Cov qauv ntawm kev hloov pauv ntawm lub zog cohesive ntawm cov nplaum txheej ntawm Teflon high-temperature daim kab xev tom qab high-temperature aging.

I.PatternofChangeinAdhesiveLayerCohesionUnderHigh-TemperatureAging

Post-curingrisingstage: Intheearlystageofhigh-temperature exposure(eg,200–260°C), residualreactivegroupscontinuetocross-link, leadingtoasignificantincreaseincohesion.Theadhesivelayerbecomestougher,anditsresistancetoadhesivesqueeze-out(

Stableequilibriumstage: Cross-linkingapproachescompletion, andcohesionremainsstableoveralongperiod.Atthisstage,thetapeexhibitsoptimalperformanceandcanwithstandcontinuousoperationatitsdesigntemperature.

Degradationanddeclistage: Underexcessivetimeortemperature,themainchainundergoesdegradation, ua rau cohesiontodecreeasecontinuously.Theadhesivelayer softensandbecomestacky, ua rau nws muaj feem cuam tshuam rau cohesivefailureandsqueeze-tawm.

II.RootCausesofCohesiveFailureandAdhesiveSqueeze-out

Rootcauseofcohesivefailure: Thaum lub cohesivestrengthoftheadhesivelayerislowerthantheinterfacialadhesionstrength, internaltearingoccurs,leavingadhesiveresidue.Qhov nostems los ntawm tsis txaus cohesionorhigh-temperaturedegradation.

Rootcauseofsqueeze-tawm: Atelevatedtemperatures, themodulusdecreases,andtheadhesivelayer undergoescoldflow,beingextruded fromtheedgesbythermalstress.Theunderlyingcauses areinsufficientcross-linkingdensity orexcessivemolecularchainmobility.

Kev sib raug zoo ntawm ob: Ntev-ntev-degradationexacerbatesbothissuessimultaneously; insufficientcross-linkingdirectlyleadstosqueeze-outintheearlystage.

III.PreventionThroughAdhesiveFormulationandProcess

Formulationdesign: Usehigh-phenylsilicone, kev ua hauj lwm-kho-kho systemswithprecisecross-linkingcontrol, balanceMQresinratios, addreinformingfillers,andeliminatelow-molecular-weightplasticizers.

Coating andcuring: Ua kom tiav tom qab-kho kho kho kom tshem tawm-molecular-hnyav cov khoom thiab tiv thaiv kom tsis txhob nyem-tawm lub sijhawm dhau los ua kom raug.

Adhesivelayerstructure: Theadhesivethickness yuav tsum tau ua kom zoo (≤25μm), thiab 0.5-1mmadhesive-freesafetymargin yuav tsum tau muab pov thawj los ntawm cov txheej txheem ntawm lub cev thaiv kev sib tsoo.

IV.PreventionThrough SubstrateandOperatingConditions

Substrateanchoring: PTFEfilmrequiresetchingorplasmatreatment, combined withaprimertomatchinterfacialandcohesivestrengths, tiv thaiv ntau tshaj kev sib tw uas tuaj yeem ua rau tsis zoo.

Temperaturecontrol: Strictlyfollowtheratedtemperaturespecificationsforuse, applygradualstepwiseheating, andvoidthermalshock.

Storageandhandling: Storeflatatlowtemperaturestopreventcoldflow, tso cai rau cov ntaub ntawv rov qab mus rau chav kub ua ntej siv, thiab xyuas kom meej qhov kev sib txuas ntawm lub ntsej muag yog huv thiab dawbofoil.

Cov ntaub ntawv saum toj no yog muab los ntawmJiangsu OKNewMaterialTechnology Co., Ltd.

Yog tias koj xav paub ntxiv txog cov ncauj lus qhia ntxaws ntxaws, daim ntawv thov scenarios, thiab kev hloov kho rau peb cov khoom lag luam - suav nrog PTFEhigh-temperaturefabric, PTFEhigh-temperaturetape, Teflonhigh -temperaturemeshbelts, seamlessbeltingforadhesivepresses, ib leeg-sided PTFEfabric, high-temperatureconveyorbelts, thiab high-temperaturefiberglassfabric-thov tsis pub muaj kev tiv tauj los ntawm cov nram qab no:

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