ʻO ka lipine wela kiʻekiʻe o PTFE he mea koʻikoʻi i ka hana semiconductor, ʻaʻole ia he mea hoʻohana maʻamau. Nā noi koʻikoʻi: ka pale wafer-level (plasma etching masking, CMP backside protection, CVD/PVD masking), nā kaʻina hana hoʻopili (hoʻopaʻa paʻa uea, pale pale pale no nā PCB), a me ka mālama pono (anti-static roller wrapping, cleanroom marking). ʻO nā koi maʻemaʻe loa: nā halogens haʻahaʻa (pale i ka corrosion pad pad), nā siloxanes haʻahaʻa (<500 ppm, pale i ka hoʻokumu ʻana o ka insulating particle), nā ion metala haʻahaʻa (<1 ppm i kēlā me kēia), ISO Class 4 cleanroom slitting/packaging, 10⁶-10⁹ Ω surface resistivity, a haʻahaʻa TVOC hoʻokuʻu.

ʻO ka hoʻomaʻemaʻe waiwai kumu ke kumu kumu o ka maikaʻi o ka lole kiʻekiʻe o ka PTFE. ʻO nā mea haumia (nā mea hoʻomaka, surfactants, ion metala, nā mea hoʻomāinoino ʻia) ke kumu o ka hoʻohaʻahaʻa ʻana i ka wela (bubbles, blistering ma luna o 260°C), nā ʻili lāʻau ʻole like ʻole (adhesion anchor points), hoʻemi ʻia ka insulation uila (dielectric loss, low breakdown voltage), nāwaliwali ka ikaika mechanical (stress concentration, pohā), ʻO nā mea maka maʻemaʻe kiʻekiʻe e hōʻoia i ka FDA-compliant, lōʻihi ke ola, kiʻekiʻe-hana PTFE lole.

Pono ka hoʻopaʻa ʻana o ka lole fiberglass PTFE-coated i ka manawa paʻa ma 370-400°C. Nā kapuahi mau: 30-90s (ka lahilahi) a 3-5+ min (mānoanoa). Nā kapuahi pahu: 5-15 min. ʻO ka hoʻoheheʻe ʻia ʻana ma lalo o ke kumu o ka opaque, nā ʻili ʻōpala e ʻili; ʻO ka nui o ka sintering ke kumu o ka melemele, brittleness, a me ka hoʻokuʻu kinoea fluoride ʻona. Kaʻina hana: hoʻohana i nā mea nānā wela o ka umu ahi, hana i ka nānā maka (semi-transparent, flexible), a hana i nā hoʻokolohua huki lipine. E hōʻoia mau i ka piha-mānoanoa like like.

Hoʻohui ʻia ka lipine wela kiʻekiʻe o ka PTFE lāʻau lapaʻau i ka substrate PTFE biocompatible me ka lāʻau silikoni hoʻōla platinum. Nā hiʻohiʻona koʻikoʻi: ISO 10993 compliant (ʻaʻohe cytotoxicity, sensitization, a irritation), kū i ka sterilization pinepine (ka mahu/EO/gamma), 260°C pale wela. ʻAʻole i ʻoi aku ma mua o 260°C (nā uahi ʻawaʻawa ma luna o 300°C), hiki i ka irradiation gamma ke hana i ka embrittlement, hōʻoia i nā ʻano sterilization, a noi i nā palapala hoʻokō piha (nā hōʻike ISO 10993, MSDS, ʻikepili aging). ʻAʻole no ka hoʻohana ʻana i ke koko pololei a i ʻole implantation ke ʻole i hōʻoia ʻia.

Pono ka lole wela PTFE e mālama pono i ka palekana a me ka lōʻihi. ʻO nā mea nui: mai ʻoi aku ma mua o 260°C (ma luna o 320°C e hoʻokuʻu i nā uahi ʻawaʻawa), e pale i nā peʻe ʻoi (ka uhi ʻia nā māwae, e hōʻike ana i ka fiberglass), ʻaʻohe hoʻomaʻemaʻe abrasive (hoʻopōʻino ka huluhulu kila i ka ʻili ʻole), mālama i ka hoʻonui ʻana i ka wela (e pale i ka haehae ʻana), a hoʻololi i ka wā i pohū a ihi ʻia. E kūʻai i ʻōwili ʻia, mamao mai UV. E hoʻohana i nā mīkina lima pale wela i ka wā e lawelawe ai.

PTFE kiʻekiʻe-mehana lole he coefficient o thermal hoʻonui (CTE) o 30-60 ppm/°C (warp/weft) - oi aku mamua o fiberglass wale akā, emi loa ma mua o maemae PTFE (100-200 ppm/°C). Loaʻa ka PTFE i nā hoʻololi o ka leo (1-2%) ma 19°C a me 30°C. No ka pale ʻana i ka hoʻopaʻa ʻana, ka uhae ʻana, a me ka delamination: hoʻolālā i nā ʻae no ka hoʻonui manuahi, e pale i ka neʻe ʻana ma o ka hoʻololi ʻana o ka pae, hoʻohana i nā tensioners ʻakomi ma nā kāʻei conveyor, a hoʻopili i ka hoʻolālā overlap anti-buckling. Pono ka nānā mau ʻana no ke kahe anu.

ʻO ka hoʻohana hou ʻana o ka tape PTFE e pili ana i nā kumu ʻehā: ka hoʻopili ʻana (kiʻekiʻe crosslink density, haʻahaʻa silicone migration, microphase structure for repositionable tack), substrate anchoring (surface activation + primer no ka pale ʻana i ka hoʻololi piha ʻana), backside coating (hoʻokuʻu i ka papa no ka pale ʻana i ka lāʻau i ka wā unwinding), a me ka mālama pono ʻana (maʻemaʻe maʻemaʻe ma luna o ka ʻenehana peeling pono). Hiki i nā mea hoʻopili i hoʻololi ʻia i ka wai hiki ke hoʻihoʻi hou i ka 90% tack ma hope o ka hoʻomaʻemaʻe.

ʻO ka PTFE kiʻekiʻe-mehana lole moena bakena hāʻawi i ʻehā mau pōmaikaʻi: hana ʻole (ʻaʻohe aila a palaoa paha, hoʻokuʻu maʻemaʻe nā pastries palupalu), ākea ākea ākea (-70 ° C a 260 ° C, palekana no ka umu i ka paʻukū), hiki ke hoʻohana hou ʻia (nā kaukani o nā pōʻai, maʻalahi e hoʻomaʻemaʻe), a hiki i ka hoʻokele wela (pale i ke ahi, kaulike browning). ʻOi aku ka maikaʻi o nā moena silicone me ka hoʻololi wela a ʻoi aku ka maikaʻi o ka ʻili.

He mea nui ka PTFE kiʻekiʻe-mehana lole i ka ʻoihana interlining lole. Nā mea nui: nā kāʻei conveyor pau ʻole no nā mīkini fusing mau (pale i ka hoʻoheheʻe ʻana i ka hoʻoheheʻe wela, ka lawe ʻole ʻana i ka wrinkle), ka uhi ʻole a me ka lole pale no nā paʻi wela paʻa (pale i nā platens mai ka hoʻopili ʻia ʻana), nā kāʻei conveyor no nā laina dot paste / pauda (mālama i ka paʻa paʻa ʻana i nā pahu hoʻopaʻa i ka wā o ka uhi ʻana). ʻO ka mānoanoa mai ka 0.13mm (padding māmā) a i ka 0.55mm (nā kāʻei conveyor kaumaha).

Fiberglass lole thermal shrinkage ke kumu nui o ka PTFE tape dimensional instability. Ma PTFE sintering wela (360-400°C), koena ulana koʻikoʻi hoʻokuʻu. Inā ʻaʻole i kāohi ʻia, emi ka lole; inā kāohi ʻia, hoʻopaʻa ʻia ke koʻikoʻi huna, e hoʻemi ʻia ma hope i ka wā o ka hoʻōla ʻana (150-200°C) a me ka hoʻohana ʻana i ka wela. Pane: hoʻohana i ka fiberglass pre-heat-set me <0.5% shrinkage ma 400°C, e hoʻopau i ke koena koʻikoʻi ma mua o ka uhi ʻana.