di patεn fכ chenj na di kכhεsiv trεnk fכ di adhesive layεr fכ Teflon hεy tεmprachכ tεp afta hεy tεmprachכ ol.

I.PatternofChangeinAdhesiveLayerKoheshonƆndaHay-TɛmpraturaEj

Post-curingrisingstage: In di early stejof hai-temperatureexposure(eg,200–260°C), residual riaktiv grup de kɔntinyu fɔ krɔs-link, we de lid to asignifikant inkris inkɔhishɔn.Di adhesive layer bikam tranga, ɛn i de rɛsistɛns to adhesivesqueeze-out(overflow)isenhanced.

Stebul ikwilεbri stej: Krכs-linkin aprכch kכmplitεshכn, εn kכhεshכn de stebul כva כlכng pεriכd.Na dis stej, di tεp de sho optimal pεrformεns εn kin witstand kכntinyu כpεreshכn na disayn tεmprachכ.

Dεgradashכn εn klaynes stej: כnda εksεsiv tεm כ tεmpratura, di mεn chen de כnda dεgradashכn, we de mek di kכhεshכn de dכn kכntinyu.Di adhesive layεr sכft εn bi stεk, we de mek i sכsεptibl fכ kכhεsiv fεil εn swεl-כt.

II.RutKɔz dɛm fɔKɔhizivFɛyl ɛnAdhesiveSkwez-Aut

Rutkozof kohεsiv fεil: We di kכhεsiv strכng fכ ed hεsiv layεr de lכw pas di intafεshal adheshon strכng, intanal tirin de kכmכt, lεf adhesive rεsidyu.Dis kכmכt frכm insufifiεnt kכhεshכn כ ay tεmprachכ dεgradashכn.

Rutcouseofsqueeze-out: Atelevatedtemperature,dimodulus decrease,en di adhesive layerundergoescoldflow,beingextrudedfrɔm di edj dɛm bay tɛmal strɛs.Di ɔndalayn kɔz nɔr inɔf krɔs-linkingdensityɔrɛksɛsiv mɔlikul chenmobiliti.

Rilayshɔn bitwin di tu: Lכng tεm dεgradεshכn de εksεsεbεt כl tu dis syu dεm wan tεm;insufisεnt krכs-link dεrekt de lidstכ skwεz-outin di εli stej.

III.PrεvεnshכnTruAdhesiveFכmyuleshכn εnPrכsεs

Fɔmyulashɔndizayn: Yuz ay-fɛnilsilikɔn, yuz adishɔn-kyuringsistimwit prɛsis krɔs-linkinkɔntrol, balansMQrɛsinrɛshɔ, adrɛdinfɔsfil, ɛn deliminet lɔw-mɔlikul-weyt plastizayza.

Kכtεn εn kכrεshכn: Impliment tכrכpכst-kכring tritmεnt fכ pul lכw-mכlikul-weyt sכbstans dεm εnprεvεnt skwεz-כut durin di fכs di εkspכzכshכn.

Adhesivelayerstructure: Di adhesivethicknessshouldbe kipthin(≤25μm), ɛn 0.5–1mmadhesive-friseftymargin fɔ provayd di edj fɔ fizik wan blɔk-swɛt-ɔut.

IV.PrεvεnshכnTruSכbstεrayt εnOpεrayshכnKכndishכn dεm

Substrateanchoring: PTFEfilm nid fɔ risech ɔ plasmatritmɛnt, we dɛn kɔmbayn wit prayma fɔ mach intafashial ɛn kɔhisiv trɛnk, fɔ mek dɛn nɔ ebul fɔ ankɔri pasmak we kin mek i nɔ wok fayn.

Temperaturecontrol: Strictly folotherated temperature specifications fɔ yuz, aplay stɛp smɔl smɔl fɔ ɔt, ɛn fɔ avɔyd tɛmalshɔk.

Stɔrej ɛn handle: Stɔrflat na di tɛmpracha fɔ mek i nɔ flɔ kol, alaw di tep fɔ go bak na rum tɛmpracha bifo yu yuz am, ɛn mek shɔ se di bonding sɔfays klin ɛn fri pan fɔyl.

Di infɔmeshɔn we wi dɔn tɔk bɔt naJiangsuOKNyuMatirialTɛknɔlɔjiKɔ.,Ltd.

If yu want fɔ lan mɔ bɔt di ditayl spɛsifikɛshɔn, aplikeshɔn sɛnɛriɔ, ɛn kɔstɔmayshɔn opshɔn fɔ wi ful rɛnj ɔf prɔdak dɛm—inklud PTFEhay-tɛmpracha fabrik, PTFEhay-tɛmpracha tep,Teflonhigh -temperaturemeshbelts,seamlessbelting fɔradhesivepresses,single-sidedPTFEfabric,hay-temperatureconveyorbelts,anthigh-temperaturefiberglassfabric—duya fil fri fɔ kɔntakt tru dɛn chanɛl dɛn ya:

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