This article describes the pattern of change in cohesive strength of PTFE high-temperature tape adhesive layer after high-temperature aging. Three-stage pattern: Post-curing rising stage (early high-temperature exposure at 200-260°C, residual reactive groups continue crosslinking, cohesion significantly increases); Stable equilibrium stage (crosslinking approaches completion, cohesion remains stable over long periods); Degradation and decline stage (excessive time/temperature causes main chain degradation, cohesion decreases, adhesive softens and becomes tacky). Root causes of cohesive failure (internal tearing leaving residue) and squeeze-out (cold flow from edges due to decreased modulus) are analyzed.

This article compares room-temperature and high-temperature maturation of silicone pressure-sensitive adhesive for PTFE tape. High-temperature maturation (120-180°C) creates dense crosslinked networks with strong cohesive strength, preventing adhesive residue after peeling. It forms chemical anchoring bonds with PTFE substrates via primer co-curing, eliminating delamination risks. High-temperature maturation also removes low-molecular volatiles before delivery, preventing bubbling and silicone oil contamination during first heating.