2026-06-25, di 2026
Anti-statik PTFE fabrik de achyv via tu men we: fɔ kɔt doping (miks kɔnduktiv fil dɛm lɛk kabɔn blak insay PTFE ɛmulshɔn, fɔm wan pɔrkolashɔn nɛtwɔk na krichɔ kɔnsɛntreshɔn) ɛn sabstret wev (ɛmbed kɔnduktiv fayba dɛn insay fayv glas klos). Surface resistivity de kontrכl na 105–109 Ω. Di prinsipul: mek wan kɔnduktiv path we de dreyn statik chaj dɛn wantɛm wantɛm, we de mek di hazada akyumyuleshɔn nɔ apin. Grounding na mandatory fɔ mek yu ebul fɔ wok fayn fayn wan.
Rid Mɔ
2026-06-25, di 2026
Tikna insay PTFE emulshɔn de sav 4 impɔtant wok dɛn: sɔspɛns stebilizayshɔn (de mek di dens PTFE patikyula dɛn nɔ sɛtul), shia-tinin bihayvya (ay viskɔsiti we yu rɛst, lɔw ɔnda agiteshɔn fɔ izi kɔtin), penetreshɔn dip kɔntrol (we de rigul rɛsin lod pan fayvglas fabrik), ɛn film yunifɔmiti (de mek i nɔ krak we yu de dray). Kritikal rikwaymɛnt: tikna dɛn fɔ rɔtin kɔmplit wan na ~380°C sintering tɛmpracha, lɛf ziro ash rɛsɛdyu fɔ mek di kɔtin klin ɛn ilɛktrik insuleshɔn.
Rid Mɔ
2026-06-24, di 2026
PTFE ay-tɛmpracha fabrik (PTFE-coated fiberglass) de gi ɛksepshɔnal kemikal rɛsistɛns, we de tinap fɔ kɔnsɛntret asid (inklud akwa regia), strɔng alkali (na rum tɛmpracha), ɔrganik sɔlvɛnt, ɛn ɔksidayzin ɛjɛn. Eksepshɔn: mɔlt alkali mɛtal ɛn ay-tɛmpracha halojen kɔmpawnd dɛn de atak PTFE. di damej we di kכt de pwεl de mek fayv glas de pan haydrofluoric asid εn hot kכnsantreyt alkali. Tεmpratura we pas 260°C de ridyus di rεsistεns. Fכ mכst kεmikכl envayroment, PTFE fabrik de stil hεli stebul εn rilibul.
Rid Mɔ
2026-06-24, di 2026
Waid-tεmpratura-rεnj PTFE tep nid silikon PSA we de mεnten adheshon frכm -70°C to 260°C. Ki disayn ɛlimɛnt dɛn: prayma-ankɔr transishɔn layt (de mek dɛn nɔ delaminɛshɔn), si-ayland maykrostrakchɔ (MQ rɛsin ayland dɛn + polysiloxane kɔntinyu faz), gradient kroslinkin (hay-dɛnsiti insay layt fɔ krip rɛsistɛns, lɔw-dɛnsity ɔta layt fɔ lɔw-temp tak), ɛn ɔt-stabiliz filɛrs (sirium ɔksayd fɔ ɔksidɛshɔn rɛsistɛns). Fεnyl-modifyed siloksan sεgmεnt dεm de sכpres lכw tεmprachכ kristalizεshכn, we de mek i ebul fכ fεksibiliti dכn -100°C.
Rid Mɔ
2026-06-24, di 2026
Aokai PTFE bin debut in ful prodak layn ap na APFE Shanghai 2026 (Booth 6T602, Hall 6). Di prɔdak dɛn we dɛn dɔn sho na fayv glas-riinfɔs PTFE tep, klin PTFE film, anti-statik gred, ɛn ay-tɛmpracha kɔnvayɔr bɛlt – we de kɔba it prɔsesin, PV lamineshɔn, litiɔm bateri, ilɛktroniks, ɛn pak. Di ɛgzibishin de go te Jun 26. Ɔl di prɔdak dɛn de sɔpɔt kɔstɔm spɛsifikɛshɔn dɛn.
Rid Mɔ
2026-06-18, di 2026-06-18
High-strength PTFE high-temperature fabric na wan kɔmpɔzit we gɛt ay-tɛnasiti fayv glas ɛn PTFE kɔtin. Ki aplikeshɔn dɛn span industrial kɔnvɛyshɔn (fud baking, tɛkstayl drying, PCB transpɔt), wɛldin protɛkshɔn (ɔt-sila kɔva, spata shild), demolding ɛn hot prɛs fɔm (rɔba moldin, PV lamination), ilɛktrik insuleshɔn (mota slot layna, kebul wrap), akitɔk mɛmbran (stediɔm ruf, 30+ ia layf), kemikal anti-kɔrɛshɔn (ɛkspɛnshɔn jɔyn, tank layn), aerospace (tɛmal blankit), ɛn spɛshal aplikeshɔn dɛn (lɛsa kɔt, 3D printin).
Rid Mɔ
2026-06-18, di 2026-06-18
Dray na impɔtant step fɔ PTFE ay-tɛmpracha fabrik prodakshɔn. di kכmכn dεfεkt dεm na: krak krak (tu fast drεy, surface skinning), kכt maygrεshכn (patikul dεm de muv to sεf, wik intanεt bon), pinhol/blista (trεp εya כ stim), wayt spat εn chכlk (sכfaynt maygrεshכn כ inkכmplit fכs), yכlכ/kכk (כva hεt כf aditiv dεm), dεlaminεshכn (shrinkage strεs pas adheshon), כrεnj pil (pow levelling), warpage (uneven shrinkage), surface dry but interior wet (skin trap moisture), ɛn tik ed dɛm (kɔfi-ring ifɛkt). Sɔlv dɛn involv kɔntrol drying profayl, prɔpa ventileshɔn, ɛn sabstret prɛtritmɛnt.
Rid Mɔ
2026-06-18, di 2026-06-18
Di kot ɛnd fes strɔkchɔ fɔ PTFE ay-tɛmpracha tep de afɛkt adhesive oozing ɛn edj liftin dairekt wan we dɛn de yuz am. If yu nɔ slit fayn (dɔl bled, angle we nɔ fayn) de mek glu filamɛnt, tan di ed adhesive layt, ɛn i de mek fayv glas bur dɛn kɔmɔt na do – we de mek yu ɔz, wik bond, ɛn lif ɔnda ɔt ɔ tɛnsiɔn. di εnd fεs dεm we nכ rεgulכr (wev, we de kכmכt) de mek di prεshכn distribyushכn nכ ivin, we de drεb adhesive krip we dεn de stכr. di ideal εnd fes na smol, flush, εn damej-fri – i de akt lεk sil we de lכk di adhesive εn mek sכh se ful edj bכnd.
Rid Mɔ
2026-06-17
PTFE emulshɔn impregnashɔn fɔ fayv glas fabrik nid difrɛn ɔksijɛn fɔ ajɔst yunifom kɔtin, strɔng adheshon, ɛn difrɛns-fri sɔfays. Ki aditiv dεm inklud: wetin ejen (ridyus surface tεnshכn, impruv pεnεtreshכn), tikna (kכntrol viskositi εn kכt wet), pH rεgεlεt (stεbyul emulshכn na pH 9-10), silane kכpl ejen (εnhans adheshon to glas), film-fכm εyd (PFA/FEP fכ sintering), fכnshכnal filεr (wear rεsistεns, kכnduktiviti), difכmεr (prεvεnt pinhol), ɛn humectants (we de dray sloslo). Selekshɔn dipen pan sabstret ɛn pefɔmɛns rikwaymɛnt.
Rid Mɔ
2026-06-17
Durin PTFE tep kotin, di sכlvεnt volatilayzεshכn rεt fכ silikon prεshכn-sεnsitiv adhesive na krichכl prכsεs paramita. Tu fast → surface skinning, poor leveling, pinhol (trapped solvent), ɛn krata (kɔndɛnseshɔn ɔ kɔntaminɛnt-induse). Tu slo → sagging, tik edj, ɛn dewet pan low-surface-energy PTFE. Di ideal strateji: slo initial volatilization fɔ lɛvɛl ɛn bɔbul ɛspɛk, dɔn aksɛleret drying fɔ shep. Yuz miks sɔlvɛnt (toluene/xylene + fast-drying) ɛn gradient ɔvin tɛmpracha (lɔ→midul→ay).
Rid Mɔ