He thuziak hian PTFE high-temperature tape adhesive layer-a high-temperature aging hnua cohesive strength inthlak danglamna pattern a sawi a. Three-stage pattern: Post-curing rising stage (200-260°C-a temperature sang taka exposure hmasa ber, residual reactive group-te crosslinking chhunzawm zel, cohesion nasa taka pung) Stable equilibrium stage (crosslinking hian zawhfel a hnaih a, hun rei tak chhung chu cohesion chu a nghet reng a); Degradation leh decline stage (hun/temperature tam lutuk hian main chain a tichhia a, cohesion a tlahniam a, adhesive a nem a, a tacky bawk). Cohesive failure (internal tearing leaving residue) leh squeeze-out (modulus tlahniam avanga edge atanga cold flow) awm chhan bulpui te chu an zirchiang a.

He thuziak hian PTFE tape atana silicone pressure-sensitive adhesive room-temperature leh high-temperature maturation a khaikhin a ni. High-temperature maturation (120-180°C) hian dense crosslinked networks a siam a, cohesive strength chak tak a nei a, chu chuan peeling hnua adhesive residue a veng thei a ni. Primer co-curing hmangin PTFE substrate te nen chemical anchoring bonds a siam a, delamination risk a ti bo a ni. High-temperature maturation hian delivery hmain low-molecular volatiles a paih chhuak bawk a, heating hmasa berah bubbling leh silicone oil contamination a veng thei bawk.