Nyati sia ƒo nu tso dɔwɔwɔ ƒe dzesi veviwo ŋu na PTFE dzoxɔxɔ gã ƒe tape si wozãna le vacuum coating, vacuum heat treatment kple nɔnɔme mawo tɔgbe me. Nudidi veviwo to vovo kura tso yamenutome zazã gbɔ: ya si dona le emee nye nu vevitɔ kekeake (TML≤1%, CVCM≤0.1%; yamenutome/nukpɔkpɔ ƒe dzesiwo hiã TML≤0.5%, CVCM≤0.01%); ele be woaɖo kpe dzoxɔxɔ ƒe tsitretsitsi dzi na PTFE substrate (260°C) kple adhesive layer siaa; silicone PSA si me ya si mebɔ o si ŋu wokɔ etɔxɛe hiã be woatsɔ axe mɔ ɖe siloxane ƒe ɖiƒoƒo nu; ŋusẽ si léa dzoxɔxɔ gã me xea mɔ na creep kple edge lifting; dzadzɛnyenye mebia be womaɖe ka aɖeke ɖa o eye ionic mesɔ gbɔ ɖe eme o; anti-static tape (anyigba ƒe tsitretsitsi 106-109 Ω/sq) xea mɔ na ESD ƒe gbegblẽ; ele be woada plasma ƒe dɔlélenutsiŋutete kpɔ hena sputtering/PECVD ƒe dɔwɔwɔwo; dzoxɔxɔ ƒe shrinkage si le 2% te kpɔa egbɔ be masking la sɔ pɛpɛpɛ.

Nyati sia tsɔ xɔme ƒe dzoxɔxɔ kple dzoxɔxɔ gã ƒe tsitsi sɔ kple silicone pressure-sensitive adhesive na PTFE tape. Dzoxɔxɔ gã ƒe tsitsi (120-180°C) naa crosslinked networks dense siwo ƒe ŋusẽ sesẽ si ƒoa ƒu, si xea mɔ na adhesive ƒe nugbagbevi siwo susɔ le wo ɖeɖe vɔ megbe. Ewɔa atikewo ƒe seke ƒe kadodowo kple PTFE substrates to primer co-curing dzi, si ɖea delamination ƒe afɔkuwo ɖa. Dzoxɔxɔ gã ƒe tsitsi hã ɖea molecule siwo mebɔ o ƒe dzoxɔxɔ ɖa hafi wotsɔa wo vɛ, si xea mɔ na bubbling kple silicone ami ƒe ɖiƒoƒo le dzoxɔxɔ gbãtɔ me.

Mɔfiame sia ƒo nu tso PTFE dzoxɔxɔ gã tape tiatia na injection molding demolding kple anti-stick dɔwɔwɔwo. Tiatia si wotu ɖe dzoxɔxɔ dzi: ≤260°C na plastik siwo wozãna le xexeame katã (silikon PSA kasɛt si wozãna ɖaa, 0.13-0.18mm); 260-300°C na mɔ̃ɖaŋununya ƒe plastik siwo ƒe dzoxɔxɔ lolo abe PC, PA66, POM (silicone adhesive si ƒe dzoxɔxɔ lolo, 0.18-0.25mm); 300-400°C na PEEK, LCP, PPS si te ɖe duƒula dzodzoewo ŋu (adhesive tape do kpo nu; zã PTFE avɔ si me nulénu mele o alo PFA film). Tiatia si wotu ɖe nusiwo wotsɔ wɔe dzi: nusiwo tacky hiã PTFE dzadzɛ siwo me woɖea asi le ŋutɔ; nusiwo wotsɔ glass/mineral yɔ fũu hiã 0.25mm + tepe si te ŋu dona le wo ŋu vevie; nusiwo wotsɔ kpe ɖe nu ŋu siwo gblẽa nu le ame ŋu biaa atike si te ŋu nɔa te ɖe nulénu nu kple nusi le ʋeʋẽm; static-sensitive dɔwɔwɔwo hiã anti-static yevu PTFE tape.

Wozãa fiberglass avɔ si ŋu wofa PTFE ɖo la geɖe le rababa ƒe dɔwɔwɔ me le esi wòte ŋu nɔa te ɖe dzoxɔxɔ nu, eƒe ŋutete be meléna ɖe nu ŋu o, kple eƒe ʋuʋudedi si mebɔ o ta. Dɔ vevi siwo wozãna dometɔ aɖewoe nye: asiɖeɖe le nusiwo wotsɔ blaa nu ŋu hena plate/vacuum vulcanization kple taya ƒe nɔnɔmewɔwɔ; alidziblanu siwo meléna ɖe nu ŋu o na nutunuwɔƒe siwo le ʋuʋu ɖi, ɣletigbalẽwo, kple fafamɔ̃wo; avɔ si wotsɔ dea nu wo nɔewo me hena rababa dzraɖoƒe si wowɔ afã kple afã; silicone kple fluoroubber zazã etɔxɛe; kple dzodoƒe ƒe agbawo hena wo dada vɔ megbe. Viɖe siwo le eme dometɔ aɖewoe nye be woaɖe aŋɔ ƒe ƒoƒo ɖa, woaɖe atike si ɖea nu le eme zazã dzi akpɔtɔ, woaxe mɔ ɖe agbalẽ xatsaxatsa nu, eye woakpɔ egbɔ be woɖe aŋɔa ɖa nyuie.

PTFE tape na atike pɔmpi / nugo anti-corrosion, non-stick, kple nutrenu takpɔkpɔ bia be sɔ substrate, adhesive ɖoɖo, kple atike media. Wokafu silicone PSA na dzoxɔxɔ 200-260°C kple acid/alkali; acrylic PSA tsi tre ɖe organic solvents ŋu gake eɖoa seɖoƒe na dzoxɔxɔ be wòaɖo ≤150°C. Le HF gome la, ne woɖa >80% alkali, alo chlorine trifluoride la, zã PTFE-ko ƒe nutrenu (menye organic adhesive o). Vevietɔ: nusi wotsɔna léa nu ɖe ​​nu ŋue nye kadodo si gbɔdzɔ wu, ke menye PTFE ŋutɔ o.

PTFE tape léle ŋusẽ nyona ɖe edzi to nutsyɔtsyɔ kple dɔyɔyɔ ɖoɖo optimization. Nusi wotsɔ blaa nu: primer layer (0.5-2μm silane primer xea mɔ na adhesive ƒe ʋuʋu), adhesive ƒe titrime 30-60μm (enyo wu na ŋusẽ léle), vacuum defoaming, kple 5-10μm filtration. Dɔyɔyɔ: dzoxɔxɔ afɔɖeɖe ɖesiaɖe (80-100°C solvent ɖeɖeɖa → 120-140°C ƒe nɔnɔme → 150-220°C goglo crosslinking), le gbedada megbe (40-60°C hena 24-48h be woaɖe nuteɖeamedzi dzi akpɔtɔ), kple tsɔtsɔ yi teƒe bubu si me teteɖeanyi boo aɖeke mele o be woaxe mɔ ɖe ememe nuteɖeamedzi tso substrate ƒe ɖeɖeɖa nu. Primer la le vevie na PTFE ƒe anyigbadziŋusẽ si bɔbɔ.

PTFE ƒe dzoxɔxɔ gã ƒe kasɛt nyea nu vevi aɖe le semiconductor wɔwɔ me, ke menye nusi wozãna na nusianu o. Dɔwɔwɔ veviwo: wafer-level takpɔkpɔ (plasma etching masking, CMP megbe takpɔkpɔ, CVD / PVD masking), nubabla ƒe ɖoɖowo (wire bonding fixation, soldering mask na PCBs), kple dɔwɔnuwo dzadzraɖo (anti-static roller wrapping, cleanroom dzesi). Nudidi siwo le dzadzɛ ŋutɔ: halogens siwo mesɔ gbɔ o (xea mɔ na bond pad ƒe xɔxlɔ̃), siloxanes siwo mebɔ o (<500 ppm, xea mɔ na insulating particle formation), ga ions siwo mebɔ o (<1 ppm ɖesiaɖe), ISO Class 4 cleanroom slitting/packaging, 106-109 Ω surface resistivity, kple TVOC ƒe dodo si bɔbɔ.

Atikewɔwɔ-grade PTFE dzoxɔxɔ gã tape ƒoa biocompatible PTFE substrate kple platinum-cured silicone adhesive. Nu vevi siwo le eme: Ewɔ ɖeka kple ISO 10993 (lãmenugbagbeviwo ƒe aɖi, seselelãme, alo dzikudodo aɖeke mele eme o), ete ŋu nɔa te ɖe vidzidzi enuenu (steam/EO/gamma), dzoxɔxɔ si te ŋu nɔa te ɖe dzoxɔxɔ si nye 260°C nu. Kpɔ nyuie: mègawu 260°C (dzudzɔ si me aɖi le si wu 300°C), gamma keklẽ ate ŋu ana wòagbã, aɖo kpe vidzidzi ƒe mɔnuwo dzi, eye nàbia be woaŋlɔ sedziwɔwɔ ŋuti nuŋlɔɖi blibo (ISO 10993 ƒe nyatakakawo, MSDS, tsitsi ŋuti nyatakakawo). Menye na ʋudodo tẽ alo nusi wotsɔ dea lãme na ame zazã o negbe ɖe woda asi ɖe edzi koŋ hafi.

PTFE tape gbugbɔgazã nɔ te ɖe nu ene dzi: adhesive ƒe wɔwɔme (crosslink density si lolo, silicone ƒe ʋuʋu si bɔbɔ, microphase structure for repositionable tack), substrate anchoring (anyigba dzi dɔwɔwɔ + primer be woaxe mɔ ɖe adhesive ƒe asitɔtrɔ blibo nu), megbedede (ɖe asi le ƒuƒoƒo ŋu be wòakpɔ adhesive ta le unwinding me), kple eŋudɔwɔwɔ nyuie (adhesive ƒe anyigba dzadzɛ, peeling mɔnu nyuitɔ, ƒo asa na dzoxɔxɔ si gbɔ eme). Atike siwo ŋu wotrɔ asi le siwo woate ŋu aklɔ kple tsi ate ŋu axɔ >90% ƒe tack le wo ŋu kɔklɔ vɔ megbe.

PTFE kasɛt si ƒe dzoxɔxɔ keke ta hiã silicone PSA si léa nuléle ɖe te tso -70°C va ɖo 260°C. Nu vevi siwo le aɖaŋuwɔwɔ me: primer-anchored transition layer (xea mɔ na delamination), atsiaƒu-ƒukpo microstructure (MQ resin ƒukpowo + polysiloxane continuous phase), gradient crosslinking (high-density ememe ƒuƒoƒo na creep tsitretsitsi, low-density gota ƒuƒoƒo na low-temp tack), kple dzoxɔxɔ-si li ke fillers (cerium oxide na oxidation tsitretsitsi). Siloxane ƒe akpa siwo ŋu wotrɔ asi le kple phenyl tea dzoxɔxɔ si mebɔ o ƒe kristalowɔwɔ ɖe to, si wɔnɛ be woate ŋu atrɔ ɖe nɔnɔmewo ŋu le -100°C te.