Semiconductor siamnaah chuan contamination chu parts per million-in an teh a, particle size chu micron-ah an teh bawk. Stray ion pakhat emaw, trace volatile organic compound emaw, microscopic particle emaw hian wafer batch pum pui a scrap thei a – dollar maktaduai za tam tak a seng a ni.
PTFE high-temperature tape , a lumna do theihna, chemical inertness, non-stick surface, leh electrical property te hian he boruak ah hian hmun pawimawh tak a chang a ni. Mahse PTFE tape eng pawh hian a ti thei lo. Semiconductor-grade tape-te hian general industrial tape-te aia sang zawk, ultra-high cleanliness standard a tlin a ngai a ni.
Aokai PTFE hian PTFE tape hi semiconductor hmanna atan bik a siam a. He kaihhruaina hian hmanna hmun pawimawh pathum – wafer-level processing, packaging leh testing, leh hmanrua enkawl dan – leh faina lama thil tul khauh tak tak, pakhat zel tana hman tur a huam a ni.
Core Application Scenarios – Component hlu tak tak humhalh
1. Wafer-level process hmanga venhimna
Wafer siam lai hian tape hi thil man to tak takte tan chuan temporary protective layer angin a thawk a ni.
Indawtdan
Tape Hnathawh dan
Thil mamawh pawimawh tak
Plasma tihfai & etching tihfai
Process ni lo hmunte chu mask la, wafer kilte chu ion bombardment laka humhim rawh
Outgas emaw, residue emaw a hnutchhiah tur a ni lo; plasma boruak a tuar thei
Thin-film deposition (CVD/PVD) hmanga siam chhuah a ni.
Coating ngai lo region-ah block rawh
Seamless adhesion hmangin deposition gas a luh loh nan
Chemical mechanical planarization (CMP) hmanga siam chhuah a ni.
Wafer hnunglam chu slurry leh abrasive debris atanga shield tur a ni
Acid chak tak tak, alkali leh oxidizing agents te dodal rawh
2. Packaging leh test dan tur
Lead frame / substrate fixation: Wire bonding, die attach, leh plastic encapsulation neih laiin heat-resistant positioning – temperature sang takah components te chu a vawng tlat thin.
Wave soldering & reflow soldering atana masking: PCB-a rangkachak finger leh contact point te chu high-temperature soldering process-a solder bawlhhlawh lakah a venghim.
Anti-static roller wrapping: Clads transport rollers chu temperature sang tak do thei, non-stick, leh static-dissipative contact surface pe turin a siam a – wafer chhiatna chu friction leh static discharge atanga a veng thei a ni.
Cleanroom temporary marking & maintenance: Labeling, cable fixing hun eng emaw chen atan, leh bawlhhlawh paih loha siamthatna tenau te tan.
Ultra-High Faina mamawh – Inrem theih loh Standard
Hengte hi semiconductor-grade PTFE tape leh general-purpose tape thliar hrangtu standard te an ni. Dan zawm loh chuan full batch scrapping a thlen thei. Aokai PTFE hian kan semiconductor-grade tape te tan heng parameter zawng zawng hi a validate vek a ni.
1. Raw material thianghlim leh outgassing tlem
Thil mamawh a ni
Engvangin Nge A Pawimawh
Typical Limit a ni
Total halogen awm zat tlem (halogen tel lo duh zawk) .
Halogens hian aluminum bond pad leh chip-a copper interconnect te a tichhe thin
<900 ppm (halogen tel lo: Cl/Br tan <50 ppm ve ve)
Siloxane awm zat khauh taka control
Siloxanes te hi khaw lum hnuaiah an volatilize a, insulating particle an siam a, chu chuan bonding failure leh electrical contact tha lo a thlen thin
A tlangpuiin <500 ppm emaw, hriat theih loh emaw
TVOC emission a tlem hle
Volatile organics te hian optical components te chu an fog a, wafer surface ah an condense thin
<50 μg/g (process hrang hrangah a danglam) .
Aokai PTFE note: Kan semiconductor-grade PTFE tape te hi high-purity PTFE leh silicone PSA hmanga siam a ni a, chu chuan typical processing temperature (260°C thleng)-a outgassing a tihtlem theih nan.
2. Particulate leh ionic contamination control
Slitting leh packaging: -ah tihfel tur a ni . ISO Class 4 (or a aia sang) cleanroom Tape atanga particle chhuak tlem zawk nan
Ultra-low metal ion content: Alkali metal sodium (Na+) leh potassium (K+) te hian semiconductor electrical characteristic a tidanglam thin. Single metal ion level hi a tlangpuiin <1 ppm chauh a ni.
Engvangin nge: Chip nalh tak tak tichhe thei instantaneous high-voltage electrostatic discharge a veng
4. Chemical leh dimensional stability
Chemical resistance: Acid chak tak (hydrofluoric acid, nitric acid), alkalis chak tak (developer solutions), leh organic solvent (acetone, isopropyl alcohol) te a tuar thei – semiconductor wet processing-a hman tlanglawn tak.
Dimensional stability: Masking misalignment leh adhesive residue tihbo nan temperature sang leh hniam inthlak danglam hnuaia thermal shrinkage tlem ber. Thickness tolerance zawng zawng chu ±5% emaw ±0.01 mm chhungah control a ni.
Thupui – Semiconductor-Grade PTFE Tape thlan dan enfiahna
Thil mamawh a ni
A sawifiahna
Validation tih dan tur
Cleanroom siam chhuah a ni
Slitting/packaging atan ISO Class 4 aia sang a ni
Particle count certification pek a ni
Halogen awm zat
<900 ppm (halogen tel lo duh zawk) .
Ion chromatography (IC) hmanga tih a ni.
Siloxane awm zat
<500 ppm (a nih loh leh hriat theih loh) .
GC-MS hmanga tih a ni
TVOC atanga emission chhuak te
260°C ah <50 μg/g a ni
Headspace GC-MS hmanga siam a ni
Metal ion te pawh a awm
<1 ppm ve ve (Na+, K+, etc.) a ni.
ICP-MS hmanga tih a ni
Surface resistivity a awm thei
106 – 109 Ω a ni
ASTM D257 a ni
Adhesive awm chhun
Peeling hnuah pawh engmah a awm lo
Mit hmuh theiha enfiah, tape test
Chemical laka inven theihna
HF, HNO3, NaOH, IPA, acetone te chu pass rawh
Immersion test a ni
Thickness tolerance a ni
±5% emaw ±0.01 mm emaw a ni
Micrometer hmanga tehna a ni
Aokai PTFE hian kan semiconductor-grade PTFE tape-te tan documentation kimchang a pe a, chutah chuan cleanroom certification, halogens tan ion chromatography (IC) report, metal ion tan ICP-MS, leh outgassing atan GC-MS te a tel a ni. Datasheet kimchang zawk hmuh theih nan i process mamawh te min rawn biak theih reng e.
Professionalism leh integrity kan vawng nung a, partner zawng zawngte tana all-round industrial solutions leh ngaihtuahna senga customer service pek kan tum tlat!
