Nin barokun bɛ kuma cogo min na Teflon fiyɛta (PTFE) kasɛti min bɛ fiɲɛ bila, o ka sigicogo mikroporozɛni bɛ fiɲɛ doncogo ni insulasi ni a tɛ nɔrɔ cogo min na, o bɛ bɛn ɲɔgɔn ma. Core conflict : fiɲɛ doncogo bɛ da wulilenw de wajibiya, ka sɔrɔ insulasi bɛ density de wajibiya ani non-stick bɛ yɔrɔ nɔgɔlenw de wajibiya. Dilancogo balannenw : ka poroze cɛmancɛ hakɛ kɔlɔsi (0,1-2μm, a ka fisa <0,5μm) walasa ka bɔgɔdaga doncogo bali ani ka tiɲɛni tension mara; porosité kɔlɔsili 50-70% (≈60% optimal) ka Gurley 20-100s/100cc sɔrɔ ani dielektriki fanga ≥2kV filimu 0,13mm kama; ka 3D rezo pores structure (τ≈2.5-4) ta min ka tortuosité haute (τ≈2.5-4) walasa ka jibɔ sira tilennenw damatɛmɛ; ka pores structure asymétrique gradient jɔ ni dense surface layer (1-5μm) ye walasa ka non-stick/insulation ani porous kɔnɔna na walasa ka ninakili sɔrɔ; aw bɛ super-oleophobe/hydrophobique surface kɛ furakɛli kɔfɛ ka sɔrɔ a ma pores block.

Nin barokun in bɛ PTFE fini funteniman nafaw jira i n’a fɔ funteni caman filɛri fɛɛrɛw. Fanga jɔnjɔn wɔɔrɔ : Funteni kunbɛncogo ɲuman (260°C bɛ to sen na, a kuncɛ ~300°C), min tɛmɛna PPS (190°C) ani aramid (200°C) kan; Kemisɛnniw ka baarakɛbaliya kojugu asidiw, alkaliw, furajiw ani oksidanw kama, a bɛ se ka jibɔ, a bɛ baara kɛ ka tɛmɛ aramidi ni P84 kan gazi sɔgɔlenw na; Bugun saniya baarakɛcogo ɲuman ni sanfɛla fanga dɔgɔyalenba ye min bɛ kɛ sababu ye ka buguri gato bɔli nɔgɔya ani ka tansiyɔn dɔgɔyali sabati; Filɛtiri kɛcogo ɲumanba ni porozɛw hakɛ ye 0,1-3μm ye min bɛ PM2,5 fɛnɲɛnamafagalanw 99,99% ni kɔ minɛ; Tasuma tɛ ni LOI ye min ka ca ni 95% ye, ni anti-static sugandiliw bɛ sɔrɔ; Masina fanga ka bon ka bɔ fibreglasi barika la, ni PTFE fibre media saniyalen ye min bɛ fɛn caman di ani ka >san 4 baara kɛ. A bɛ tali kɛ kosɛbɛ PPS, aramid, Nomex, P84 ani fibreglasi filɛri fɛɛrɛw la funteni, kemikaliw kɛlɛli, jikuruw kɛlɛli ani saniya baarakɛcogo bɛɛ la.

Nin barokun in bɛ fɛɛrɛ sigilenw di walasa ka nɛgɛ tolenw ni nɔrɔlenw joli bali ni aw bɛ baara kɛ ni PTFE kaseti ye min funteni ka bon walasa ka PCB sanu bolokɔninw lakana SMT lajɛ waati. Jusigi sababu sɛgɛsɛgɛli : tolen bɛ sɔrɔ jɛɲɔgɔnya dɛsɛ fɛ walima fɛnw ni ɲɔgɔn cɛ jiginni fɛ; joli bɛ bɔ viscosity drop ani adhesive overflow fɛ reflow heat kɔrɔ. Fura koloma ye kaseti sugandili ɲuman ye : silikoni PSA min kuntaala surun ≥300°C, min bɛ to senna ≥260°C, a janya bɛɛ lajɛlen ye milimɛtɛrɛ 0,08-0,13 ye ni nɔrɔlan finmanw ye minnu bɛ ɲɔgɔn minɛ kosɛbɛ, ani seereyaw min tɛ joli/tolenw kɛlɛ. Taabolo kɔlɔsili fɛɛrɛ wɔɔrɔ : saniya ka kɔn lamini ɲɛ ni IPA ye ; zeru-tension lamination ni fiɲɛ bɔli dafalen ye; segin-ka-bɔnye funteni hakɛ ɲɛnabɔlen ni funteni nɔgɔman ye (<2°C/s); nɛnɛba bɔli 50°C duguma ni 180° ye; baara kɛli teliya la sanga 24 kɔnɔ ani baara kɛli siɲɛ kelen dɔrɔn; dɛsɛ furakɛli ni IPA wiping ani 40-50x magnifier sɛgɛsɛgɛli ye. Ni PCB fan fila bɛ u la, aw bɛ u falen ni kaseti kura ye sani aw ka kɛ fan filanan baara la.

Nin barokun bɛ laadilikan sigilenw di PTFE fini funtenimanba kan kurukuruw kunbɛnni kan sintering waati. Kurukuruw sababu jɔnjɔn ye funteni dɔgɔyali ye min tɛ kelen ye ani degun min tɛ bɛn ɲɔgɔn ma. Fɛnɲɛnɛmaw bɛ baara kɛcogo dafalen dafa : fɛn fɔlɔw substrat kɔlɔsili (dewaxing/heat setting dafalen walasa ka kɔnɔna degunw ban); impregnation ani drying (coating finman caman, funteni jiginni nɔgɔman, active drive rollers); sintering furnace control (1-3% overfeed for the thermal shrinkage allowance, closed-loop micro-tension control, transverse temperature uniformity within ±5°C, gradient preheating-sintering-cooling curve, fiɲɛ-flotation forow i n’a fɔ fura ɲuman, spreader rollers kurulenw) nɛnɛ ni sigili (nɛnɛ dɔɔni dɔɔni, ka a jɛnsɛnni to a la fo ka se 100°C duguma, ka nɛnɛ dafalen kɛ sani a ka wuli); ɛntɛrinɛti kɔlɔsili ni yeelen sɛgɛsɛgɛli barikama ye ani infirɛri sɛgɛsɛgɛli.

Nin barokun bɛ sɛgɛsɛgɛli kɛ cogo min na cɛncɛn walima finimugu matɛri furakɛli bɛ nɔ bila PTFE fini funteniman sanfɛla jɔcogo la. Yɛlɛma bɛ kɛ yɔrɔ saba la : Mikoroskɔpi cogoya bɛ wuli ka bɔ filɛlikɛlan nɔgɔlen na ka taa gully texture gɛlɛn na ni Ra/Rz hakɛ cayalenba ye, ka 3D masin ankɔri jɔcogo dɔw dilan walasa ka jɛɲɔgɔnya kɛ kɔfɛ. Faratiw bɛ finimugu dafalen na: PTFE layini sɔgɔli, fibreglasi substrat bɛ se ka bɔ kɛnɛ kan (o bɛ kɛ sababu ye ka fɛnw bɔnɛ minnu tɛ nɔrɔ, ji doncogo, ani masin fanga dɔgɔyali), ka fara microcracks ni nɔgɔ bɔli kan.

Nin barokun in bɛ taabolo jɔnjɔn dafalen jira min bɛ kɛ ka fibreglasi finimugu don ni PTFE emulsion ye. Fɛɛrɛ jɔnjɔn wolonwula : 1 A furakɛcogo ka kɔn (dewaxing/desizing) la 350-400°C la walasa ka finimugu bonyafɛnw bɔ; 2 Emulsion formulation ni 40-55% solide hakɛ ani surfactants ye walasa ka jisigicogo ɲɛ; 3 Aw bɛ kɔnɔbara don a la ni dip-squeeze fɛɛrɛ ye walima ni dɔgɔtɔrɔ ka nɛgɛdaga dacogo ye; 4 Aw bɛ a ja 100-150°C la walasa ka ji labɔ dɔɔni dɔɔni ani ka PTFE filimu jalen kɛ; 5 Sintirili 360-390°C la (fo ka se 400°C ma) walasa ka PTFE fɛnɲɛnamafagalanw wuli ka kɛ filimu ye min bɛ to senna; 6 Siginiden caman-jalen-sintering segin-segin siɲɛ 2-4 walasa ka se laɲini janya ma ani resin hakɛ (45-65%); 7 Furakɛli kɔfɛ, koronawirisi furakɛli, dakun tigɛcogo, winding ani jogo sɛgɛsɛgɛli sen bɛ o la. Kɔlɔsili yɔrɔw kolomaw : dewaxing dafalen, emulsion jilama dafalen, jalen dɔɔni dɔɔni, sintering funteni tigitigi, ani coating density basigilen. Fɛn minnu bɛ dilan, olu bɛ baara kɛ ni laminiw ye minnu bɛ kɛ ni nɛgɛ ye, minnu bɛ kɛ ni fɛn caman ye, minnu bɛ kɛ ka fɛnw ta minnu bɛ funteni caman sɔrɔ ani fɛnw ye minnu bɛ kɛ ni fɛn dilanni ye.

Nin barokun in bɛ baara kɛcogo jiralan jɔnjɔnw ɲɛfɔ PTFE funteni caman kasɛti la min bɛ kɛ ni fɛnɲɛnamafagalanw dacogo ye, fɛnɲɛnamafagalan funteni furakɛli ani o ɲɔgɔnna sigidaw la. Fɛn minnu ka kan ka kɛ, olu ni fiɲɛ baarakɛcogo tɛ kelen ye kosɛbɛ: gazi bɔli de nafa ka bon kosɛbɛ (TML≤1%, CVCM≤0,1%; aerospace/optical grades bɛ TML≤0.5%, CVCM≤0,01% de wajibiya); funteni kunbɛncogo ka kan ka sɛgɛsɛgɛ PTFE substrat (260°C) ni nɔrɔlen fila bɛɛ la; silikoni PSA min saniyalen don kɛrɛnkɛrɛnnenya la, min gazi ka dɔgɔn, o de ka kan ka kɛ walasa ka siloksan nɔgɔli bali; funteni minɛ fanga min ka bon, o bɛ creep ni edge lifting bali; saniya tɛ fiɲɛ bɔli wajibiya ani ionw hakɛ dɔgɔyali; kase anti-statique (surface resistivity 106-109 Ω/sq) bɛ ESD tiɲɛni bali; plasma resistance ka kan ka jateminɛ ka ɲɛsin sputtering/PECVD taabolo ma; funteni dɔgɔyali min bɛ 2% duguma, o bɛ masɔrɔcogo ɲuman sabati.

Nin barokun bɛ fɛnɲɛnamafagalanw jira, PTFE fini min funteni ka bon, o bɛ se ka minnu muɲu. Fibreglasi fini min datugulen don ni PTFE ye, o bɛ kemikaliya baarakɛbaliya danfaralen jira, a bɛ se ka fɛnɲɛnamafagalanw bɛɛ lajɛlen kɛlɛ minnu bɛ sɔrɔ baarakɛcogo la, k’a sɔrɔ a ma wuli, ka funu walima ka kemikɛli kɛ. Jago minnu bɛ se ka muɲu, olu ye : alikɔliw (mɛtanɔli, etanɔli, isoporopanɔli), ketɔni (asetɔni, MEK, siklohɛksanɔn), ɛsitɛri (ɛtili asetati, butili asetati), idɔrɔkarɔbɔni (gazi, toluyɛni, sililɛni, hɛkɛsani), hidrɔkarbɔni halojeni (dikuloromɛtan, kulorofɔrimu, karɔbɔni tetarakururi), ɛtiriw (diɛtili etɛri, THF), asidi fɛnɲɛnamaw (asidi asetiki glasial, asidi foromiki), aminiw ni amidiw (triethylamine, DMF), fenɔliw, ani fɛn wɛrɛw i n’a fɔ disulfure de carbone, piridine, tulu silikoni ani frein ji.

Nin barokun in bɛ nɛnɛ hakɛ wajibiyalenw ɲɛfɔ PTFE finimugu sɔgɔli waati la. Sintiri kɔfɛ 380-400°C la, fini ka kan ka tɛmɛ teliya la 310-315°C kristali-sensitive zone fɛ. Nɛnɛ hakɛ min bɛ fɔ, o ye 30-50°C ye miniti kɔnɔ (finimugu finman bɛ se ka se 100-200°C/min ma fiɲɛ nɛnɛ fɛ). Nɛnɛ teliya (quenching) bɛ kristali dɔgɔya (45-50%), o bɛ kɛ sababu ye ka finimugu nɔgɔlenw, gɛlɛnw sɔrɔ minnu ɲɛw bɛ nɔgɔya, u bɛ nɔrɔ kosɛbɛ, a bɛ baara kɛ cogo ɲuman na min tɛ nɔrɔ, ani a bɛ se ka delamination ni cracking kɛlɛ. Nɛnɛ dɔɔni (foro nɛnɛ) bɛ na ni kristali caman ye (60-70%), o bɛ kɛ sababu ye ka finimugu gɛlɛnw, karilenw kɛ minnu ka teli ka dɔgɔya, ka sɔgɔsɔgɔ ani ka fɛn fitininw kari.

Nin barokun bɛ silikoni tansiyɔn-sɛgɛsɛgɛli nɛgɛma min bɛ kɛ PTFE kaseti kama, o kɔgɔli so funteni ni funteni caman na. Funteniba kɔgɔli (120-180°C) bɛ rezow dilan minnu bɛ ɲɔgɔn cɛ, minnu fanga ka bon ni ɲɔgɔn cɛ, o bɛ nɔrɔli tolenw bali u bɔli kɔfɛ. A bɛ kemikɛli jɛɲɔgɔnyaw kɛ ni PTFE substrates ye primer co-curing fɛ, o bɛ delamination faratiw ban. Funteni caman kɔgɔli fana bɛ fɛnɲɛnamafagalanw bɔ minnu ka dɔgɔn sani jiginni ka kɛ, o bɛ bugun ni silikoni tulu nɔgɔli bali funteni fɔlɔ waati.