I. Idatha Eyinhloko: Amapharamitha e-Half-Life ye-BPO ne-DCP
1. I-Half-Life Temperature Reference
I-Peroxide crosslinking agents ilandela i-kinetics yokubola ye-oda lokuqala, kanti uhhafu wempilo (t₁/₂) ezingeni lokushisa elinikeziwe kuyinkomba evame ukusetshenziswa.
I-Benzoyl Peroxide (BPO): Uhhafu wempilo yeminithi elingu-1 cishe. 131°C, ihora elingu-1 lesigamu sempilo cishe. 92°C, isigamu sempilo yamahora angu-10 cishe. 72°C. Imikhiqizo ebolile yi-CO₂ ne-benzoic acid, engabangela amabhamuza kalula.
2. I-Dicumyl Peroxide (DCP):
Uhhafu wempilo yeminithi elingu-1 cishe. 171°C, ihora elingu-1 lesigamu sempilo cishe. 135°C, isigamu sempilo yamahora angu-10 cishe. 115°C. Imikhiqizo eyenziwe nge-acetophenone ne-methane, enephunga elinamandla.
3. Imfuneko Yokusetshenziswa Kwedatha
Amanani angenhla ayireferensi yedatha yezinto ezimsulwa. Ezixazululweni zangempela zokunamathela, izinyibilikisi, izigcwalisi, nama-antioxidants angaphazamisa izinga lokubola, ngakho ukulungiswa nge-DSC (Differential Scanning Calorimetry) kuyadingeka.
II. I-logic yokufanisa iwindi lenqubo
1. Nquma Isikhathi Ngokusekelwe Kuzinga Lokubola
Isendlalelo sokunamathisela sidinga ukufeza u-97% -99% we-crosslinking (cishe ukuphila kwesigamu se-5-7). Ngakho-ke, isikhathi sokuphulukisa kufanele sibe izikhathi ezingu-5-7 isigamu sempilo ezingeni lokushisa eliqondiwe.
2. I-Back-Calculate Temperature kusuka ku-Production Line Residence Time
Uma isikhathi sokushisa esisebenzayo kuhhavini singamaminithi angu-5 kanye nokuphila kwesigamu se-5 kuyadingeka ukuze kuqedwe, khona-ke okudingekayo t₁/₂ ≤ iminithi elingu-1. Izinga lokushisa elinguhhafu wempilo eliyiminithi elingu-1 lilinganiselwa. 131°C ye-BPO kanye nokulinganiselwa. 171°C ku-DCP. Izinga lokushisa lokupholisa kufanele libekwe libe ngaphezulu noma libe ngaphezudlwana kwaleli nani.
3. Bala Isikhathi Emuva Kusuka Emazingeni Okushisa Aphezulu Avumelekile
Okokuqala thola izinga lokushisa eliphezulu (i-Tmax) elingamelana ne-substrate ne-adhesive layer. Thola isigamu sempilo kulelo zinga lokushisa, bese ubala isikhathi esincane sokuhlala ngokuphindaphinda izikhathi ezingu-5-7, ukuvimbela ukulimala okushisayo ekushiseni ngokweqile.
III. IWindows Ejwayelekile Yokwelapha yeTeflon Tape
I-substrate ye-Teflon inokumelana nokushisa okuhle kakhulu, kodwa okunamathelisa okuzwela ukucindezela kwe-silicone okusetshenzisiwe kuyisici esikhawulelayo. Izikimu ezimbili zihlongozwa ngokusekelwe ezicini ze-crosslinker.
1. I-BPO Low-Temperature Fast Scheme
Ifanele amateyipu azacile noma izinhlelo zokusebenza ezizwelayo ekuncipheni kokushisa. Iwindi: 115-135°C, 3-10 imizuzu.
Isibonelo: Ku-125°C kuhhavini, uhhafu wempilo ye-BPO cishe. Imizuzu engu-2.5, ngakho-ke ukuphila kwesigamu se-5 kuthatha cishe imizuzu engu-12.5. Ukuze kusheshiswe, izinga lokushisa linganyuswa libe ngu-135 ° C (t₁/₂ ≈ imizuzwana engu-45), liqedele inqubo ngemizuzu emi-5. Nokho, kufanele kuqashelwe izindaba ze-CO₂ micro-bubble; Ukushisisa okunyanyisiwe noma ama-nip roller amaphakathi ayanconywa.
2. I-DCP High-Temperature Stable Scheme
Ifanele amateyipu aminyene nemikhiqizo edinga amandla okubamba asezingeni eliphezulu. Iwindi: 150-175 ° C, 5-15 imizuzu.
Isibonelo: Ku-160°C, uhhafu wempilo ye-DCP cishe. Imizuzu engu-1.5, ngakho-ke ukuphila kwesigamu se-5 kudinga imizuzu engu-7.5. Ukwenyukela ku-170°C kunciphisa uhhafu wempilo ukuthi ucishe. Imizuzu engu-0.8, ithola ukubola okungaphezulu kuka-97% emizuzwini emi-5, ehambisana nemigqa yokukhiqiza enesivinini esikhulu. I-PTFE izinzile ngokwengxenye kuleli zinga lokushisa, okwenza lokhu kube iwindi lezimboni elikahle.
IV. Amaphuzu Abalulekile Abalulekile Wokufanisa
1. Ukubambisana Phakathi Kwezici Zokushisisa Okunyathelwe Nokonakala
Sebenzisa igradient 'yokuqalisa kwezinga lokushisa eliphansi → izinga lokushisa eliphezulu eligcwele ukuhlangana okugcwele.' Ngokwesibonelo, nge-DCP, qala ngokuvumela okunamathelayo ukuthi kugeleze futhi kumanzise i-PTFE ngo-130°C, bese ukhuphula izinga lokushisa libe ngu-165°C ukuze uqedele ukuphulukisa. Lokhu kunciphisa ukukhubazeka kwendawo futhi kuthuthukisa i-anchorage.
Ama-inhibitors noma ama-solvents ekwakhiweni kwe-adhesive angashintsha izinga lokubola. Sebenzisa i-DSC ukuze ulinganise ijika le-exothermic eliphilisayo, thola isikhathi sokufinyelela izinga eliphezulu lokusabela ezingeni lokushisa lenqubo, futhi ubale uhhafu wempilo efanayo ngokufanele. Ungawasebenzisi ngokunganaki amanani ajwayelekile.
3. Ukucatshangelwa komlando we-Substrate Thermal
Ifilimu ye-Teflon eyakhelwe ukunwetshwa ingase inciphe ngokushisa ngaphezu kuka-200°C. Uma usebenzisa iwindi le-DCP lokushisa okuphezulu, i-substrate kufanele ifakwe ngaphambili noma kukhethwe ifilimu eshushuluzayo encipha kancane ukuze kuvinjwe ukugoqa kwe-tape ngemva kokuphulukiswa.
Kafushane: Ngokusekelwe esikhathini sangempela sokushisisa somugqa wokukhiqiza, khetha iphoyinti lokushisa lapho uhhafu wempilo wenelisa 'n × uhhafu wempilo ≈ isikhathi sokuhlala,' ngaleyo ndlela uqondanise ngokunembile izici zokubola ze-BPO noma i-DCP nenqubo yokwelapha yeteyipu ye-Teflon.
Ulwazi olungenhla luhlinzekwa ngu I-Jiangsu OK New Material Technology Co., Ltd. , umkhiqizi wezindwangu ze-Teflon ezishisa kakhulu.
Uma ungathanda ukufunda okwengeziwe mayelana nokucaciswa okuningiliziwe, izimo zohlelo lokusebenza, nezinketho zokwenza ngokwezifiso uhla lwethu olugcwele lwemikhiqizo-okuhlanganisa izindwangu ze-Teflon ezishisa kakhulu, itheyiphu ye-Teflon yokushisa ephezulu, amabhande e-Teflon anezintambo ezinokushisa okuphezulu, amabhande omshini wokunamathisela angenamthungo, i-PTFE ehlangothini olulodwa, indwangu ye-conveyorglass enezinga eliphezulu lokushisa eliphezulu. izindwangu-sicela ukhululeke ukuxhumana nathi nge:
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