Eli nqaku lichaza ipateni yotshintsho kumandla okubambisana kwe-PTFE yobushushu obuphezulu betape yokunamathela emva kokuguga okuphezulu. Ipatheni yezigaba ezintathu: I-post-curing rise up (i-high-temperature exposure ekuqaleni kwe-200-260 ° C, amaqela asebenzayo aseleyo aqhubeka e-crosslink, ukubambisana kwanda kakhulu); Inqanaba elizinzileyo lolungelelwaniso (iindlela ze-crosslinking ezigqityiweyo, ubumbano luhlala luzinzile ixesha elide); Ukuthotywa kunye nenqanaba lokuhla (ixesha eligqithisileyo / ubushushu bubangela ukuthotywa kwekhonkco eliphambili, ukuhambelana kuncipha, i-adhesive iyathamba kwaye ibe tacky). Iingcambu ezibangela ukusilela okubambeneyo (ukukrazuka kwangaphakathi kushiya intsalela) kunye nokucudisa ngaphandle (ukuhamba okubandayo okuvela emaphethelweni ngenxa yokuncipha kwemodyuli) ziyahlalutywa.

Eli nqaku lithelekisa ubushushu begumbi kunye nokuvuthwa okuphezulu kwe-silicone ye-adhesive-sensitive adhesive for PTFE tape. Ukuvuthwa kobushushu obuphezulu (i-120-180 ° C) kudala uthungelwano oluxineneyo olunqamlezileyo olunamandla abambeneyo aqinileyo, lukhusela intsalela encamathelayo emva kokuxobuka. Yenza iikhemikhali ze-anchoring bonds kunye ne-PTFE substrates ngokusebenzisa i-primer co-curing, ukuphelisa umngcipheko we-delamination. Ukuvuthwa okuphezulu kweqondo lokushisa kwakhona kususa i-volatiles ephantsi ye-molecular ngaphambi kokunikezelwa, ukuthintela ukugquma kunye nokungcoliswa kweoli ye-silicone ngexesha lokufudumeza kokuqala.