JiangsuTeflonHigh-TemperatureClothManufacturer–JiangsuAokaiNewMaterialTechnologyCo.,Ltd. chuan hei hi a bul berah chuanporousstructure leh lei chung/bulkfunctionalproperties inkara thawhhona tha tak a nih thu a hriat nawn tir a ni.
1.SourcesoftheConflictAmongMicroporousStructureandProperties Airpermeability chuan openpores inzawmkhawm a ngai a, chu chu gaspassing throughtortuouschannels a ni.Permeabilityrate chu porediameter square leh porosity nen a inzat a, porechannels tortuosity nen a inmil lo hle bawk.
Insulation(dielectric chakna) a ni. reliesonthematerial'sdensity.PTFEmatrix-a microroporesisequivalent to mixingir(withalowbreakdownfieldstrengthof~3kV/mm) dah luh hian, andopenpores hian partialdischarge leh creepagetracking atan kawng awm thei a pe a ni.A poresity sang zawk leh pores kaltlanga dinglam zawkah chuan droppinbreakdownvoltage chu a pawimawh zawk a ni.
Airpermeabilityvs.stick ni lo thil neih: Thenon-stickproperty chuPTFE-a leihnuai chakna hniam tak(~18mN/m) aanga lo chhuak a ni a, leilung chu a smooth a ni.Micropores chuan lei chunglam a tipung a, a contact area tak tak a tipung a;moltenmaterialor viscousmediamaypen etratethemicropores,forming'mechanicalinterlocking'thatinsteadcausesadhesion.Chuvangin,material chuan a rualin boruak luh theihna leh lei chunglam hnim leh luh theihna a do theihna a nei tur a ni.
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2.1AveragePoreDiameter(0.1–2μm) lehNarrowPoreSizeDistribution control tur Insulation atan: Electron aiin poresize a te zawk tihna a ni a, freepatand initiation te chu partialdischarge atan a lian a, boruak gaps-a breakdown chuanPaschen-a dan a la zui reng a;mahse, extremely finemicropores(submicr onscale) chuanbreakdownvoltage chu nasa takin a tipung thei a ni.Zirchianna hrang hrangah chuan 0.5μm hnuai lam a nih chuan, 50-μm-thickePTFEfilm-a DCbreakdown chakna chu 40kV/mm aia sang a la thleng thei tih a tarlang.
Non-stick performance atan chuan: Poresize chu hot-meltadhesives(eg,PE,PP)-a gyration emaw,meltviscosity emaw molecularchainradius-in a ruat,criticalpenetrationsized aiin a te zawk a nih chuan,melt chu microproores-te chu a infiltrate thei lo.Itonly contactstherais edPTFEfibril chu lei chung lamah a ni a, chu chuan contactarea tenau tak tak a thlen a, chuvangin non-stickproperty chu a nghawng lo.A tlangpuiin, lei chunglam chu 0.5μm aia te zawkin a titawp thei a, chu chu mostthot-meltadhesives hmanga luh a veng thei a ni.
2.2ControlPorosityinaRange tlemte(50%–70%) .
Toolowporosity(<30%) hian practicalairpermeability a pe thei lo va;toohigh(>80%) chuan solid content chu a tihtlem nasa lutuk a,insulation leh mechanicalproperties-a chhiatna nasa tak a thlen a ni. Ataporosity around60%,theairpermeability(Gurleyvalue) chu 20–100s/100cc chhungin control theih a ni a, film 0.13mm thick erawh chuandielectricstrength≥2kV a vawng reng thei a, chu chu theat-sealinginsulation mamawh ang chiah a ni.
2.3AdoptaHigh-Tortuosity3DNetworkPoreStructure(JiangsuTeflonHigh-TemperatureClothManufacturer-in a hman)
PTFE-a'node-fibril'structure hian a pianphungah chuanshightortuosity(τ≈2.54) a siam a ni.Gases-te chuan kawng khirh tak tak a paltlang tur a ni a, chu chuan boruak chhena kawng a tizau a, straight-throughdischargechannel siamna chu a titawp thei a ni. Hightortuosity hian squarerelationship atanga poresize-a fairpermeability innghahna chu a ti tlem bawk a, pores lian zawk tlemte chu insulation rintlakna nena inthlengna atana hman a phalsak bawk.
2.4ConstructanAsymmetricGradientPoreStructure–DenseSurface,PorousChhung lam Densesurface vun layer(thickness1–5μm) a ni.
Heatcalendering hmangin, hun rei lote chhunga temperature sang intering emaw, ultra-thinfluoropolymer(eg, TeflonAF) hmanga coating emaw hmangin, hnathawhna thil nena inbiakna chuan a surface chu adensefilm ang chiah a nei a ni.Micropores chu nanometerscale-ah khar a ni a, a then chu a hmin leh seal a ni a, non-stickperformance leh insulation tihpun a ni. The bulkreteinsahighlyporousbreathablelayer: Skinlayer hnuaiah chuan material chuan micropores inzawmkhawmte porousnetwork sang tak a la nei reng a ni.Gascan chu laterally leh longitudinally-in edges kaltlangin residual nano-sized poresintheskin hmangin a transmit thei a,overallairpermeability a vawng reng thei a ni.
A nghawng dan: Insulation chu denselayer-in a thunun a, non-stickperformance chu denselayer-in lei chunglam hniam tak energy leh ultra-finepores-in a tichiang a, airpermeability chu interlayer diffus-ah a awm bawk ionandedgeconvection.Heat-sealingmachine-a hman a nih chuan, tapesurface chu moltenfilm-ah a innghat lo va, chutih laiin moisture leh volatile chu microporouslayer-a edge hmangin paih chhuah theih a ni.
2.5SurfacePost-Treatment:Super-Oleophobic/HydrophobicModificationPoreBlockage awm lovin Fluorinatedmonomer emaw, perfluorinated layer te tak te tak(<50nm)vapordeposition atanga plasmagrafting hmangin, acoating withthevenlowersurfaceenergy chu innerwallsofthemicropores ah a siam thei a ni.Hei hian porechannels clogging lovin stickysubstance hmanga siam a veng thei bawk. He enkawlna hian lei chunglam chu'micro/nanodual-phobicity,'non-stick property chu anti-soiling-a tihchangtlun, airpermeability hloh zawng zawng nen a siam a ni.
3.BalancedDesign atana hmanraw hman dan tlangpui
A tha ber tura siambreathablePTFEtape(0.13mmthick) lak chu entirnan:
Parameter a ni
Hlutna
Thli luh theihna (Gurley) .
30–60 s/100 cc – heat-sealing exhaust, vacuum lamination, etc. atana thil tulte a tlin.
Breakdown voltage a awm
≥3 kV (DC) – voltage hniam atanga hniam lam insulation isolation atan a tha
A chunglam non-stick peel force (acrylic adhesive laka, EVA hot-melt adhesive lakah) a ni.
<0.1 N/cm – hun rei tak temperature sang taka hman hnuah pawh a la awm lo
Temperature laka inven theihna
-70°C atanga 260°C thlenga hman chhunzawm zel tur
4.Thutawp
The balance ofthemicroporousstructureinbreathableTeflonhigh-temperaturetapeesessentially achieved through morphologicalengineering ,a property pathum chu structurallevel hrang hranga sem darh a ni:
Insulation leh non-stickperformance chu lei hnaih denses emaw, ultra-finemicropores emaw hmangin a pe a;
Airpermeability hi chhungril lama inzawm, tortuousmacroporousnetwork hmanga enkawl a ni. Submicronrange-a lei chung poresize chu control a nih rualin, internal poresity leh tortuosity chu gradientstructure nen chiang taka inzawmkhawm a nih chuan, tape hian a rualin specification hrang hrangah airpermeability,insulation, leh non-stickperformance tha tak a nei thei a ni.
