Teflon high-temperature tape a adhesive layer-a cohesive strength inthlak danglamna pattern chu high-temperature aging hnua a ni.

I.PatternofChangeinAdhesiveLayerCohesionUnderHigh-TemperatureAging

Post-curingrisingstage: Temperature sang taka exposure hmasa berah(eg,200–260°C),residualreactivegroup chu cross-link-ah a kal zel a, chu chuan inpumkhatna nasa takin a tipung a ni.

Stableequilibriumstage: Cross-linking approachescompletion, leh cohesion chu hun rei tak chhungin a nghet reng a ni.Hetiang stage-ah hian tape hian performance tha ber a lantir a, temperature design-a operation chhunzawm zel pawh a tuar thei bawk.

Degradationanddeclinestage: Hun tam lutuk emaw, temperature emaw hnuai lam chuan chain chu a tlahniam zel a, chu chuan cohesion chu a tlahniam chhunzawm zel a ni.

II.RootCohesiveFailure lehAdhesiveSqueeze-Out chhan

Rootcauseofcohesivefailure: Lu layer-a inzawm chakna chu interfacialadhesion chakna aiin a hniam zawk chuan, chhungril te chu a lo awm a, adhesiveresidue a hnutchhiah a ni.Hei hi cohesion tling lo emaw, temperature sang tak atanga lo chhuak a ni.

Rootcauseofsqueeze-out: Temperature sang zawkah chuanmodulus chu a tlahniam a, adhesivelaye chu scoldflow hnuaiah a awm a,thermalstress hmangin edges atanga extrude a ni.

Heng pahnih inkara inzawmna: Hun rei tak chhunga chhiatna hian heng thil pahnih hi a rualin a tizual a;cross-linking tling lo directly chuan a tir lamah squeeze-out a thlen thin.

III.AdhesiveFormulation lehProcess hmanga invenna

Formulationdesign: High-phenylsilicone hmangin, addition-curingsystem hmangin cross-linkingcontrol dik tak hmangin, MQresinratios balance,addreinforcingfillers, leh low-molecular-weight plasticizers te chu paih chhuak rawh.

Coatingandcuring: Molecular-weight substances te paih chhuah nan leh exposure hmasa berah squeeze-out ven nan post-curingtreatment uluk taka kalpui tur a ni.

Adhesivelayerstructure: Adhesivethickness chu(≤25μm)-ah dah tur a ni a, 0.5–1mmadhesive-freesafetymargin chu physically blocksqueeze-out turin edge-ah pek tur a ni.

IV.Substrate lehOperatingConditions hmanga invenna

Substrateanchoring: PTFEfilm hian etching emaw plasmatreatment emaw a mamawh a,primer nena inzawm chuan interfacia lehcohesivestrengths a inmil a, anchoring tam lutuk chu cohesivefailure a thlen thei tur ven a ngai a ni.

Temperaturecontrol: Temperaturespecification hrang hrangte chu khauh takin zawm la,stepwiseheating hmangin, thermalshock pawh pumpelh rawh.

Storageandhandling: Coldflow ven nan temperature hniam takah dah la, hman hmain tape chu room temperature-ah a kir leh theih nan phalsak la, bondingsurface chu foil atanga thianghlim leh free a nih ngei ngei tur a ni.

A chunga thu hriatte hi a pe a niJiangsuOKThil tharTechnologyCo.,Ltd.

Kan thil siam chi hrang hrang—PTFEhigh-temperaturefabric, PTFEhigh-temperaturetape,Teflonhigh te pawh tel—a chipchiar zawka specification, application scenario, leh customizationoption chungchang zir belh i duh chuan -temperaturemeshbelts,seamlessbeltingforadhesivepresses,single-sidedPTFEfabric,temperature sang conveyorbelt,leh temperature sang tak fiberglassfabric—a hnuaia channel hmang hian zalen takin i inhriat theih nan:

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