di patεn fכ chenj na di kכhεsiv strכng fכ di adhesive layεr fכ Teflon hεy tεmprachכ tep afta hεy tεmprachכ ol.

I.PatternofChangeinAdhesiveLayerKoheshonƆndaHay-TɛmpraturaEj

Post-curingrisingstage: In di early stejof hai-temperatureexposure(eg,200–260°C), residual riaktiv grup de kɔntinyu fɔ krɔs-link, we de lid to asignifikant inkris inkɔhɛshɔn.Di adhesive layer bikam tranga, ɛn i de rɛsistɛns to adhesivesqueeze-out(overflow)isenhanced.

Stebul ikwilεbri stej: Krכs-linkin aprכch kכmplitεshכn, εn kכhεshכn de stebul כvalכng pεriכd.Na dis stej, di tεp de sho optimal pεrformεns εn i kin stεnd kכntinyu כpεreshכn na disayn tεmprachכ.

Dεgradashכn εn klaynes stej: כnda εksεsiv tεm כ tεmpratura, di mεn chen de כnda dεgradashכn, we de mek di kכhεshכn de dכn kכntinyu.Di adhesive layεr sכft εn bi stεk, we de mek i sכsεptibl fכ kכhεsiv fεil εn swεl-כt.

II.RutKɔz dɛm fɔKɔhizivFɛyl ɛnAdhesiveSkwez-Aut

Rutkozof kohεsiv fεil: We di kכhεsiv strכng fכ ed hεsiv layεr de lכw pas di intafεshal adheshon strכng, intanal tia de kכmכt, lεf adhesive rεsidyu.Dis kכmכt frכm insufifiεnt kכhεshכn כ hεy tεmprachכ dεgradashכn.

Rutcouseofsqueeze-out: Atelevatedtemperature,dimodulus decrease, en di adhesive layerundergoescolldflow,de bi extruded from the edgesby termal strress.Di ɔndalayn kɔz nɔ de inɔf krɔs-linkingdensityɔrɛksɛsiv mɔlikul chenmobiliti.

Rilayshɔn bitwin di tu: Lכng tεm dεgradashכn de εksεsεbεt כl tu dis syu dεm wan tεm;insufisεnt krכs-link dεrekt de lid to swεl-outin di εli stej.

III.PrεvεnshכnTruAdhesiveFכmyuleshכn εnPrכsεs

Fɔmyulashɔndizayn: Yuz ay-fɛnilsilikɔn, yuz adishɔn-kyuringsistimwit prɛsis krɔs-linkinkɔntrol, balansMQrɛsinrɛshɔ, adrɛdinfɔsfil, ɛn deliminatelɔ-mɔlikul-weyt plastizayza.

Coatingandcuring: Implimentthoroughpost-curingtreatment fɔ pul di low-molecular-weight substances ɛn mek dɛn nɔ swɛt-ɔut di tɛm we dɛn de ɛksplɔz di fɔs.

Adhesivelayerstructure: Di adhesivethicknessshouldbe kipthin(≤25μm), ɛn 0.5–1mmadhesive-friseftymarginshouldbiprovayd di edj fɔ fizik wan blɔk-swɛt-ɔut.

IV.PrεvεnshכnTruSכbstεrayt εnOpεrayshכnKכndishכn dεm

Substrateanchoring: PTFEfilm nid fɔ risech ɔ plasmatritmɛnt, we dɛn kɔmbayn wit prayma fɔ mach intafashial ɛn kɔhisiv trɛnk, fɔ mek dɛn nɔ ebul fɔ ankɔri pasmak we kin mek i nɔ wok fayn.

Temperaturecontrol: Strictly followtherated temperature specifications fɔ yuz, aplay stɛp smɔl smɔl fɔ ɔt, ɛn fɔ avɔyd tɛmalshɔk.

Stɔrej ɛn handel: Stɔrflat na di tɛmpracha fɔ mek i nɔ mek kol flɔ, alaw di tep fɔ go bak na rum tɛmpracha bifo yu yuz am, ɛn mek shɔ se di bonin sɔfays klin ɛn fri pan fɔyl.

Di infɔmeshɔn we wi dɔn tɔk bɔt naJiangsuOKNyuMatirialTɛknɔlɔjiKɔ.,Ltd.

If yu want fɔ lan mɔ bɔt di ditayl spɛsifikɛshɔn, aplikeshɔn sɛnɛriɔ, ɛn kɔstɔmayshɔn opshɔn fɔ wi ful rɛnj ɔf prɔdak dɛm—inklud PTFEhay-tɛmpracha fabrik, PTFEhay-tɛmpracha tep,Teflonhigh -temperaturemeshbelts,seamlessbelting fɔradhesivepresses,single-sidedPTFEfabric,hay-temperatureconveyorbelts,anthigh-temperaturefiberglassfabric—duya fil fri fɔ kɔntakt tru dɛn chanɛl dɛn ya:

SavisHotlayn:

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