Nsakrae a ɛba wɔ ahoɔden a ɛka bom a ɛwɔ Teflon teyp a ɛyɛ hyew kɛse a wɔde nkata so no mu wɔ ɔhyew a ɛkɔ soro a ɛyɛ onyin akyi.

I.PatternofChangeinAdhesiveLayerCohesionUnderHigh-TemperatureOkwakoraa ne mmerewa

Post-curingrisingstage: Wɔ ɔhyew a ɛkorɔn a wɔde wɔn ho hyɛ mu mfiase no mu (sɛ nhwɛso no, 200–260°C), residualreactivegroup kɔ so yɛ cross-link, na ɛma ɛkɔ soro kɛse.

Stableequilibriumstage: Cross-linking kwan a wɔfa so wie, na biakoyɛ kɔ so gyina bere tenten mu.Wɔ saa gyinabea yi mu no, teape no da adwumayɛ a eye sen biara adi na ebetumi agyina adwumayɛ a ɛkɔ so wɔ ɔhyew a wɔahyɛ so.

Degradationandclinestage: Bere anaa ɔhyew a ɛba fam dodo no, nkɔnsɔnkɔnsɔn titiriw no kɔ ɔsɛe mu, na ɛma nkabom no so tew bere nyinaa.Adhesive layer no yɛ mmerɛw na ɛbɛyɛ stacky, ɛma ɛyɛ mmerɛw kɛse sɛ cohesive huammɔdi na ɛtwetwe-fi mu.

II.Ntini a ƐdeCohesiveDi nkogudi neAdhesiveSqueeze-Out

Ntini a ɛde nkabom a entumi nyɛ yiye: Sɛ ahoɔden a ɛka bom a ɛwɔ ti a ɛtwetwe no mu no sua sen interfacialadhesion ahoɔden no, emu nsu no ba, na ɛma nkae a ɛbata ho.Eyi fi nkabom a ɛnnɔɔso anaasɛ ɔhyew a ɛkɔ soro a ɛsɛe mu.

Ntini a ɛde squeeze-out: Ɔhyew a ɛkɔ soro no, modulus no so tew, na adhesivelaye no kɔ scoldflow mu, denam ɔhyew nhyɛso so yi fi anoano no fi mu.Nea ɛde ba no nyɛ cross-linkingdensity a ɛdɔɔso a ɛboro molecule chainmobility.

Abusuabɔ a ɛda abien no ntam: Bere tenten mu ɔsɛe ma nsɛm abien no nyinaa mu yɛ den bere koro mu;cross-linking a ɛnnɔɔso tẽẽ ma ɛtwetwe-fi mfiase.

III.Asiw ano denamAdhesiveFormulationandProcess so

Nsusuwii: Fa phenylsilicone a ɛkorɔn di dwuma, fa addition-curingsystem di dwuma wɔ cross-linkingcontrol pɛpɛɛpɛ, kari pɛ MQresinratios, addreinforcingfillers, na yi plasticizers a emu duru sua di dwuma.

Coatingandcuring: Fa aduruyɛ a edi mũ di dwuma wɔ aduruyɛ akyi de yi nneɛma a emu duru sua na esiw nhyɛso ano wɔ bere a edi kan a wɔde wɔn ho ahyɛ mu no mu.

Adhesivelayerstructure: Ɛsɛ sɛ wɔma adhesive thickness no yɛ teateaa(≤25μm), na 0.5–1mmadhesive-free safety margin ma anoano no ma honam fam siw squeeze-out.

IV.Asiw ano denam Substrate neOperatingTebea horow so

Substrateanchoring: PTFEfilm hwehwɛ sɛ wɔsan yɛ anaasɛ wɔde plasma ayaresa, wɔde ka primer ho ma ɛne interfacia ne ahoɔden a ɛka bom hyia, siw anchoring a ɛboro so a ebetumi ama wɔadi nkogu wɔ biakoyɛ mu no ano.

Ɔhyew a wɔde di dwuma: Di ɔhyew ho nhyehyɛe a wɔayɛ no akyi denneennen na fa di dwuma, fa ɔhyew a wɔde di dwuma nkakrankakra, na kwati ɔhyew mu ahodwiriw.

Nneɛma a wɔkora so ne nea wɔde di dwuma: Fa sie wɔ ɔhyew a ɛba fam so na amma awɔw ansen, ma kwan ma tetape no san kɔ dan mu hyew mu ansa na wode adi dwuma, na hwɛ hu sɛ bondings no ani ho tew na ɛnyɛ nea ɛwɔ foil so.

Nsɛm a ɛwɔ atifi hɔ no, wɔde maJiangsuOKNneɛma FoforoMfiridwumaCo.,Ltd.

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