Sengoliloeng sena se akaretsa matšoao a mantlha a ts'ebetso bakeng sa tepi ea PTFE ea mocheso o phahameng o sebelisoang ho koahela vacuum, kalafo ea mocheso oa vacuum le libaka tse tšoanang. Litlhoko tsa bohlokoa li fapane haholo le ts'ebeliso ea sepakapaka: ho tsoa mali ho bohlokoa haholo (TML≤1%, CVCM≤0.1%; limaraka tsa sefofane / optical li hloka TML≤0.5%, CVCM≤0.01%); ho hanyetsa mocheso ho tlameha ho netefatsoa bakeng sa bobeli ba PTFE substrate (260 ° C) le lera la sekhomaretsi; PSA ea silicone e hloekisitsoeng ka ho khetheha e hlokahalang ho thibela tšilafalo ea siloxane; matla a ho tšoara mocheso o phahameng a thibela ho qhoqhoa le ho phahamisa bohale; bohloeki ha bo hloke ho tsoa ha fiber le li-ionic tse fokolang; tepi e khahlanong le static (ka holim'a resistivity 10⁶-10⁹ Ω / sq) e thibela tšenyo ea ESD; khanyetso ea plasma e tlameha ho hlahlojoa bakeng sa lits'ebetso tsa sputtering/PECVD; shrinkage ea mocheso ka tlase ho 2% e netefatsa ho nepahala ha masking.

Sehlooho sena se bapisa mocheso oa kamore le mocheso o phahameng oa sekhomaretsi se nang le khatello ea silicone bakeng sa tepi ea PTFE. Boemo bo phahameng ba mocheso (120-180 ° C) bo etsa marang-rang a teteaneng a kopantsoeng a nang le matla a matla a ho kopanya, a thibela masala a sekhomaretsi ka mor'a ho ebola. E theha litlamo tsa lik'hemik'hale tse nang le lik'hemik'hale tse nang le PTFE substrates ka primer co-curing, ho felisa likotsi tsa delamination. Ho hōla ha mocheso o phahameng ho boetse ho tlosa li-volatile tsa limolek'hule tse tlaase pele ho tsoaloa, ho thibela ho phatloha le ho silafala ha oli ea silicone nakong ea ho futhumatsa ha pele.

Tataiso ena e akaretsa khetho ea theipi ea mocheso o phahameng oa PTFE bakeng sa ho bopa ente le lits'ebetso tse khahlanong le lithupa. Khetho e thehiloeng mocheso: ≤260 ° C bakeng sa polasetiki e tloaelehileng (tape e tloaelehileng ea silicone PSA, 0.13-0.18mm); 260-300 ° C bakeng sa li-plastiki tsa boenjiniere tse phahameng tsa mocheso joaloka PC, PA66, POM (sekhomaretsi sa silicone se phahameng, 0.18-0.25mm); 300-400 ° C bakeng sa PEEK, LCP, PPS haufi le libapali tse chesang (theipi e khomarelang e hlōleha; sebelisa lesela la PTFE le se nang sekhomaretsi kapa filimi ea PFA). Khetho e thehiloeng ho lintho tse bonahalang: thepa ea tacky e hloka libaka tse phahameng tsa PTFE tse hloekileng; lisebelisoa tse tlatsitsoeng ka khalase / liminerale li hloka tepi e sa sebetseng ea boima ba 0.25mm +; li-additives tse senyang li hloka sekhomaretsi se hanyetsanang le lik'hemik'hale le substrate e teteaneng; static-sensitive applications hloka anti-static black PTFE theipi.

Lesela la fiberglass le koahetsoeng ka PTFE le sebelisoa haholo ts'ebetsong ea rabara bakeng sa ho hanyetsa mocheso, thepa e sa thupeng le khohlano e tlase. Lisebelisoa tsa bohlokoa li kenyelletsa: li-liner tsa ho lokolla bakeng sa ho phunya poleiti / vacuum le ho etsa mabili; mabanta a conveyor a sa thupeng bakeng sa tshilo e butsweng, di-calender le mehala ya ho phodisa; lesela la interleave bakeng sa polokelo ea rabara e felileng; ts'ebetso e khethehileng ea silicone le fluororubber; le literei tsa ontong bakeng sa ho phekoa. Melemo e kenyelletsa ho felisa ho khomarela hlobo, ho fokotsa tšebeliso ea moemeli oa tokollo, ho thibela ho phuthela ha lirolara, le ho etsa bonnete ba hore e thellisoa hantle.

Theipi ea PTFE bakeng sa phala ea lik'hemik'hale / sejana se thibelang ho bola, ho se thupeng, le ts'ireletso e tiisang e hloka karoloana e ts'oanang, tsamaiso ea likhomaretsi le mecha ea litaba ea lik'hemik'hale. Silicone PSA e khothalletsoa 200-260 ° C ka li-acids / alkalis; acrylic PSA e hanela metsoako ea lintho tse hlapollang empa e fokotsa mocheso ho ≤150°C. Bakeng sa HF, ho belisa >80% alkali, kapa chlorine trifluoride, sebelisa lesela la PTFE-feela (ha ho sekhomaretsi sa organic). Bohlokoa: sekhomaretsi ke sehokelo se fokolang, eseng PTFE ka boeona.

Matla a ho ts'oara tepi ea PTFE a ntlafatsoa ka ho roala le ho ntlafatsa ts'ebetso ea ho phekola. Coating: primer layer (0.5-2μm silane primer thibela sekhomaretsi peeling), sekhomaretsi botenya 30-60μm (optimal bakeng sa ho tšoara matla), vacuum defoaming, le 5-10μm filtration. Ho folisa: ho futhumatsa ka mohato (80-100 ° C ho tlosoa ha solvent → 120-140 ° C shape → 150-220 ° C deep crosslinking), post-curing (40-60 ° C bakeng sa 24-48h ho phomola khatello ea kelello), le phetisetso e tlaase ho thibela khatello ea kelello ea ka hare ho substrate shrinkage. The primer ke ea bohlokoa bakeng sa matla a tlase a holim'a PTFE.

Theipi ea mocheso o phahameng oa PTFE e sebetsa e le thepa ea bohlokoa tlhahisong ea semiconductor, eseng ntho e ka sebelisoang ka kakaretso. Lisebelisoa tsa bohlokoa: ts'ireletso ea boemo ba li-wafer (masking ea plasma etching, ts'ireletso ea mokokotlo oa CMP, masking ea CVD / PVD), mekhoa ea ho paka (ho lokisa terata, maske a solder bakeng sa li-PCB), le tlhokomelo ea lisebelisoa (anti-static roller wrapping, ho tšoaea kamore e hloekileng). Litlhoko tse hloekileng ka ho fetisisa: li-halogens tse tlaase (li thibela ho bola ha li-bond), li-siloxane tse tlaase (<500 ppm, li thibela ho thehoa ha likaroloana tse sireletsang), li-ion tse tlaase tsa tšepe (<1 ppm ka 'ngoe), ISO Class 4 cleanroom slitting/packaging, 10⁶-10⁹ Ω TV surface resistivity.

Theipi ea boemo ba bongaka ea PTFE e nang le mocheso o phahameng o kopanya biocompatible PTFE substrate le sekhomaretsi sa silicone se phekotsoeng ka platinum. Lintlha tsa bohlokoa: ISO 10993 e lumellana (ha e na cytotoxicity, sensitization, kapa ho teneha), e mamella sterilization e pheta-phetoang (mouoane / EO / gamma), ho hanyetsa mocheso oa 260 ° C. Mehato ea bohlokoa ea ho itšireletsa: e se ke ea feta 260 ° C (mosi o chefo o ka holimo ho 300 ° C), mahlaseli a gamma a ka 'na a etsa hore a fokotsehe, a netefatse mekhoa ea ho thibela likokoana-hloko,' me a kope litokomane tsa ho lumellana ka botlalo (litlaleho tsa ISO 10993, MSDS, lintlha tsa botsofali). Eseng bakeng sa tšebeliso ea mali e tobileng kapa e kentsoeng ntle le haeba e netefalitsoe ka ho toba.

PTFE theipi reusability e itšetlehile ka lintlha tse 'nè: sebopeho sa sekhomaretsi (high crosslink density, low silicone migration, microphase structure for repositionable tack), substrate anchoring (surface activation + primer ho thibela phetisetso e feletseng ea sekhomaretsi), ho roala ka morao (ho lokolla lesela ho sireletsa sekhomaretsi nakong ea ho phutholoha), le ho tšoara ka nepo (sekhomaretsi se hloekileng, ho qoba sekhomaretsi se nepahetseng). Likhomaretsi tse fetotsoeng tse hlatsuoang ka metsi li ka hlaphoheloa> 90% tack kamora ho hloekisoa.

Theipi ea PTFE ea mocheso o pharaletseng e hloka silicone PSA e bolokang ho khomarela ho tloha -70°C ho ea ho 260°C. Lintlha tse ka sehloohong tsa moralo: primer-anchored transition layer (thibela delamination), sea-island microstructure (MQ resin Islands + polysiloxane continuous phase), gradient crosslinking (high-density inner layer for creep resistance, low-density out layer for low-temp tack), le heat-stabilized fillers (cerium resistance oxide). Phenyl-modified siloxane likarolo li hatella mocheso o tlase oa crystallization, o nolofalletsang ho fetoha ha maemo ka tlase ho -100 ° C.