Sengoliloeng sena se akaretsa matšoao a mantlha a ts'ebetso bakeng sa tepi ea PTFE ea mocheso o phahameng o sebelisoang ho koahela vacuum, kalafo ea mocheso oa vacuum le libaka tse tšoanang. Litlhoko tsa bohlokoa li fapane haholo le ts'ebeliso ea sepakapaka: ho tsoa mali ho bohlokoa haholo (TML≤1%, CVCM≤0.1%; limaraka tsa sefofane / optical li hloka TML≤0.5%, CVCM≤0.01%); ho hanyetsa mocheso ho tlameha ho netefatsoa bakeng sa bobeli ba PTFE substrate (260 ° C) le lera la sekhomaretsi; PSA ea silicone e hloekisitsoeng ka ho khetheha e hlokahalang ho thibela tšilafalo ea siloxane; matla a ho tšoara mocheso o phahameng a thibela ho qhoqhoa le ho phahamisa bohale; bohloeki ha bo hloke ho tšolloa ha fiber le li-ionic tse fokolang; tepi e khahlanong le static (ka holim'a resistivity 10⁶-10⁹ Ω / sq) e thibela tšenyo ea ESD; khanyetso ea plasma e tlameha ho hlahlojoa bakeng sa lits'ebetso tsa sputtering/PECVD; shrinkage ea mocheso ka tlase ho 2% e netefatsa ho nepahala ha masking.

Sehlooho sena se bapisa mocheso oa kamore le mocheso o phahameng oa sekhomaretsi se nang le khatello ea silicone bakeng sa tepi ea PTFE. Boemo bo phahameng ba mocheso (120-180 ° C) bo etsa marang-rang a teteaneng a kopantsoeng a nang le matla a matla a ho kopanya, a thibela masala a sekhomaretsi ka mor'a ho ebola. E theha litlamo tsa lik'hemik'hale tse nang le lik'hemik'hale tse nang le li-substrates tsa PTFE ka primer co-curing, ho felisa likotsi tsa delamination. Ho hōla ha mocheso o phahameng ho boetse ho tlosa li-volatile tsa limolek'hule tse tlaase pele ho tsoaloa, ho thibela ho phatloha le ho silafala ha oli ea silicone nakong ea ho futhumatsa ha pele.

Tataiso ena e akaretsa khetho ea theipi ea mocheso o phahameng oa PTFE bakeng sa ho bopa ha ente le lits'ebetso tse khahlanong le lithupa. Khetho e thehiloeng mocheso: ≤260 ° C bakeng sa polasetiki e tloaelehileng (tape e tloaelehileng ea silicone PSA, 0.13-0.18mm); 260-300 ° C bakeng sa li-plastiki tsa boenjiniere tse phahameng tsa mocheso joaloka PC, PA66, POM (sekhomaretsi sa silicone se phahameng, 0.18-0.25mm); 300-400 ° C bakeng sa PEEK, LCP, PPS haufi le libapali tse chesang (theipi e khomarelang e hlōleha; sebelisa lesela la PTFE le se nang sekhomaretsi kapa filimi ea PFA). Khetho e thehiloeng ho lintho tse bonahalang: thepa ea tacky e hloka libaka tse phahameng tsa PTFE tse hloekileng; lisebelisoa tse tlatsitsoeng ka khalase / liminerale li hloka tepi e sa sebetseng ea boima ba 0.25mm +; li-additives tse senyang li hloka sekhomaretsi se hanyetsanang le lik'hemik'hale le substrate e teteaneng; static-sensitive applications hloka anti-static black PTFE theipi.

Lesela la fiberglass le koahetsoeng ka PTFE le sebelisoa haholo ts'ebetsong ea rabara bakeng sa ho hanyetsa mocheso, thepa e sa thupeng le khohlano e tlase. Lisebelisoa tsa bohlokoa li kenyelletsa: li-liner tsa ho lokolla bakeng sa ho phunya poleiti / vacuum le ho etsa mabili; mabanta a conveyor a sa thupeng bakeng sa tshilo e butsweng, di-calender le mehala ya ho phodisa; lesela la interleave bakeng sa polokelo ea rabara e felileng; ts'ebetso e khethehileng ea silicone le fluororubber; le literei tsa ontong bakeng sa ho phekoa. Melemo e kenyelletsa ho felisa ho khomarela hlobo, ho fokotsa tšebeliso ea moemeli oa tokollo, ho thibela ho phuthela ha lirolara, le ho etsa bonnete ba hore e theohile hantle.

Thempereichara ea phetoho ea khalase (Tg) ea sekhomaretsi sa silicone se nang le khatello ea maikutlo e ka bang -120 ° C - e tlase haholo ho feta likhomaretsi tsa acrylic. Tg ena e tlase haholo e boloka tepi ea PTFE ea mocheso o phahameng e tenyetseha le ho khomarela esita le ho -70 ° C, e thibela ho phunyeha ha brittle le ho nolofalletsa ho khomarela ka botšepehi lits'ebetsong tsa cryogenic.

Khetho ea pampiri ea tokollo kapa substrate ea filimi le moemeli oa tokollo e ama ka kotloloho botsitso ba polokelo le ts'ebetso ea peeling ea tepi ea mocheso o phahameng oa PTFE. Sehlooho sena se bapisa PET vs. kraft paper substrates le silicone vs. fluorinated release agents, e khothalletsang motsoako o nepahetseng bakeng sa peeling ea zero-residu le ho tšepahala nako e telele.