Eli nqaku libandakanya indlela yokutshatisa isantya somatshini wokugquma kunye nobude be-oveni ukuze kuqinisekiswe ukuba i-organosilicone incamathele ifikelela kwiqondo lokunyanga ekujoliswe kuko kwiteyiphu ye-PTFE yobushushu obuphezulu. Umgaqo ongundoqo wokuthelekisa: ixesha lokuhlala lilonke t_total = ubude be-oveni obusebenzayo L ÷ isantya somgca v kufuneka singabi ngaphantsi kwexesha elifunekayo lokunyanga. Fumana iimpawu zonyango nge-DSC okanye iimvavanyo zokunyanga ezincamathelayo ezibonisa 'iqondo lobushushu - ixesha eliphantsi lokunyanga' ubudlelwane. Imodeli yonyango elinganayo eyongezelekayo: yahlula i-oveni ngokwemimandla, bala i-ti=Li/v kunye ne-tcure(Ti), qinisekisa ∑(ti/tcure(Ti)) ≥1. Iinkqubo zokubala: misela imimandla yobushushu enobude uLi kunye namaqondo obushushu Ti; seta isantya somgca v, ubale ixesha lokuhlala kwindawo nganye kunye nomlinganiselo wegalelo; phinda de kube iyonke ≥1 (umda wokhuseleko 1.1-1.2 ucetyiswa).

Eli nqaku lithelekisa iiyantlukwano phakathi kokufudumeza kwe-infrared radiation kunye ne-hot-air circulation ukufudumeza iindlela zokuphilisa kwi-crosslinked structure efanayo ye-adhesive layers ye-silicone. Iindlela zokuhambisa ubushushu: umoya oshushu uxhomekeke kwi-convection-conduction ngokunyuka kobushushu obuthambileyo, umahluko omncinci wangaphakathi / wangaphandle wobushushu; I-IR inobunzulu bokungena obulinganiselweyo kunye nokufunxa okuqinileyo komphezulu (amashumi ukuya kumakhulu eemicrometers) idala umnqantsa wokuthambeka komphezulu ukuya ngaphakathi. Iimpembelelo ekufanisweni kwe-crosslink: umoya oshushu wenza ukunyanga okuhambelanayo ngaphakathi nangaphandle kunye nokuxinana kwe-crosslink efanayo; I-IR ibangela ukuba umaleko womphezulu wenze 'ifilimu yolusu' exineneyo ethintela ukwenziwa kobushushu kunye nokushukuma kwetsheyini yangaphakathi, idala ingxinano ye-crosslink eyehlayo ukusuka kumphezulu ukuya ngaphakathi.

Eli nqaku libandakanya ubungakanani bembalelwano phakathi kweqhezu lejeli kunye namandla ahambelanayo kwi-adhesives ye-silicone yoxinzelelo lwe-Teflon. Iqhezu le-Gel = ipesenti yobuninzi be-crosslinked network enganyibilikiyo kwi-toluene (i-Soxhlet extraction, 24hr). Amandla okubambisana abonakaliswe ngamandla obushushu obuphezulu (180 ° C, 1kg). Uluhlu oluthathu: ngaphantsi kwendawo ebalulekileyo (<60%) - akukho intanethi ye-percolating, ubambe amandla kufuphi ne-zero; uluhlu olusebenzayo (60-85%) - amandla okubambisana akhula ngokukhawuleza kunye neqhezu le-gel, i-60% → i-70% iphakamisa ixesha lokubamba ukusuka kwimizuzu ukuya kwiiyure, i-70% → i-80% inika ukwanda kwe-3-10x; i-high crosslinking (> 85%) - izuza ngokukhawuleza (85% → 95% kuphela i-20-50% yokwanda), i-tack yehla kakhulu, > i-95% ilahlekelwa iipropati ze-PSA.

Eli nqaku liquka indlela yokutshatisa iqondo lobushushu lokubola kunye nesiqingatha sobomi be-peroxide crosslinking agents (BPO kunye neDCP) kunye nefestile yenkqubo yokunyanga yeTeflon tape. Idatha ebalulekileyo: i-BPO - i-1-min-half-life in ~ 131 ° C, i-1-hr kwi- ~ 92 ° C, i-10-iyure kwi- ~ 72 ° C; DCP — 1-min at ~171°C, 1-hr at ~135°C, 10-hr at ~115°C. Ingqiqo ehambelanayo: i-adhesive idinga i-97-99% crosslinking = 5-7 isiqingatha-ubomi; ixesha lokuphilisa = 5-7 × isiqingatha-ubomi kwiqondo lokushisa elijoliswe kuyo. Ubushushu bokubala umva ukusuka kwixesha lokuhlala kumgca wemveliso okanye umva-bale ixesha ukusuka kwiqondo lobushushu eliphezulu elivumelekileyo.

Eli nqaku lithelekisa iiyantlukwano phakathi kokufudumeza kwemitha ye-infrared kunye nokufudumeza komoya oshushu kwi-crosslinked structure efanayo ye-adhesive layer ye-silicone. Iindlela zokuhambisa ubushushu: umoya oshushu yi-convection-conduction, ithambile kwaye iqhubela phambili, idala iqondo lobushushu eliphakathi; I-IR kukufunxa ngemitha ngokufunxa okunzulu komphezulu (i-micrometers ukuya kwi-millimeters) idala umnqantsa wokuthambeka komphezulu ukuya ngaphakathi. Iimpembelelo kwi-crosslink density distribution: i-hot-air ivumela iinxalenye zangaphakathi nangaphandle ukuba zingene kuluhlu lobushushu be-vulcanization phantse ngaxeshanye, ukunikezela ukuxinana kwe-crosslink efanayo kunye nobukhulu; I-IR ibangela umaleko womphezulu ukuba unyange ngoko nangoko ukwenza ulusu olushinyeneyo oluthintela ukuhanjiswa kobushushu, nto leyo ekhokelela ekuncipheni okubukhali koxinzelelo lwe-crosslink ukusuka kumphezulu ukuya ngaphakathi.

Eli nqaku liphonononga iziphumo zolawulo loxinzelelo lwewebhu ngexesha leTeflon yobushushu obuphezulu bokugquma kwi-PTFE substrate flatness kunye ne-adhesive coating uniformity. Iimpembelelo kwi-substrate flatness: Ukuxinezeleka okungaphezulu komda we-elastic kubangela ukolula kweplastiki okungaguqukiyo kunye nentamo (ubude be-longitudinal, ukucutha okunqamlezayo), ukwenza ukuthamba, imibimbi kunye neepateni ezinamaza; I-PTFE ichwechwa phantsi koxinzelelo oluqhubekayo iba 'nomkhenkce' emva kokupholisa, ibangele ukungalingani komphezulu; Uxinzelelo olungalinganiyo olunqamlezileyo olusuka kunxunguphalo lwerola ehambelanayo ludala imiphetho egobileyo, amadyungudyungu asembindini, kunye namanqaku axengaxengayo.

Eli nqaku lichaza ipateni yotshintsho kumandla okubambisana kwe-PTFE yobushushu obuphezulu betape yokunamathela emva kokuguga okuphezulu. Ipatheni yezigaba ezintathu: I-post-curing rise up (i-high-temperature exposure ekuqaleni kwe-200-260 ° C, amaqela asebenzayo aseleyo aqhubeka e-crosslink, ukubambisana kwanda kakhulu); Inqanaba elizinzileyo lolungelelwaniso (iindlela zokuwela ukudibanisa ukugqitywa, ubumbano luhlala luzinzile ixesha elide); Ukuthotywa kunye nenqanaba lokuhla (ixesha eligqithisileyo / ubushushu bubangela ukuthotywa kwekhonkco eliphambili, ukuhambelana kuncipha, i-adhesive iyathamba kwaye ibe tacky). Iingcambu ezibangela ukusilela okubambeneyo (ukukrazuka kwangaphakathi kushiya intsalela) kunye nokucudisa ngaphandle (ukuhamba okubandayo okuvela emaphethelweni ngenxa yokuncipha kwemodyuli) ziyahlalutywa.

Eli nqaku libonisa iindlela zokuphucula ukuxhathisa kwe-creep kunye nokuzinza kwexesha elide lokubamba iteyiphu ephezulu yobushushu beTeflon. Amaqhinga abandakanya: Ukulungiswa kwe-molecular network topology - i-high MQ silicone resin / gum ratio (1.2: 1-2: 1) ifom ye-hard-phase domains; ukufakwa kwamaqela e-phenyl (20-30 mol%) kuthintela ukuhamba kwekhonkco; ubunzima be-molecular crosslink elawulwa kwi-5,000-15,000 g / mol; I-Gradient modulus multilayer adhesive structure — primer-anchoring layer (1-3μm) ene-silane coupling agent, high-modulus cohesive layer (30-50μm) njenge-shear-resistant skeleton, i-viscoelastic functional layer (3-8μm) yokumanzisa umphezulu; I-Nanofillers - i-silica evuthayo (i-10-25 wt%) enokuguqulwa komphezulu yenza ukuwela ukuguqulwa komzimba.

Eli nqaku lijongana nendlela uyilo lwesakhiwo se-microporous seTeflon ephefumlayo (PTFE) yobushushu obuphezulu beteyiphu ibhalansisa ukufikeleleka komoya ngokugquma kunye neempawu ezingabambekiyo. Ungquzulwano olungundoqo: Ukungena komoya kufuna imingxunya evulekileyo, ngelixa ukugquma kufuna ukuxinana kunye nokungancamatheli kufuna umphezulu ogudileyo. Izicwangciso zoyilo olulinganisiweyo: lawula i-avareji ye-pore diameter (0.1-2μm, ngokufanelekileyo <0.5μm) ukuthintela ukungena okunyibilikayo kunye nokugcina umbane wokuphuka; ukulawula i-porosity kwi-50-70% (≈60% ngokufanelekileyo) ukufezekisa i-Gurley 20-100s / 100cc kunye namandla e-dielectric ≥2kV yefilimu ye-0.13mm; ukwamkela ubume bepore womnatha ophezulu we-3D (τ≈2.5-4) ukucinezela imijelo yokukhupha ngokuthe ngqo; Yakha i-asymmetric gradient pore structure kunye ne-asymmetric gradient pore layer (1-5μm) ye-non-stick / insulation kunye ne-porous yangaphakathi yokuphefumla; sebenzisa i-super-oleophobic/hydrophobic surface post-treatment ngaphandle kokuvaleka kwepore.

Eli nqaku libonelela ngezisombululo ezicwangcisiweyo zokuthintela intsalela encamathelayo kunye ne-adhesive bleed xa usebenzisa i-PTFE high-temperature tape ukukhusela iminwe yegolide ye-PCB ngexesha lendibano ye-SMT. Uhlalutyo lwesizathu esisisiseko: i-residue ivela ngenxa yokungaphumeleli kokubambisana okanye ukudluliselwa kwe-interfacial; ukopha kwenzeka ukusuka kwi-viscosity drop kunye ne-adhesive ephuphumayo phantsi kobushushu bokuphinda buphume. Isisombululo esingundoqo kukukhethwa kwe-tape efanelekileyo: i-silicone ye-PSA ene-peak yexesha elifutshane ≥300 ° C, eqhubekayo ≥260 ° C, ubukhulu obupheleleyo be-0.08-0.13mm kunye neengqimba ezinamathele ezinamathele eziphezulu, kunye ne-anti-bleed / i-residu-free certification. Ulawulo lwenkqubo yamanyathelo amathandathu: ukucocwa kwangaphambili kwe-lamination kunye ne-IPA; I-zero-tension lamination kunye nokukhutshwa komoya ngokupheleleyo; iprofayile yeqondo lobushushu eliphuculweyo ngokufudumeza okuthambileyo (<2°C/s); ukuxobuka okubandayo ngaphantsi kwe-50 ° C kwi-angle ye-180 °; ukusetyenzwa kwangoko kwiiyure ezingama-24 kunye nokusetyenziswa kanye kuphela; ukusilela ukuphatha ngokusula IPA kunye nokuhlolwa 40-50x sikhulisi. KwiiPCB ezinamacala amabini, buyisela iteyiphu entsha phambi kokulungiswa kwecala lesibini.