Lesi sihloko sihlanganisa indlela yokufanisa isivinini somugqa womshini wokumboza kanye nobude be-ovini ukuze kuqinisekiswe ukunamathela kwe-organosilicone kufinyelela izinga lokuphulukisa eliqondiwe letheyiphu ye-PTFE yokushisa ephezulu. Isimiso sokufanisa esiyinhloko: isikhathi sokuhlala sisonke t_total = ubude behhavini obusebenzayo L ÷ isivinini somugqa v akumelwe sibe ngaphansi kwesilinganiso esincane esidingekayo sokwelapha. Thola izici zokwelapha nge-DSC noma ukuhlola okunamathelayo okusungula ubuhlobo 'izinga lokushisa - ubuncane besikhathi sokwelapha'. Imodeli yokwelapha eqongelelekayo elinganayo: hlukanisa i-ovini ibe izindawo, bala i-ti=Li/v kanye ne-tcure(Ti), qinisekisa ∑(ti/tcure(Ti)) ≥1. Izinqubo zokubala: setha izindawo zokushisa ezinobude uLi namazinga okushisa Ti; setha isivinini somugqa v, ubale isikhathi sokuhlala sendawo ngayinye nesilinganiso somnikelo; phinda kuze kube isamba esingu-≥1 (imajini yokuphepha engu-1.1-1.2 iyanconywa).

Lesi sihloko siqhathanisa umehluko phakathi kokushisisa ngemisebe ye-infrared kanye nezindlela zokuphulukisa zokufudumeza komoya oshisayo ekufanisweni kwesakhiwo esiphambanayo sezendlalelo zokunamathela ze-silicone. Izindlela zokudlulisa ukushisa: umoya oshisayo uncike ekuqhubeni i-convection ngokukhuphuka kwezinga lokushisa elithambile, umehluko omncane wokushisa wangaphakathi / wangaphandle; I-IR inokujula kokungena okulinganiselwe nokumuncwa okuqinile kwendawo (amashumi kuya kumakhulu ama-micrometer) okudala ukuthambekela okuphakathi nendawo kuya kwangaphakathi. Imithelela ekufaniseni kwe-crosslink: umoya oshisayo uvumela ukuphulukiswa okuvumelanayo ngaphakathi nangaphandle ngobuningi be-crosslink obufanayo; I-IR ibangela ungqimba olungaphezulu ukuthi lwakhe 'ifilimu yesikhumba' eliminyene ngokushesha evimbela ukuqhutshwa kokushisa kanye nokunyakaza kwangaphakathi kweketango, okudala ukuminyana kwe-crosslink kwehla ukusuka phezulu kuye ngaphakathi.

Lesi sihloko sihlanganisa ukuxhumana komthamo phakathi kwengxenye yejeli namandla ahlangene kuzinamatheliso ezizwela ukucindezela kwe-silicone yeteyipu ye-Teflon. Ingxenye yejeli = iphesenti elikhulu lenethiwekhi exhumene kakhulu engancibiliki ku-toluene (Isizinda se-Soxhlet, 24hr). Amandla ahlangene abonakala ngamandla okubamba izinga lokushisa eliphezulu (180°C, 1kg). Ububanzi obuthathu: ngezansi kwephuzu elibalulekile (<60%) — ayikho inethiwekhi ye-percolating, ebambe amandla eduze kweqanda; ububanzi obusebenzayo (60-85%) - amandla ahlangene akhula ngokuqhubekayo nge-gel ingxenyenamba, i-60% → 70% iphakamisa isikhathi sokubamba kusukela emaminithini kuya emahoreni, 70% → 80% inikeza ukwanda okungu-3-10x; high crosslinking (>85%) — izuza kancane (85%→95% kuphela 20-50% ukwanda), tack kwehla kakhulu, >95% ulahlekelwa PSA izakhiwo.

Lesi sihloko sihlanganisa indlela yokufanisa izinga lokushisa lokubola kanye nengxenye yempilo ye-peroxide crosslinking agents (BPO ne-DCP) nefasitela lenqubo yokwelapha leteyipu ye-Teflon. Idatha ebalulekile: BPO — 1-minthi uhhafu wempilo ku-~131°C, ihora elingu-1 ku-~92°C, ihora elingu-10 ku-~72°C; I-DCP — iminithi elingu-1 kokuthi ~171°C, ihora elingu-1 kokuthi ~135°C, ihora elingu-10 ku-~115°C. I-logic ehambisanayo: i-adhesive idinga i-97-99% crosslinking = 5-7 impilo yesigamu; isikhathi sokuphulukisa = 5-7 × isigamu sempilo ekushiseni okuhlosiwe. Bala emuva izinga lokushisa kusukela esikhathini sokuhlala komugqa wokukhiqiza noma ubale emuva kwesikhathi ukusuka kumazinga okushisa aphezulu avumelekile.

Lesi sihloko siqhathanisa umehluko phakathi kokushisisa ngemisebe ye-infrared kanye nokufudumeza komoya oshisayo ekufanisweni kwesakhiwo esiphambanayo sesendlalelo sokunamathela se-silicone. Izindlela zokudlulisa ukushisa: umoya oshisayo uyi-convection-conduction, imnene futhi iqhubekela phambili, idala i-gradient yokushisa emaphakathi; I-IR iwukumunca emisebeni okumunca indawo ejulile (ama-micrometer ukuya kumamilimitha) okudala umqansa osuka phezulu uye wangaphakathi. Imithelela ekusabalaliseni kokuminyana kwe-crosslink: Umoya oshisayo uvumela izingxenye zangaphakathi nezingaphandle ukuthi zingene ebangeni lokushisa le-vulcanization cishe ngasikhathi sinye, zinikeze ukuminyana okufanayo kwe-crosslink ngokujiya; I-IR ibangela ungqimba olungaphezulu ukuthi lwelaphe ngokushesha ukwakheka kwesikhumba esiminyene esivimba ukudluliswa kokushisa, okuholela ekwehleni kwe-gradient ebukhali yokuminyana kwe-crosslink kusuka phezulu kuya ngaphakathi.

Lesi sihloko sihlola imiphumela yokulawula ukungezwani kwewebhu phakathi ne-Teflon itheyiphu yetheyiphu yokushisa ephezulu yokushisa ku-PTFE substrate flatness kanye nokufana kwe-adhesive coating. Imithelela ekushikeni kwe-substrate: ukungezwani okudlula umkhawulo onwebekayo kubangela ukwelula nokugoqa kwentamo okungabuyiseleki emuva (ukwelulwa kwe-longitudinal, ukufinyela okunqamulayo), ukwakha ukuxega, imibimbi namaphethini angamagagasi; I-PTFE ingena ngaphansi kwengcindezi eqhubekayo iba 'iqandiswe' ngemva kokupholisa, ibangele ukungalingani kwendawo; ukungezwani okuguquguqukayo okungalingani okuvela ekufananeni kwama-roller okungalungile kudala imiphetho egobile, amabhamuza amaphakathi, namamaki axegayo aqinile.

Lesi sihloko sichaza iphethini yoshintsho emandleni ahlangene we-PTFE ungqimba olunamathelayo lwetheyiphu yokushisa ephezulu ngemva kokuguga okuphezulu. Iphethini yezigaba ezintathu: Isiteji esikhuphukayo sokuphulukisa (ukuchayeka emazingeni okushisa aphezulu ku-200-260 ° C, amaqembu asalayo asebenzayo ayaqhubeka nokuphambana, ukuhlangana kuyanda kakhulu); Isiteji sokulingana esizinzile (izindlela zokuphambana maqondana nokuqedwa, ukubumbana kuhlala kuzinzile isikhathi eside); Ukuwohloka nokwehla kwesigaba (isikhathi esiningi/izinga lokushisa eleqile lidala ukuwohloka kweketango eliyinhloko, ukuhlangana kuyancipha, okunamathelayo kuyathamba futhi kuba nzima). Izimbangela eziyinhloko zokwehluleka ukuhlangana (ukudabuka kwangaphakathi okushiya insalela) kanye nokuminyanisa (ukugeleza okubandayo okuvela emaphethelweni ngenxa yokuncipha kwemodulus) kuyahlaziywa.

Lesi sihloko sinikeza izindlela zokuthuthukisa ukumelana nokukhasa kanye nokuzinza kwesikhathi eside kwe-teflon high-hold-temperature tape. Amasu ahlanganisa: Ukuthuthukiswa kwe-topology yenethiwekhi ye-molecular — high MQ silicone resin/gum ratio (1.2:1–2:1) yakha izizinda eziqinile zesigaba esiqinile; ukufakwa kwamaqembu e-phenyl (20-30 mol%) kuvimbela ukunyakaza kweketango; I-crosslink isisindo se-molecular elawulwa ku-5,000-15,000 g / mol; I-Gradient modulus multilayer adhesive structure — primer-anchoring layer (1-3μm) ene-silane coupling agent, high-modulus cohesive layer (30-50μm) njengohlaka lwamathambo olumelana ne-shear, ungqimba olusebenzayo lwe-viscoelastic (3-8μm) lokumanzisa phezulu; Ama-Nanofillers - i-silica evuthayo (10-25 wt%) enokuguqulwa kwendawo idala ukuphambana komzimba okubuyiselekayo.

Lesi sihloko sikhuluma ngendlela idizayini yesakhiwo esine-microporous ye-Teflon ephefumulayo (PTFE) yetheyiphu yokushisa ephezulu ebhalansisa ukungeneka komoya nge-insulation kanye nezakhiwo ezinganamathi. Ukungqubuzana okuyinhloko: ukungena komoya kudinga izimbotshana ezivulekile, kuyilapho ukwahlukanisa kudinga ukuminyana futhi okunganamathi kudinga izindawo ezibushelelezi. Amasu okuklama okulinganiselayo: lawula isilinganiso se-pore ububanzi (0.1-2μm, ngokufanelekile <0.5μm) ukuvimbela ukungena okuncibilika nokugcina i-voltage yokuphuka; lawula i-porosity ku-50-70% (≈60% ngokufanele) ukufeza i-Gurley 20-100s/100cc namandla e-dielectric ≥2kV yefilimu engu-0.13mm; sebenzisa ukwakheka kwezimbotshana zenethiwekhi ye-3D ene-tortuosity ephezulu (τ≈2.5-4) ukucindezela iziteshi zokuphuma eziqondile; ukwakha i-asymmetric gradient pore isakhiwo esinongqimba lwesikhumba esiminyene (1-5μm) sokungeyona intonga/ukushisa kanye nengaphakathi elinezimbotshana ukuze kuphefumuleke; sebenzisa i-super-oleophobic/hydrophobic surface post-treatment ngaphandle kokuvaleka kwezimbotshana.

Lesi sihloko sinikeza izixazululo ezihlelekile zokuvimbela izinsalela zokunamathela nokopha okunamathelayo uma usebenzisa i-PTFE itheyiphu yokushisa ephezulu ukuvikela iminwe yegolide ye-PCB ngesikhathi somhlangano we-SMT. Ukuhlaziywa kwembangela yezimpande: insalela ivela ekuhlulekeni okuhlangene noma ukudluliswa okuhlangene; ukopha kwenzeka ngenxa yokwehla kwe-viscosity kanye nokuchichima kokunamathela ngaphansi kokushisa okugelezayo. Isixazululo esiyinhloko ukukhetha itheyiphu efanele: i-silicone PSA enokuphakama kwesikhashana okungu-≥300°C, okuqhubekayo ≥260°C, ukujiya okuphelele okungu-0.08-0.13mm okunezendlalelo ezinamathelayo ezinamathele eziqinile eziqinile, kanye nesitifiketi esivimbela ukopha/insalela. Ukulawula inqubo yezinyathelo eziyisithupha: ukuhlanzwa kwangaphambili kwe-lamination nge-IPA; I-lamination ye-zero-tension nge-air evacuation egcwele; iphrofayili yezinga lokushisa lokugeleza kabusha elilungiselelwe ngokufudumeza okuthambile (<2°C/s); ukuxebuka okubandayo ngaphansi kuka-50°C nge-engeli engu-180°; ukucubungula ngokushesha phakathi kwamahora angama-24 nokusetshenziswa kanye kuphela; ukuphatha ukwehluleka ngokusula kwe-IPA kanye nokuhlolwa kwesikhulisi esingu-40-50x. Kuma-PCB anezinhlangothi ezimbili, buyisela itheyiphu entsha ngaphambi kokucutshungulwa kohlangothi lwesibili.