Lesi sihloko sihlanganisa izinkomba zokusebenza ezibalulekile ze-PTFE itheyiphu yokushisa ephezulu esetshenziswa ekufakweni kwe-vacuum, ukwelashwa kokushisa kwe-vacuum nezimo ezifanayo. Izidingo ezibalulekile zihluke kakhulu ekusetshenzisweni komkhathi: ukukhipha umoya kubaluleke kakhulu (TML≤1%, CVCM≤0.1%; amamaki e-aerospace/optical adinga i-TML≤0.5%, i-CVCM≤0.01%); ukumelana nezinga lokushisa kufanele kuqinisekiswe kukho kokubili i-PTFE substrate (260°C) kanye nongqimba olunamathelayo; I-PSA ye-silicone ehlanjululwe ngokukhethekile iyadingeka ukuvimbela ukungcoliswa kwe-siloxane; amandla okubamba izinga lokushisa eliphezulu avimbela ukukhasa nokuphakamisa unqenqema; ukuhlanzeka akudingi ukuchithwa kwe-fiber kanye nokuqukethwe kwe-ionic ephansi; i-anti-static tape (i-surface resistivity 10⁶-10⁹ Ω/sq) ivimbela ukulimala kwe-ESD; ukumelana kwe-plasma kufanele kuhlolwe izinqubo ze-sputtering/PECVD; ukuncipha okushisayo okungaphansi kuka-2% kuqinisekisa ukunemba kwemaski.

Lesi sihloko siqhathanisa izinga lokushisa legumbi nokuvuthwa kwezinga lokushisa eliphezulu kwe-adhesive ezwela ukucindezela kwe-silicone ye-PTFE tape. Ukuvuthwa kwezinga lokushisa eliphezulu (120-180°C) kudala amanethiwekhi aminyene axhumene anamandla okuhlangana aqinile, okuvimbela insalela enamathelayo ngemva kokuxebuka. Yakha amabhondi okunamathisela amakhemikhali anezingxenye ezingaphansi ze-PTFE ngokusebenzisa i-primer co-curing, eqeda ubungozi be-delamination. Ukuvuthwa kwezinga lokushisa eliphezulu futhi kususa ukuguquguquka kwamangqamuzana aphansi ngaphambi kokulethwa, kuvimbela ukubhamuza nokungcoliswa kukawoyela we-silicone ngesikhathi sokushisisa kokuqala.

Lo mhlahlandlela uhlanganisa ukukhetha kwetheyiphu ye-PTFE yokushisa ephezulu yokubumba umjovo kanye nezinhlelo zokusebenza zokulwa nezinti. Ukukhetha okusekelwe emazingeni okushisa: ≤260 ° C kumapulasitiki ajwayelekile (i-tape ejwayelekile ye-silicone ye-PSA, 0.13-0.18mm); I-260-300 ° C yepulasitiki yobunjiniyela bezinga eliphezulu lokushisa njenge-PC, i-PA66, i-POM (i-adhesive ye-silicone yezinga eliphezulu, i-0.18-0.25mm); 300-400°C ye-PEEK, LCP, PPS eduze nabagijimi abashisayo (itheyiphu yokunamathela ihluleka; sebenzisa indwangu ye-PTFE enganamatheli noma ifilimu ye-PFA). Ukukhetha okusekelwe ezintweni ezibonakalayo: izinto ezicashile zidinga ukukhishwa okuphezulu okuhlanzekile kwe-PTFE; izinto ezigcwele ingilazi/amaminerali zidinga itheyiphu engagugi engu-0.25mm+; izithasiselo ezonakalisayo zidinga ingcina ekwazi ukumelana namakhemikhali kanye ne-substrate eminyene; izinhlelo zokusebenza ezizwela i-static zidinga itheyiphu ye-PTFE ephikisana ne-static.

Indwangu ye-fiberglass ehlanganiswe ne-PTFE isetshenziswa kakhulu ekucubunguleni irabha ukumelana nokushisa, impahla enganamathele, nokungqubuzana okuphansi. Izicelo ezibalulekile zifaka: amalayini okukhulula amapuleti/i-vacuum vulcanization kanye nokubumba amathayi; amabhande okuthutha angagxili ezigayweni ezivulekile, amakhalenda, nemigqa yokupholisa; indwangu ye-interleave yokugcina i-rubber ephelile; ukuphathwa okukhethekile kwe-silicone ne-fluororubber; kanye namathreyi ehhavini ukuze kulungiswe emva kokwelashwa. Izinzuzo zihlanganisa ukuqeda ukunamathela kwesikhunta, ukunciphisa ukusetshenziswa kwe-ejenti yokukhululwa, ukuvimbela ukugoqwa kwama-roller, nokuqinisekisa ukuboliswa okushelelayo.

Itheyiphu ye-PTFE yepayipi lamakhemikhali/isitsha sokunqanda ukugqwala, ukungagxili, nokuvikelwa kokuvala kudinga i-substrate ehambisanayo, isistimu yokunamathela, kanye nemidiya yamakhemikhali. I-Silicone PSA inconywa ku-200-260 ° C ngama-acids / alkali; I-acrylic PSA imelana nezinyibilikisi eziphilayo kodwa ikhawulela izinga lokushisa libe ngu-≤150°C. Ku-HF, ukubilisa >80% alkali, noma i-chlorine trifluoride, sebenzisa i-PTFE-only lining (akukho okunamathelayo okuphilayo). Okubalulekile: i-adhesive iyisixhumanisi esibuthakathaka, hhayi i-PTFE ngokwayo.

Amandla okubamba itheyiphu ye-PTFE athuthukiswa ngokugcotshwa kanye nokwenza ngcono inqubo yokwelapha. I-Coating: ungqimba lwe-primer (0.5-2μm silane primer ivimbela ukuxebuka kwe-adhesive), ukujiya kwe-adhesive 30-60μm (okulungele ukubamba amandla), i-vacuum defoaming, kanye nokuhlunga okungu-5-10μm. Ukwelapha: Ukushisa okuhamba kancane (80-100°C ukususwa kwe-solvent → 120-140°C shape → 150-220°C deep crosslinking), post-curing (40-60°C for 24-48h ukuze uphumuze ingcindezi), kanye nokudluliswa kwe-tension ephansi ukuvimbela ukucindezeleka kwangaphakathi ekuncipheni kwe-substrate. I-primer ibalulekile kumandla aphansi we-PTFE.

Itheyiphu ye-PTFE yokushisa okuphezulu isebenza njengento ebalulekile ekwenziweni kwe-semiconductor, hhayi into evamile esebenzisekayo. Izinhlelo zokusebenza ezibalulekile: ukuvikelwa kweleveli ye-wafer (i-plasma etching masking, ukuvikelwa kwe-CMP ngemuva, ukufihla i-CVD/PVD), izinqubo zokupakisha (ukulungiswa kwe-wire bonding, imaski e-soldering yama-PCB), nokugcinwa kwemishini (i-anti-static roller wrapping, ukumakwa kwegumbi lokuhlanza). Izidingo ezihlanzeke kakhulu: ama-halogen aphansi (avimbela ukugqwala kwephedi yebhondi), ama-siloxane aphansi (<500 ppm, avimbela ukwakheka kwezinhlayiyana ezivikelayo), ama-ion ensimbi aphansi (<1 ppm ngayinye), ukuhlukaniswa/ukupakisha kwegumbi le-ISO Class 4, 10⁶-10⁹ Ω ukumelana ne-TV ebusweni obuphansi, nokumelana ne-TV okuphansi.

Itheyiphu yokushisa ephezulu ye-PTFE yezinga lezokwelapha ihlanganisa i-biocompatible PTFE substrate ne-adhesive abicah elashwe ngeplatinamu. Izici ezibalulekile: I-ISO 10993 iyahambisana (ayikho i-cytotoxicity, ukuzwela, noma ukucasuka), imelana nokuvala inzalo okuphindaphindiwe (umusi/EO/gamma), ukumelana nokushisa okungu-260°C. Izinyathelo zokuqapha ezibucayi: ungeqi ku-260°C (intuthu enobuthi engaphezu kuka-300°C), i-gamma irradiation ingase ibangele i-embrittlement, iqinisekise izindlela zokuvala inzalo, futhi icele imibhalo yokuthobela ngokugcwele (imibiko ye-ISO 10993, i-MSDS, idatha yokuguga). Hhayi okwegazi eliqondile noma ukusetshenziswa kokufakelwa ngaphandle kokuthi kuqinisekiswe ngokuqondile.

Ukusebenziseka kabusha kwetheyiphu ye-PTFE kuncike ezicini ezine: ukwakheka kokunamathelayo (ukuminyana okuphezulu kwe-crosslink, ukufuduka kwe-silicone ephansi, isakhiwo se-microphase se-tack ekwazi ukubekeka kabusha), i-substrate anchoring (ukwenza kusebenze kobuso + i-primer ukuvimbela ukudluliswa okunamathelayo okugcwele), ukunamathela okungemuva (ukukhulula ungqimba ukuze kuvikelwe okunamathelayo ngesikhathi sokuqaqa), nokuphatha okufanele (indlela yokunamathisela ecwebileyo, indawo yokunamathisela ecwebileyo, ukugwema okulungile). Izinamatheliso eziguquliwe eziwasheka ngamanzi zingalulama > 90% itheki ngemuva kokuhlanza.

Itheyiphu ye-PTFE yobubanzi obubanzi bezinga lokushisa idinga i-silicone PSA egcina ukunamathela ukusuka -70°C kuya ku-260°C. Izakhi eziyinhloko zokuklama: ungqimba lwenguquko olunama-primer-anchored (lugwema i-delamination), i-sea-island microstructure (i-MQ resin Islands + i-polysiloxane isigaba esiqhubekayo), i-gradient crosslinking (ungqimba olungaphakathi olunomthamo omkhulu wokumelana nokukhasa, ungqimba lwangaphandle olunobukhulu obuphansi bokudonswa kwezinga lokushisa eliphansi), kanye nezigcwali ezizinzile ze-oxid oxide (i-oxid oxide). Amasegimenti e-phenyl-modified siloxane acindezela i-crystallization yezinga lokushisa eliphansi, evumela ukuguquguquka okungaphansi -100°C.