Cov qauv ntawm kev hloov hauv lub zog cohesive ntawm cov nplaum txheej ntawm Teflon high-temperature daim kab xev tom qab high-temperature aging.

I.PatternofChangeinAdhesiveLayerCohesionUnderHigh-TemperatureAging

Post-curingrisingstage: Intheearlystageofhigh-temperature exposure(eg,200–260°C), residualreactivegroupscontinuetocross-link, leadingtoasignificantincreaseincohesion.Theadhesivelayerbecomestougher,anditsresistancetoadhesivesqueeze-out.

Stableequilibriumstage: Cross-linkingapproachescompletion, andcohesionremainsstableoveralongperiod.Atthisstage,thetapeexhibitsoptimalperformanceandcanwithstandcontinuousoperationatitsdesigntemperature.

Degradationanddeclinestage: Underexcessivetimeortemperature,themainchainundergoesdegradation, ua rau cohesiontodecreeasecontinuously.Theadhesivelayer softensandbecomestacky, ua rau nws muaj feem cuam tshuam rau cohesivefailureandsqueeze-tawm.

II.RootCausesofCohesiveFailureandAdhesiveSqueeze-out

Rootcauseofcohesivefailure: Thaumthecohesivestrengthoftheadhesivelayerislowerthantheinterfacialadhesionstrength, internaltearingoccurs,leavingadhesiveresidue.Qhov nostems los ntawm tsis txaus cohesionorhigh-temperaturedegradation.

Rootcauseofsqueeze-tawm: Atelevatedtemperatures, themodulusdecreases, andtheadhesivelayer undergoescoldflow,beingextruded fromtheedgesbythermalstress.Theunderlyingcausesareinsufficientcross-linkingdensityorexcessivemolecularchainmobility.

Kev sib raug zoo ntawm ob peb: Ntev-ntev degradationexacerbatesbothissuessimultaneously; insufficientcross-linkingdirectlyleadstosqueeze-outintheearlystage.

III.PreventionThroughAdhesiveFormulationandProcess

Formulationdesign: Usehigh-phenylsilicone, kev ua hauj lwm-kho-kho systemswithprecisecross-linkingcontrol, balanceMQresinratios, addreinformingfillers,andeliminatelow-molecular-weightplasticizers.

Coatingandcuring: Ua kom zoo tom qab-kho kho kho kom tshem tawm-molecular-yuag cov khoom thiab tiv thaiv kom tsis txhob nyem-tawm lub sijhawm ua kom pom tseeb.

Adhesivelayerstructure: Theadhesivethickness yuav tsum tau keptthin (≤ 25μm), thiab 0.5-1mmadhesive-freesafetymargin yuav tsum tau muab pov thawj ntawm cov txheej txheem ntawm lub cev thaiv kev sib tsoo-tawm.

IV.PreventionThrough SubstrateandOperatingConditions

Substrateanchoring: PTFEfilmrequiresetchingorplasmatreatment, combined withaprimertomatchinterfacialandcohesivestrengths, tiv thaiv ntau tshaj kev sib tw uas tuaj yeem ua rau tsis zoo.

Temperaturecontrol: Strictlyfollowtheratedtemperaturespecificationsforuse, applygradualstepwiseheating, andvoidthermalshock.

Storageandhandling: Storeflatatlowtemperaturestopreventcoldflow, tso cai rau cov ntaub ntawv rov qab mus rau chav kub ua ntej siv, thiab xyuas kom meej qhov sib txuas ntawm lub ntsej muag tsis huv thiab dawbofoil.

Cov ntaub ntawv saum toj no yog muab los ntawmJiangsu OKNewMaterialTechnology Co., Ltd.

Yog tias koj xav paub ntxiv txog cov ncauj lus qhia ntxaws ntxaws, daim ntawv thov scenarios, thiab kev xaiv xaiv rau peb cov khoom lag luam - suav nrog PTFEhigh-temperaturefabric, PTFEhigh-temperaturetape, Teflonhigh -temperaturemeshbelts, seamlessbeltingforadhesivepresses, ib sab PTFEfabric, high-temperatureconveyorbelts, thiab high-temperaturefiberglassfabric-thov tsis pub muaj kev tiv tauj los ntawm cov nram qab no:

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