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As noted by the PTFE high-temperature tape manufacturer, heat is transferred via hot air convection to the surface of the adhesive layer, and then conducted inward from the surface through thermal conduction. Silicone adhesives have an extremely low thermal conductivity (approximately 0.2 W/m·K), so a temperature gradient between the exterior and interior is inevitable. However, this gradient is relatively moderate, representing a globally balanced heating mode with a slow heating rate.
Infrared energy is absorbed by the chemical bonds in the silicone adhesive (such as Si–O). In most cases, the energy is intensely absorbed by the very shallow surface layer (on the order of micrometers to millimeters) and converted into heat, which is then conducted inward, creating a steep "surface-to-interior" temperature gradient. Only when the wavelength perfectly matches the absorption peak of the substrate can "volumetric" simultaneous heating of the interior and exterior be achieved.
Hot-air circulation produces a spatially relatively uniform temperature field that evolves slowly over time. Infrared radiation, on the other hand, readily establishes an extremely non-uniform transient high-temperature field in the thickness direction.
The slow temperature rise allows the inner and outer portions of the adhesive layer to enter the vulcanization temperature range almost simultaneously. The crosslinking reaction proceeds synchronously in space, resulting in a uniform crosslink density distribution along the thickness direction, with a consistent overall network structure and no significant regions of over-crosslinking or under-crosslinking.
Intense surface absorption causes the surface layer to reach high temperature instantly and complete crosslinking rapidly, forming a dense cured skin. This cured layer acts as a thermal barrier, hindering heat transfer to the interior and leaving the internal portion at a low temperature for an extended period. The final result is a gradient structure where crosslink density decreases sharply from the surface inward, exhibiting very poor uniformity.
The premature curing of the surface layer not only blocks heat conduction but also locks in the volume, restricting subsequent shrinkage during internal curing. This further exacerbates structural non-uniformity and introduces internal stresses.
The overall slow and uniform heating allows the crosslinking reaction to proceed synchronously and progressively throughout the entire adhesive layer. Molecular chains have sufficient time for conformational relaxation, facilitating the formation of an ideal network with uniformly distributed crosslinking points, well-ordered network chains, and fewer defects, along with low internal stress.
The steep temperature gradient and differential curing rates can induce significant thermal stresses and curing shrinkage stresses. The rapid gelation of the surface layer "freezes" the volume; when the interior cures later, its shrinkage is constrained by the surface layer, leading to high stress concentration at the interface and even the initiation of microcracks. Meanwhile, uneven consumption of reactive groups creates crosslink-rich "hard regions" and crosslink-poor "soft regions," causing microscopic phase separation and disrupting network uniformity.
The gentle temperature rise of hot-air circulation allows small-molecule byproducts (such as alcohols or water released by condensation-cure silicones) to diffuse and evaporate freely, avoiding bubble formation. Infrared curing, however, is highly prone to sealing off outgassing channels due to premature surface curing, generating bubbles or porous voids that directly compromise the macroscopic density of the crosslinked network.
The two curing methods have diametrically opposite effects on crosslinked structure uniformity. Hot-air circulation trades efficiency for a thermally conduction-driven, controllable, and moderate temperature field, ensuring uniform crosslink density across the thickness direction and a complete microscopic network. It is the inevitable choice for applications demanding high reliability and structural uniformity, such as potting and thick-layer coatings. Infrared radiation, by contrast, due to the concentrated release of energy at the surface, inherently tends to create non-uniform temperature and curing fields, readily producing gradient crosslinked structures and various defects. Its processing window is extremely narrow, making it suitable primarily for rapid curing of thin coatings (micron-scale) where uniformity requirements are low. The choice between the two is essentially a trade-off between "efficiency" and "uniformity."
The above information is provided by Jiangsu Aokai New Material Technology Co., Ltd., a PTFE high-temperature tape manufacturer.
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