I. Iinkcukacha eziPhambili: IiParameters ze-Half-Life ze-BPO kunye ne-DCP
1. Half-Life Temperature Reference
I-peroxide crosslinking agents ilandela i-kinetics yokubola okokuqala, kunye nesiqingatha sobomi (t₁/₂) kwiqondo lokushisa elinikeziweyo lisalathisi esisetyenziswa ngokuqhelekileyo.
I-Benzoyl Peroxide (BPO): Umzuzu we-1 wesiqingatha sobomi malunga ne-approx. 131 ° C, 1-iyure-isiqingatha-ubomi malunga. 92 °C, isiqingatha-iyure-iyure-ubomi malunga. 72°C. Iimveliso ezibolileyo yi-CO₂ kunye ne-benzoic acid, enokubangela lula amaqamza.
2. IDicumyl Peroxide (DCP):
-1-umzuzu-isiqingatha-ubomi malunga malunga. 171°C, 1-iyure-isiqingatha-ubomi malunga. 135 ° C, 10-iyure isiqingatha-ubomi malunga. 115°C. Iimveliso ze-by-products yi-acetophenone kunye ne-methane, enevumba elinamandla.
3. Imfuneko yokuSetyenziswa kweDatha
La maxabiso angasentla yinxalenye yedatha yezinto ezisulungekileyo. Kwizisombululo zangempela zokubambelela, i-solvents, fillers, kunye ne-antioxidants inokuphazamisa izinga lokubola, ngoko ke ukulungiswa nge-DSC (Differential Scanning Calorimetry) kuyafuneka.
II. Ingqiqo yokuTshatisa iNkqubo yefestile
1. Misela ixesha ngokuSekwe kwiDegree of Decomposition
I-adhesive layer idinga ukufezekisa i-97% -99% ye-crosslinking (malunga ne-5-7 ye-half-life). Ngoko ke, ixesha lokunyanga kufuneka libe ngamaxesha angama-5-7 kwisiqingatha sobomi kwiqondo lokushisa elijoliswe kuyo.
2. Ubushushu obalwe ngasemva ukusuka kwiXesha lokuHlala loMsebenzi weMveliso
Ukuba ixesha lokufudumala elisebenzayo kwi-oven yimizuzu emi-5 kunye ne-5 yesiqingatha-ubomi obufunekayo ukuze kugqitywe, ke i-t₁/₂ ≤ efunekayo 1 iminithi. Ubushushu besiqingatha somzuzu womzuzu-1 bumalunga. I-131 ° C ye-BPO kunye ne-approx. I-171°C ye-DCP. Ubushushu bokunyanga kufuneka bubekwe okanye bungaphezulu kancinci kweli xabiso.
3. Emva-Bala ixesha ukusuka kuBubushushu obuvumelekileyo obuphezulu
Okokuqala misela ubushushu obukhulu (Tmax) ukuba i-substrate kunye ne-adhesive layer inokumelana nayo. Fumana isiqingatha-ubomi kwelo qondo lokushisa, uze ubale ubuncinci bexesha lokuhlala ngokuphindaphinda ngamaxesha angama-5-7, ukukhusela umonakalo we-thermal ekugqithiseni.
III. Unyango oluqhelekileyo lweWindows kwiTeflon Tape
I-Teflon substrate inokumelana nobushushu obugqwesileyo, kodwa i-adhesive ye-silicone yoxinzelelo lwe-adhesive esetyenzisiweyo yeyona nto ithintelayo. Izikimu ezimbini zicetywayo ngokusekelwe kwiimpawu ze-crosslinker.
1. I-BPO ye-Low-Temperature Fast Scheme ePhantsi
Ifanele iiteyiphu ezicekethekileyo okanye izicelo ezibuthathaka kubushushu obunciphayo. Ifestile: 115-135 ° C, 3-10 imizuzu.
Umzekelo: Kwi-125 ° C kwi-oven, i-half-life ye-BPO isondele. Imizuzu ye-2.5, ngoko ke i-5 yesiqingatha-ubomi ithatha malunga nemizuzu eyi-12.5. Ukukhawuleza, ukushisa kunokuphakanyiswa kwi-135 ° C (t₁/₂ ≈ imizuzwana ye-45), ukugqiba inkqubo kwimizuzu ye-5. Nangona kunjalo, kufuneka kunikwe ingqwalasela kwimiba ye-CO₂ micro-bubble; Ukufudumeza okunyathelweyo okanye i-nip rollers ephakathi iyacetyiswa.
2. ISkimu seDCP esizinzile sobushushu obuphezulu
Ilungele iiteyiphu ezishinyeneyo kunye neemveliso ezifuna amandla okugcina ubushushu obuphezulu. Ifestile: 150-175 ° C, 5-15 imizuzu.
Umzekelo: Kwi-160 ° C, i-half-life ye-DCP imalunga. Imizuzu eyi-1.5, ngoko ke i-5 yesiqingatha-ubomi ifuna imizuzu eyi-7.5. Ukunyuka ukuya kwi-170 ° C kunciphisa isiqingatha sobomi ukuya kwi-approx. Imizuzu eyi-0.8, ukufezekisa ukubola kwe-97% kwimizuzu emi-5, ukuhambelana nemigca yokuvelisa ngesantya esiphezulu. I-PTFE izinzile ngokobu bushushu, isenza le festile yeshishini.
IV. Amanqaku aPhambili aSebenzayo ukuze aMatanise
1. Intsebenziswano phakathi koKufudumeza okuNyathelweyo kunye noKubola kweempawu
Sebenzisa i-gradient ye 'i-low-temperature initiation → ubushushu obuphezulu obugcweleyo.' Umzekelo, nge-DCP, vumela kuqala i-adhesive ukuba ihambe kwaye imanzise i-PTFE kwi-130 ° C, emva koko unyuse iqondo lobushushu liye kwi-165 ° C ukugqiba ukunyanga. Oku kunciphisa iziphene ezingaphezulu kunye nokwandisa i-anchorage.
I-inhibitors okanye i-solvents ekubunjweni kwe-adhesive inokuguqula izinga lokubola. Sebenzisa i-DSC ukulinganisa ijiko lokunyanga i-exothermic, fumana ixesha lokufikelela kwinqanaba eliphezulu lokusabela kwiqondo lobushushu benkqubo, kwaye umva-bale isiqingatha sobomi obulinganayo ngokufanelekileyo. Musa ukulandela ngokumfamekileyo imilinganiselo esemgangathweni.
3. Ukuqwalaselwa kweMbali ye-Substrate Thermal
Ifilimu yeTeflon eyoluliweyo isenokuncipha ngokushushu okungaphezulu kwe-200°C. Ukuba usebenzisa i-DCP yefestile ephezulu yokushisa, i-substrate kufuneka ifakwe ngaphambili okanye ifilimu ye-skived ye-low-shrinkage kufuneka ikhethwe ukukhusela i-tape curling emva kokunyanga.
Isishwankathelo: Ngokusekelwe kwixesha langempela lokufudumeza komgca wokuvelisa, khetha indawo yokushisa apho isiqingatha-ubomi siyanelisa 'n × isiqingatha-ubomi ≈ ixesha lokuhlala,' ngaloo ndlela uhambelana ngokuchanekileyo neempawu zokubola kwe-BPO okanye i-DCP kwinkqubo yokunyanga yeTeflon tape.
Olu lwazi lungentla lunikezelwa ngu Jiangsu OK New Material Technology Co., Ltd. , umenzi weTeflon amalaphu aphezulu obushushu.
Ukuba ungathanda ukufunda ngakumbi malunga neenkcukacha ezicacileyo, iimeko zesicelo, kunye neenketho zokwenza ngokwezifiso uluhlu lwethu olupheleleyo lweemveliso-kubandakanya amalaphu eTeflon aphezulu obushushu, iteyiphu yobushushu obuphezulu beTeflon, amabhanti eTeflon anobushushu obuphezulu, amabhanti omatshini ancamathelayo angenamthungo, icala elinye lePTFE, ilaphu elinobushushu obuphezulu kunye ne-fiberglass enobushushu obuphezulu. amalaphu-nceda uzive ukhululekile ukuqhagamshelana nathi ngokusebenzisa:
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