Nin barokun bɛ kuma cogo min na ka kɛɲɛ ni finimugu masin layini teliya ni foro janya bɛnkan ye walasa ka a jira ko organosilicone nɔrɔlen bɛ se ka furakɛli hakɛ laɲininen sɔrɔ PTFE kaseti funteni caman na. Sariyasen min bɛ bɛn ɲɔgɔn ma : sigiyɔrɔ bɛɛ lajɛlen t_total = foro janya nafama L ÷ layini teliya v man kan ka dɔgɔya ni furakɛli waati wajibiyalen fitinin ye. Aw bɛ furakɛli jogo sɔrɔ DSC walima furakɛli sɛgɛsɛgɛliw fɛ minnu bɛ kɛ ni nɛgɛ ye minnu bɛ 'funteni — furakɛli waati fitinin' jɛɲɔgɔnya sigi sen kan. Furakɛli dalajɛlen modɛli min bɛ bɛn ɲɔgɔn ma : aw bɛ foro tila yɔrɔw la, ka ti=Li/v ni tcure(Ti jate), ka a lajɛ ko ∑(ti/tcure(Ti)) ≥1. Jateminɛ kɛcogo : funteni yɔrɔw sigi minnu janya ye Li ani funteni hakɛ Ti ye; set line speed v, ka zone kelen-kelen bɛɛ sigiyɔrɔ waati ni a ka dɛmɛ hakɛ jate; aw bɛ segin-ka-bɔ fo ka se a bɛɛ lajɛlen ≥1 ma (lakanani hakɛ 1,1-1,2 bɛ fɔ).

Nin barokun in bɛ danfara minnu bɛ infirɛri fiɲɛbɔli ni fiɲɛ sumalen lamini sumaya furakɛli fɛɛrɛw cɛ, olu suma ɲɔgɔn na silikɔni nɔrɔlenw ka sigicogo kelen-kelen kan. Funteni jiginni fɛɛrɛw : fiɲɛ sumalen bɛ a jigi da convection-conduction kan ni funteni jiginni nɔgɔman ye, kɔnɔna/kɛnɛma funteni danfara fitinin; IR ka doncogo juguman dan ye ni sanfɛla minɛni barikama ye (mikɔrɔmɛtɛrɛ tan fo kɛmɛ) min bɛ sanfɛla-ka-kɔnɔna jiginni gɛlɛnw Dabɔ. A nɔ minnu bɛ sɔrɔ ɲɔgɔndan kelen na : fiɲɛ sumalen bɛ se ka kɛ sababu ye ka furakɛli kɛ ɲɔgɔn fɛ kɔnɔna ni kɛnɛma ni ɲɔgɔndan density kelen ye; IR bɛ kɛ sababu ye ka sanfɛla lamini teliya ka 'farifilimu' dense dilan min bɛ funteni taabolo ni kɔnɔna cakɛda lamaga bali, o bɛ kɛ sababu ye ka crosslink density dɔgɔya ka bɔ surface la ka taa kɔnɔna na.

Nin barokun bɛ kuma bɛnkan hakɛlama kan jeli tilayɔrɔba ni jɛɲɔgɔnya fanga cɛ silikɔni tansiyɔn nɔrɔlenw na Teflon kase kama. Gel fraction = mass percentage of crosslinked network min tɛ se ka wuli toluyɛni kɔnɔ (Soxhlet bɔli, 24hr). Jɛɲɔgɔnya fanga min bɛ dɔn ni funteni minɛ fanga ye min ka bon (180°C, 1kg). Dakun saba : yɔrɔ kɔrɔlen duguma (<60%) — rezo percolating tɛ, fanga min bɛ zeru kɛrɛfɛ; waleyali hakɛ (60-85%) — jɛɲɔgɔnya fanga bɛ bonya kosɛbɛ ni jeli tilayɔrɔba ye, 60%→70% bɛ min waati kɔrɔta ka bɔ miniti la ka se lɛrɛw ma, 70%→80% bɛ dɔ fara 3-10x kan crosslinking caman (>85%) — tɔnɔw bɛ kɛ dɔɔni dɔɔni (85%→95% dɔrɔn 20-50% bɛ caya), tack bɛ jigin kosɛbɛ, >95% bɛ bɔnɛ PSA nafaw la.

Nin barokun bɛ kuma perokisidi crosslinking agents (BPO ani DCP) ka tiɲɛni funteni ni u tilancɛ si hakɛ bɛncogo kan ni furakɛli kɛcogo finɛtiri ye Teflon tape kama. Kunnafoni jɔnjɔnw : BPO — miniti 1 tilancɛ ɲɛnamaya ~131°C, lɛrɛ 1 ~92°C, lɛrɛ 10 ~72°C; DCP — miniti 1 ~171°C la, lɛrɛ 1 ~135°C la, lɛrɛ 10 ~115°C la. Matching logic : nɔrɔli mago bɛ 97-99% crosslinking = 5-7 tilancɛ-ɲɛnamaya; furakɛli waati = 5-7 × tilancɛ-ɲɛnamaya hakɛ laɲininen funteni na. Aw bɛ segin ka funteni jate ka bɔ sɛnɛfɛnw dilanni sira sigi waati la walima ka kɔfɛ jateminɛ kɛ waati la ka bɔ funteni hakɛ danmadɔ la min bɛ se ka kɛ.

Nin barokun in bɛ danfara minnu bɛ infrarouge radiation he

Nin barokun in bɛ web tension control (web tension control) nɔw sɛgɛsɛgɛ Teflon ka kaseti dacogo funteni caman waati la PTFE substrat flatness ani adhesive coating uniformity kan. A nɔ minnu bɛ substrat flakɛli la : tension min tɛmɛna elastique dan kan, o bɛ kɛ sababu ye ka plastiki sɔgɔsɔgɔli ni kɔkolo wuli min tɛ se ka segin kɔ (janya janya, ka surunya transversal), ka kɛ slackness, kurukuruw ani wavy patterns ye PTFE creep under sustained tension bɛ kɛ 'frozen' ye nɛnɛ kɔfɛ, o bɛ kɛ sababu ye ka surface unevenence; tension transverse uneven ka bɔ roller parallelism jugu la, o bɛ kɛ sababu ye ka dakunw kurukuru, cɛmancɛ kurukuruw, ani taamasiɲɛw sirilenw ni waati ni waati.

Nin barokun bɛ PTFE kasɛti nɔrɔlan min bɛ funteni caman na, o ka ɲɔgɔndɛmɛ fanga caman yeli cogoya ɲɛfɔ, funteni caman kɔrɔbayalen kɔfɛ. Taabolo saba kɛcogo : kɛnɛyali kɔfɛ wulicogo (funteni caman sɔrɔli daminɛ na 200-260°C la, kulu tolenw minnu bɛ se ka ɲɔgɔn sɔrɔ, olu bɛ taa a fɛ ka ɲɔgɔndan kɛ, jɛɲɔgɔnya bɛ bonya kosɛbɛ) Balannako sabatili dakun (crosslinking bɛ gɛrɛ dafalen na, jɛɲɔgɔnya bɛ to sabatilen na waati jan kɔnɔ); Tiɲɛni ni dɔgɔyali taabolo (waati/funteni tɛmɛnen bɛ kɛ sababu ye ka cakɛda kunbaba tiɲɛ, jɛɲɔgɔnya bɛ dɔgɔya, nɔrɔli bɛ nɔgɔya ani ka kɛ nɔrɔlen ye). Jɛɲɔgɔnya dɛsɛ (kɔnɔna tigɛli ka tolen to) ani sɔgɔsɔgɔli (nɛnɛ bɔli ka bɔ dakunw na ka a sababu kɛ modulu dɔgɔyali ye) jujɔw bɛ sɛgɛsɛgɛ.

Nin barokun in bɛ fɛɛrɛw jira walasa ka Teflon kasɛti min bɛ minɛ kosɛbɛ, o minɛcogo sabatili ni a minɛcogo kuntaalajan ɲɛ. Fɛɛrɛw ye : Molecular network topology optimization — MQ silicone resin/gum ratio (1,2:1–2:1) hakɛ caman bɛ fasa gɛlɛnw dilan; fenili kuluw (20-30 mol%) donli bɛ cakɛda lamagacogo bali; crosslink molekiyɔmu girinya min bɛ kɔlɔsi ni 5000-15000 g/mol ye; Gradient modulus multilayer adhesive structure — primer-anchoring layer (1-3μm) ni silane coupling agent ye, high-modulus cohesive layer (30-50μm) i n’a fɔ kolotuguda min bɛ se ka sɔgɔsɔgɔ, viscoelastic functional layer (3-8μm) walasa ka surface modulure Nanofillers — silica fumed (10-25 wt%) ni surface modification bɛ farikolo crosslinking kɔseginlen dilan.

Nin barokun bɛ kuma cogo min na Teflon fiyɛta (PTFE) kasɛti min bɛ fiɲɛ bila, o ka sigicogo mikroporozɛni bɛ fiɲɛ doncogo ni insulasi ni a tɛ nɔrɔ cogo min na, o bɛ bɛn ɲɔgɔn ma. Core conflict : fiɲɛ doncogo bɛ poro da wulilenw de wajibiya, ka sɔrɔ insulasi bɛ density de wajibiya ani non-stick bɛ yɔrɔ nɔgɔlenw de wajibiya. Dilancogo balannenw : ka poroze cɛmancɛ hakɛ kɔlɔsi (0,1-2μm, a ka fisa <0,5μm) walasa ka bɔgɔdaga doncogo bali ani ka tiɲɛni tension mara; porosité kɔlɔsili 50-70% (≈60% optimal) ka Gurley 20-100s/100cc sɔrɔ ani dielektriki fanga ≥2kV filimu 0,13mm kama; ka 3D rezo pores structure (τ≈2.5-4) ta min ka tortuosité (τ≈2.5-4) ye walasa ka jibɔ sira tilennenw bali; ka pores structure asymétrique gradient jɔ ni dense surface layer (1-5μm) ye walasa ka non-stick/insulation ani porous kɔnɔna na walasa ka ninakili sɔrɔ; aw bɛ a kɛ super-oleophobique/hydrophobique surface furakɛli kɔfɛ ka sɔrɔ a ma pores block.

Nin barokun in bɛ fɛɛrɛ sigilenw di walasa ka nɛgɛ tolenw ni nɔrɔlenw joli bali ni aw bɛ baara kɛ ni PTFE kaseti ye min funteni ka bon walasa ka PCB sanu bolokɔninw lakana SMT lajɛ waati. Jusigi sababu sɛgɛsɛgɛli : tolen bɛ sɔrɔ jɛɲɔgɔnya dɛsɛ fɛ walima fɛnw ni ɲɔgɔn cɛ jiginni fɛ; joli bɛ bɔ viscosity drop ani adhesive overflow fɛ reflow heat kɔrɔ. Fura koloma ye kaseti sugandili ɲuman ye : silikoni PSA min kuntaala surun ≥300°C, min bɛ to senna ≥260°C, a janya bɛɛ lajɛlen ye milimɛtɛrɛ 0,08-0,13 ye ni nɔrɔlan finmanw ye minnu bɛ ɲɔgɔn minɛ kosɛbɛ, ani seereyaw min tɛ joli/tolenw kɛlɛ. Taabolo kɔlɔsili fɛɛrɛ wɔɔrɔ : saniya ka kɔn lamini ɲɛ ni IPA ye ; zeru-tension lamination ni fiɲɛ bɔli dafalen ye; reflow funteni hakɛ ɲɛnabɔlen ni funteni nɔgɔman ye (<2°C/s); nɛnɛba bɔli 50°C duguma ni 180° ye; baara teliya la sanga 24 kɔnɔ ani baara kɛli siɲɛ kelen dɔrɔn; dɛsɛ furakɛli ni IPA wiping ani 40-50x magnifier sɛgɛsɛgɛli ye. Ni PCB fan fila bɛ u la, aw bɛ u falen ni kaseti kura ye sani aw ka kɛ fan filanan baara la.