2026-07-23 IB
Tsab ntawv xov xwm no hais txog yuav ua li cas kom phim txheej tshuab kab nrawm thiab qhov cub ntev kom ntseeg tau tias organosilicone nplaum ncav cuag lub hom phiaj kho kom sov rau PTFE daim kab xev. Lub hauv paus ntsiab lus tseem ceeb: tag nrho lub sijhawm nyob hauv t_total = qhov cub ntev L ÷ kab ceev v yuav tsum tsis pub tsawg tshaj li qhov yuav tsum tau kho lub sijhawm kho. Tau txais cov yam ntxwv kho mob los ntawm DSC lossis cov tshuaj nplaum kho mob uas tsim kom muaj 'kub - yam tsawg kawg nkaus kho lub sij hawm' kev sib raug zoo. Cov qauv sib npaug sib npaug: faib qhov cub rau hauv ib cheeb tsam, xam ti = Li / v thiab tcure(Ti), xyuas kom ∑(ti/tcure(Ti)) ≥1. Cov txheej txheem suav: teeb tsa qhov kub thiab txias nrog qhov ntev Li thiab kub Ti; teem kab ceev v, xam txhua cheeb tsam lub sij hawm nyob thiab qhov sib piv; iterate kom txog thaum tag nrho ≥1 (safety margin 1.1-1.2 pom zoo).
Nyeem ntxiv
2026-07-22 : kuv
Kab lus no sib piv qhov sib txawv ntawm cov hluav taws xob hluav taws xob hluav taws xob thiab cov cua kub cua kub kho cov txheej txheem ntawm crosslinked qauv uniformity ntawm silicone nplaum txheej. Thaum tshav kub kub hloov tshuab: kub-cua cia siab rau convection-conduction nrog maj mam kub nce, me me sab hauv / sab nraud kub sib txawv; IR tau txwv qhov tob tob nrog qhov nqus ntawm qhov chaw muaj zog (ntau txog kaum rau pua pua micrometers) tsim kom muaj qhov tob tob-rau-sab hauv gradient. Cov teebmeem ntawm crosslink uniformity: kub-cua ua rau synchronous curing sab hauv thiab tawm nrog uniform crosslink ntom; IR ua rau cov txheej txheem saum npoo kom nrawm nrawm 'skin film' uas cuam tshuam cov cua sov thiab cov saw hlau sab hauv, tsim kom muaj qhov sib txawv ntawm qhov sib txawv ntawm qhov chaw mus rau sab hauv.
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2026-07-20
Tsab ntawv xov xwm no suav nrog kev sib tham ntau ntawm cov gel feem thiab lub zog cohesive hauv silicone siab-rhiab nplaum nplaum rau Teflon daim kab xev. Gel feem = huab hwm coj feem pua ntawm crosslinked network insoluble hauv toluene (Soxhlet extraction, 24hr). Cohesive lub zog uas muaj qhov kub thiab txias tuav lub zog (180 ° C, 1kg). Peb qhov ntau: hauv qab qhov tseem ceeb (<60%) - tsis muaj qhov sib txuas, tuav lub zog ze zero; Kev siv ntau yam (60-85%) - cohesive zog loj hlob exponentially nrog gel feem, 60% → 70% nce tuav lub sij hawm ntawm feeb mus rau teev, 70% → 80% muab 3-10x nce; high crosslinking (> 85%) - nce qeeb (85% → 95% tsuas yog 20-50% nce), tack poob qis,> 95% poob PSA cov khoom.
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2026-07-18 IB
Tsab ntawv xov xwm no hais txog yuav ua li cas kom phim qhov kub thiab txias ib nrab ntawm peroxide crosslinking agents (BPO thiab DCP) nrog cov txheej txheem kho qhov rais rau Teflon daim kab xev. Cov ntaub ntawv tseem ceeb: BPO — 1-min ib nrab-lub neej ntawm ~ 131 ° C, 1-hr ntawm ~ 92 ° C, 10-hr ntawm ~ 72 ° C; DCP - 1-min ntawm ~ 171 ° C, 1-hr ntawm ~ 135 ° C, 10-hr ntawm ~ 115 ° C. Kev sib txuam logic: nplaum xav tau 97-99% crosslinking = 5-7 ib nrab-lub neej; curing lub sij hawm = 5-7 × ib nrab-lub neej ntawm lub hom phiaj kub. Rov qab-xws li kub los ntawm cov kab ntau lawm nyob rau lub sij hawm los yog rov qab xam lub sij hawm los ntawm qhov siab tshaj plaws tso cai kub.
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2026-07-17 IB
Kab lus no sib piv qhov sib txawv ntawm cov hluav taws xob hluav taws xob hluav taws xob thiab cov cua kub cua kub cua sov ntawm cov qauv sib txuas sib txuas ntawm cov txheej txheem silicone nplaum. Thaum tshav kub kub hloov mechanisms: kub-cua yog convection-conduction, maj mam thiab zuj zus, tsim nruab nrab kub gradient; IR yog hluav taws xob-absorption nrog khaus deg nqus (micrometers mus rau millimeters) tsim qhov tob-rau-sab hauv gradient. Effects on crosslink density distribution: hot-air allows inner and outer portions to enter vulcanization temperature range nearly simultaneously, yielding uniform crosslink density along thickness; IR ua rau cov txheej txheem saum npoo los kho tam sim ua cov tawv nqaij tawv uas cuam tshuam kev hloov pauv cua sov, ua rau muaj kev sib tw ntse ntawm crosslink ntom ntom ntawm qhov chaw sab hauv.
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2026-07-16 IB
Tsab ntawv xov xwm no tshuaj xyuas cov teebmeem ntawm lub vev xaib nruj tswj lub sijhawm Teflon high-temperature tape coating on PTFE substrate flatness and adhesive coating uniformity. Cov teebmeem ntawm substrate flatness: nro tshaj elastic txwv ua rau irreversible yas stretching thiab necking (ntev elongation, transverse nqaim), ua slackness, wrinkles thiab wavy qauv; PTFE creep nyob rau hauv kev ruaj ntseg nro yuav 'frozen' tom qab txias, ua rau nto unevenness; Qhov tsis sib xws ntawm qhov sib txawv ntawm qhov tsis zoo ntawm cov menyuam tsis sib xws ua rau cov npoo curled, nruab nrab blistering, thiab lub sijhawm nruj-xoo cov cim.
Nyeem ntxiv
2026-07-15 IB
Kab lus no piav qhia txog cov qauv ntawm kev hloov pauv hauv kev sib koom ua ke ntawm PTFE high-temperature tape adhesive layer after high-temperature aging. Peb-theem qauv: Tom qab kho qhov nce theem (thaum ntxov-qhov kub thiab txias ntawm 200-260 ° C, cov pab pawg residual reactive txuas ntxiv txuas ntxiv, cohesion nce ntxiv); Stable equilibrium theem (crosslinking mus kom tiav, cohesion tseem ruaj khov nyob rau lub sij hawm ntev); Degradation thiab poob theem (ntau lub sij hawm / kub ua rau lub ntsiab saw degradation, cohesion txo, nplaum softens thiab ua tacky). Cov hauv paus hauv paus ua rau tsis sib haum xeeb (sab hauv tearing tawm residue) thiab nyem-tawm (txias ntws los ntawm cov npoo vim txo qis modulus) raug tshuaj xyuas.
Nyeem ntxiv
2026-07-14 IB
Kab lus no nthuav tawm txoj hauv kev los txhim kho creep tsis kam thiab lub sij hawm ntev tuav ruaj khov ntawm Teflon high-temperature daim kab xev. Cov tswv yim muaj xws li: Molecular network topology optimization - siab MQ silicone resin / cov pos hniav piv (1.2: 1-2: 1) cov ntaub ntawv nyuaj-theem domains; kev koom ua ke ntawm phenyl pawg (20-30 mol%) cuam tshuam cov saw hlau; crosslink molecular hnyav tswj ntawm 5,000-15,000 g / mol; Gradient modulus multilayer nplaum qauv - primer-anchoring txheej (1-3μm) nrog silane coupling tus neeg sawv cev, high-modulus cohesive txheej (30-50μm) raws li shear-resistant skeleton, viscoelastic functional txheej (3-8μm) rau deg ntub dej; Nanofillers - fumed silica (10-25 wt%) nrog kev hloov kho saum npoo tsim rov qab lub cev sib txuas.
Nyeem ntxiv
2026-07-13 IB
Tsab xov xwm no hais txog yuav ua li cas microporous qauv tsim ntawm breathable Teflon (PTFE) high-temperature daim kab xev sib npaug huab cua permeability nrog rwb thaiv tsev thiab tsis-stick zog. Core conflict: air permeability requires open pores, while insulation demands density and non-stick requires smooth surfaces. Cov tswv yim tsim kev sib npaug: tswj qhov nruab nrab pore txoj kab uas hla (0.1-2μm, qhov zoo tshaj <0.5μm) kom tsis txhob yaj nkag mus thiab tswj qhov hluav taws xob tawg; tswj porosity ntawm 50-70% (≈60% pom) ua tiav Gurley 20-100s / 100cc thiab dielectric zog ≥2kV rau 0.13mm zaj duab xis; txais yuav high-tortuosity 3D network pore qauv (τ≈2.5-4) txhawm rau txhawm rau ncaj qha los ntawm kev tso tawm; tsim asymmetric gradient pore qauv nrog ntom ntom ntawm daim tawv nqaij txheej (1-5μm) rau tsis-stick / rwb thaiv tsev thiab ntxeem tau sab hauv rau breathability; siv super-oleophobic / hydrophobic nto tom qab kev kho mob yam tsis muaj pore blockage.
Nyeem ntxiv
2026-07-10 IB
Cov kab lus no muab cov kev daws teeb meem rau kev tiv thaiv cov nplaum nplaum thiab cov nplaum nplaum thaum siv PTFE high-temperature daim kab xev los tiv thaiv PCB kub ntiv tes thaum lub sij hawm SMT sib dhos. Hauv paus ua rau kev tsom xam: residue tshwm sim los ntawm kev sib koom ua ke tsis ua haujlwm lossis kev hloov pauv ntawm lub ntsej muag; los ntshav tshwm sim los ntawm viscosity poob thiab nplaum nplaum nyob rau hauv reflow tshav kub. Cov txheej txheem tseem ceeb yog xaiv cov kab xev kom zoo: silicone PSA nrog lub sij hawm luv luv ≥300 ° C, nruam ≥260 ° C, tag nrho cov thickness 0.08-0.13mm nrog nyias high-cohesion nplaum txheej, thiab tiv thaiv los ntshav / residue-dawb ntawv pov thawj. Kev tswj 6-kauj ruam: ua ntej lamination tu nrog IPA; xoom-tension lamination nrog kev khiav tawm ntawm huab cua; optimized reflow kub profile nrog maj mam cua sov (<2 ° C / s); txias peeling hauv qab 50 ° C ntawm 180 ° kaum; ua tam sim ntawd hauv 24 teev thiab siv ib zaug xwb; tsis ua hauj lwm tuav nrog IPA so thiab 40-50x magnifier tshuaj xyuas. Rau ob-sided PCBs, hloov nrog daim kab xev tshiab ua ntej ua haujlwm thib ob.
Nyeem ntxiv