100°C ukususwa kwe-solvent → 120-140°C shape → 150-220°C deep crosslinking), post-curing (40-60°C for 24-48h ukuze uphumuze ingcindezi), kanye nokudluliswa kwe-tension ephansi ukuvimbela ukucindezeleka kwangaphakathi ekuncipheni kwe-substrate. I-primer ibalulekile kumandla aphansi we-PTFE.

Itheyiphu ye-PTFE yokushisa okuphezulu isebenza njengento ebalulekile ekwenziweni kwe-semiconductor, hhayi into evamile esebenzisekayo. Izinhlelo zokusebenza ezibalulekile: ukuvikelwa kweleveli ye-wafer (i-plasma etching masking, ukuvikelwa kwe-CMP ngemuva, ukufihla i-CVD/PVD), izinqubo zokupakisha (ukulungiswa kwe-wire bonding, imaski e-soldering yama-PCB), nokugcinwa kwemishini (i-anti-static roller wrapping, ukumakwa kwegumbi lokuhlanza). Izidingo ezihlanzeke kakhulu: ama-halogen aphansi (avimbela ukugqwala kwephedi yebhondi), ama-siloxane aphansi (<500 ppm, avimbela ukwakheka kwezinhlayiyana ezivikelayo), ama-ion ensimbi aphansi (<1 ppm ngayinye), ukuhlukaniswa/ukupakisha kwegumbi le-ISO Class 4, 10⁶-10⁹ Ω ukumelana ne-TV ebusweni obuphansi, nokumelana ne-TV okuphansi.

Itheyiphu yokushisa ephezulu ye-PTFE yezinga lezokwelapha ihlanganisa i-biocompatible PTFE substrate ne-adhesive abicah elashwe ngeplatinamu. Izici ezibalulekile: I-ISO 10993 iyahambisana (ayikho i-cytotoxicity, ukuzwela, noma ukucasuka), imelana nokuvala inzalo okuphindaphindiwe (umusi/EO/gamma), ukumelana nokushisa okungu-260°C. Izinyathelo zokuqapha ezibucayi: ungeqi ku-260°C (intuthu enobuthi engaphezu kuka-300°C), i-gamma irradiation ingase ibangele i-embrittlement, iqinisekise izindlela zokuvala inzalo, futhi icele imibhalo yokuthobela ngokugcwele (imibiko ye-ISO 10993, i-MSDS, idatha yokuguga). Hhayi okwegazi eliqondile noma ukusetshenziswa kokufakelwa ngaphandle kokuthi kuqinisekiswe ngokuqondile.

Ukusebenziseka kabusha kwetheyiphu ye-PTFE kuncike ezicini ezine: ukwakheka kokunamathelayo (ukuminyana okuphezulu kwe-crosslink, ukufuduka kwe-silicone ephansi, isakhiwo se-microphase se-tack ekwazi ukubekeka kabusha), i-substrate anchoring (ukwenza kusebenze kobuso + i-primer ukuvimbela ukudluliswa okunamathelayo okugcwele), ukunamathela okungemuva (ukukhulula ungqimba ukuze kuvikelwe okunamathelayo ngesikhathi sokuqaqa), nokuphatha okufanele (indlela yokunamathisela ecwebileyo, indawo yokunamathisela ecwebileyo, ukugwema okulungile). Izinamatheliso eziguquliwe eziwasheka ngamanzi zingalulama > 90% itheki ngemuva kokuhlanza.

Ukuncipha okushisayo kwendwangu ye-Fiberglass kuyimbangela eyinhloko ye-PTFE tape dimensional ukungasebenzi. Emazingeni okushisa e-PTFE sintering (360-400°C), ingcindezi yokwaluka eyinsalela iyakhululwa. Uma kungavinjelwa, indwangu iyancipha; uma kuvinjelwa, ukucindezeleka okucashile kukhiyiwe, okubangela ukuncipha kamuva ngesikhathi sokuphulukisa okunamathelayo (150-200°C) kanye nokushisa kokugcina. Isixazululo: sebenzisa i-fiberglass esethwe ngaphambi kokushisa ene-<0.5% shrinkage ku-400 ° C, esusa ukucindezeleka okusele ngaphambi kokumboza.

Itheyiphu ye-PTFE yobubanzi obubanzi bezinga lokushisa idinga i-silicone PSA egcina ukunamathela ukusuka -70°C kuya ku-260°C. Izakhi eziyinhloko zokuklama: ungqimba lwenguquko olunama-primer-anchored (lugwema i-delamination), i-sea-island microstructure (i-MQ resin Islands + i-polysiloxane isigaba esiqhubekayo), i-gradient crosslinking (ungqimba olungaphakathi olunomthamo omkhulu wokumelana nokukhasa, ungqimba lwangaphandle olunobukhulu obuphansi bokudonswa kwezinga lokushisa eliphansi), kanye nezigcwali ezizinzile ze-oxid oxide (i-oxid oxide). Amasegimenti e-phenyl-modified siloxane acindezela i-crystallization yezinga lokushisa eliphansi, evumela ukuguquguquka okungaphansi -100°C.

Isakhiwo sobuso esisikiwe se-PTFE itheyiphu yezinga lokushisa eliphezulu sithinta ngokuqondile ukugoqa okunamathelayo kanye nokuphakamisa unqenqema ngesikhathi sokufaka isicelo. Ukusika okungalungile (izindwani ezibuthuntu, i-engeli engafanele) kudala imicu yeglue, kwenze kube mncane ungqimba olunamathelayo olusemaphethelweni, futhi kuveza obala ama-fiberglass burrs - okuholela ekuphumeni, ekuhlanganisweni okubuthakathaka, nasekuphakamiseni ngaphansi kokushisa noma ukushuba. Ubuso obungajwayelekile bokuphela (obunamagagasi, obuphumela ngaphandle) bubangela ukusakazwa kwengcindezi engalingani, ukushayela okunamathelayo kukhase ngesikhathi sokulondoloza. Ubuso obufanele ekugcineni bushelela, buyashesha, futhi abunamonakalo - busebenza njengesivalo esivala ingcina futhi siqinisekise ukubopha okugcwele emaphethelweni.

Ngesikhathi sokumbozwa kwetheyiphu ye-PTFE, izinga le-solvent volatilization ye-adhesive ezwela ukucindezela kwe-silicone iyipharamitha yenqubo ebalulekile. Kuyashesha kakhulu → ukuhlikihlwa kwesikhumba, ukungaleveli kahle, izimbobo (i-solvent evalelekile), nama-craters (ukujiya noma okubangelwa ukungcola). Iyanensa kakhulu → ukuwohloka, imiphetho ewugqinsi, nokucwiliswa kwamanzi ku-PTFE yamandla aphansi. Isu elifanele: ukuvuthwa kancane kwasekuqaleni kokulinganisa kanye nokuphunyuka kwebhamuza, bese kusheshiswa ukomisa ukuze kubunjwe. Sebenzisa izinyibilikisi ezixubile (i-toluene/xylene + ukomisa ngokushesha) nezinga lokushisa likahhavini we-gradient (eliphansi→elimaphakathi→phezulu).

Itheyiphu ye-PTFE yokushisa okuphezulu ilahlekelwa ukunamathela ngemva kokusetshenziswa okuphindaphindiwe ngenxa yokungcoliswa kwendawo (uthuli, uwoyela we-silicone), ukwehluleka kokunamathela okunamathelayo (insalela), noma ukubopha okubuthakathaka kwe-substrate. Izisombululo: i-silicone ye-high-crosslink i-PSA (ukufuduka okuphansi, i-balance tack/amandla okubamba), ukwelashwa kwe-primer ku-PTFE substrate, ukusekelwa kwe-fiberglass ecinene, nokubamba okufanele (indawo ehlanzekile, ikhasi elipholile, i-engeli engu-180°). Ukuhlolwa komthamo kuqinisekisa ukuthuthuka.