2026-07-15 na ɔkyerɛwee
Saa asɛm yi kyerɛkyerɛ nsakrae a ɛba wɔ ahoɔden a ɛka bom mu wɔ PTFE a ɛyɛ hyew kɛse teyp adhesive layer mu wɔ ɔhyew a ɛkɔ soro onyin akyi no mu. Nhwɛso a ɛwɔ afã abiɛsa: Post-curing rising stage (mfiase no ɔhyew a ɛkorɔn a wɔde da adi wɔ 200-260°C, residual reactive akuw kɔ so crosslinking, cohesion kɔ soro kɛse); Stable equilibrium stage (crosslinking bɛn wie, biakoyɛ kɔ so yɛ stable bere tenten); Degradation ne decline stage (bere/ɔhyew a ɛboro so ma main chain degradation, cohesion so tew, adhesive softens na ɛbɛyɛ tacky). Wɔyɛ ntini a ɛde cohesive huammɔdi (mfinimfini tetew gyaw nkae) ne squeeze-out (nwini a ɛsen fi anoano esiane modulus a ɛso atew nti) mu nhwehwɛmu.
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2026-07-08 na ɔkyerɛwee
Saa asɛm yi de dan mu hyew ne ɔhyew a ɛkorɔn nyin a silicone nhyɛso-te nka adhesive ma PTFE tape toto ho. Ɔhyew a ɛkɔ soro a ɛnyin (120-180°C) ma nhama a ɛyɛ den a ɛwɔ crosslinked a ahoɔden a ɛyɛ den a ɛka bom yɛ adwuma, na esiw nkae a ɛbata ho bere a wɔapete awie no ano. Ɛnam primer co-curing so na ɛyɛ nnuru a ɛde anchoring bonds ne PTFE substrates, na eyi delamination asiane ahorow fi hɔ. Ɔhyew a ɛkɔ soro a ɛma ɛyɛ kɛse nso yi nneɛma a ɛyɛ hyew a ɛwɔ molecule a ɛba fam no fi hɔ ansa na wɔde ama, na esiw bubbling ne silicone ngo a ɛde efĩ ba bere a edi kan a wɔde hyew no no ano.
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