Ichi chinyorwa chinovhara maitiro ekufananidza kumhanyisa muchina wekumhanyisa uye kureba kweovheni kuti ive nechokwadi chekuti organosilicone inonamira inosvika kune chinangwa chekurapa dhigirii repamusoro-tembiricha yePTFE tepi. Musimboti wekufananidza: nguva yese yekugara t_total = hurefu hweovheni hunoshanda L ÷ mutsara wekumhanyisa v haifanirwe kunge iri pasi peinodiwa nguva yekurapa. Wana maitiro ekurapa kuburikidza neDSC kana adhesive kurapa bvunzo inomisikidza 'tembiricha - shoma yekurapa nguva' hukama. Yakaenzana cumulative yekurapa modhi: patsanura hovhoni muzvikamu, verenga ti=Li/v uye tcure(Ti), simbisa ∑(ti/tcure(Ti)) ≥1. Maitiro ekuverengera: isa tembiricha nzvimbo dzine urefu Li uye tembiricha Ti; seta mutsara wekumhanyisa v, kuverenga nguva yekugara yenzvimbo yega yega uye reshiyo yemupiro; iterate kusvika yakazara ≥1 (safety margin 1.1-1.2 yakakurudzirwa).

Ichi chinyorwa chinofananidza mutsauko pakati pe infrared radiation kudziyisa uye kupisa-mhepo kutenderera kudziyisa nzira dzekurapa pane zvakachinjika chimiro kufanana kwesilicone adhesive layer. Maitiro ekutamisa kupisa: mhepo inopisa inotsamira pane convection-conduction nekunyorova kwekushisa kukwira, diki mukati / kunze kwekushisa kusiyana; IR ine kudzika kushoma kwekupinda nekunyura kwakasimba kwepasi (makumi kusvika kumazana emamicrometer) ichigadzira kukwirisa pamusoro-kusvika-mukati gradient. Mhedzisiro pakufanana kwecrosslink: mhepo inopisa inoita kuti synchronous kurapa mukati nekunze neuniform crosslink density; IR inokonzeresa kuti nzvimbo yepasi igadzire 'ganda firimu' rakakora iro rinotadzisa kupisa kupisa uye kufamba kwemukati cheni, zvichiita kuti crosslink density ichidzike kubva pamusoro kuenda mukati.

Ichi chinyorwa chinovhara huwandu hwetsamba pakati pechikamu chegel uye kusimba kwakabatana mune silicone kumanikidza-sensitive adhesives yeTeflon tepi. Gel chikamu = chikamu chemazana che crosslinked network isinganyunguriki mu toluene (Soxhlet extraction, 24hr). Simba rakabatana rinoratidzwa nepamusoro-tembiricha kubata simba (180 ° C, 1kg). Mitsara mitatu: pazasi yakakosha point (<60%) - hapana percolating network, inobata simba pedyo ne zero; maitiro anoshanda (60-85%) - simba rakabatana rinokura zvishoma nezvishoma nejeri chikamu, 60% → 70% inosimudza nguva yekubata kubva pamaminitsi kusvika kumaawa, 70% → 80% inopa 3-10x kuwedzera; high crosslinking (> 85%) - inowedzera zvishoma nezvishoma (85% → 95% chete 20-50% inowedzera), tack inodonha zvakanyanya,> 95% inorasikirwa nePSA zvinhu.

Ichi chinyorwa chinobata maitiro ekufananidza tembiricha yekuora uye hafu yehupenyu hweperoxide crosslinking agents (BPO neDCP) nehwindo rekurapa rekuita tepi yeTeflon. Core data: BPO - 1-min hafu yeupenyu pa ~ 131 ° C, 1-hr pa ~ 92 ° C, 10-hr pa ~ 72 ° C; DCP - 1-min pa ~171°C, 1-awa pa ~135°C, 10-awa pa ~115°C. Kufananidza logic: adhesive inoda 97-99% crosslinking = 5-7 hafu-upenyu; kuporesa nguva = 5-7 × hafu yeupenyu pane chinangwa chekushisa. Kumashure-karukureta tembiricha kubva kugadzira mutsara yekugara nguva kana kumashure-karukureta nguva kubva pakakwirira inobvumirwa tembiricha.

Ichi chinyorwa chinofananidza mutsauko pakati pe infrared radiation kudziyisa uye kupisa-mhepo kutenderera kudziyisa pane yakachinjika chimiro kufanana kwesilicon adhesive layer. Maitiro ekupisa kupisa: kupisa-mhepo inofambisa-convection, yakapfava uye inofambira mberi, ichigadzira mwero tembiricha gradient; IR kunyura kwemwaranzi nekunyudza kwakadzika kwepasi (micrometers to millimeters) ichigadzira kukwidza pamusoro-kusvika-mukati gradient. Mhedzisiro pacrosslink density kugovera: kupisa-mhepo inobvumira mukati nekunze zvikamu kupinda vulcanization tembiricha siyana panguva imwe chete, ichipa yunifomu crosslink density pamwe ukobvu; IR inokonzeresa kuti ganda repamusoro riporese nekukasira kuumba ganda rakakora izvo zvinotadzisa kupisa kupisa, zvichikonzera kupinza kwakapinza kweiyo crosslink density kuderera kubva pamusoro mukati.

Ichi chinyorwa chinoongorora mhedzisiro yewebhu tension control panguva yeTeflon yakakwirira-tembiricha tepi yekuputira paPTFE substrate flatness uye adhesive coating kufanana. Migumisiro pane substrate flatness: kushushikana kudarika elastic muganho kunokonzera kusagadziriswa kwepurasitiki kutambanudza uye mutsipa (longitudinal elongation, transverse narrowing), kuumba slackness, wrinkles uye wavy mapatani; PTFE inonyura pasi pekukakavadzana kwakasimba inova 'yakaoma' mushure mekutonhora, zvichikonzera kusaenzana kwepamusoro; kusaenzana kuchinjika tension kubva kuhurombo husina kumira mushe kunogadzira micheto yakamonereka, pakati mabhururu, uye periodic tight-loose mamaki.

Ichi chinyorwa chinotsanangura maitiro ekuchinja musimba rakabatana rePTFE yakakwirira-temperature tepi yakanamatira layer mushure mekuchembera kwakanyanya. Maitiro matatu-matanho: Kurapa kwemashure ekukwira kwepamusoro (kutanga kwekushisa kwepamusoro-kupisa pa 200-260 ° C, mapoka akasara anogadzirisa anoramba achiyambuka, kubatana kunowedzera zvakanyanya); Yakagadzikana equilibrium nhanho (crosslinking nzira dzekupedzisa, kubatana kunoramba kwakagadzikana kwenguva refu); Kudzikira uye kuderera nhanho (yakawandisa nguva / tembiricha inokonzeresa kuderera kweketani huru, kubatana kunoderera, kunamira kunopfava uye kunova tacky). Midzi inokonzeresa kutadza kwakabatana (kubvaruka kwemukati kusiya zvisaririra) uye kusvina-kunze (kutonhora kuyerera kubva kumicheto nekuda kwekudzikira modulus) kunoongororwa.

Ichi chinyorwa chinopa nzira dzekuvandudza zvinokambaira kuramba uye kwenguva yakareba kubata kugadzikana kwepamusoro-kubata Teflon yakakwirira-tembiricha tepi. Nzira dzinosanganisira: Molecular network topology optimization - high MQ silicone resin / gum ratio (1.2: 1-2: 1) inoumba nzvimbo dzakaoma dzakaoma-chikamu; kubatanidzwa kwemapoka ephenyl (20-30 mol%) inodzivisa kufamba kweketani; crosslink molecular weight controlled at 5,000-15,000 g / mol; Gradient modulus multilayer adhesive structure - primer-anchoring layer (1-3μm) ine silane coupling agent, high-modulus cohesive layer (30-50μm) seskeleton isingadziviriri skeleton, viscoelastic functional layer (3-8μm) yekunyorova pamusoro; Nanofillers - fumed silica (10-25 wt%) ine shanduko yepasi inogadzira inodzokororwa yemuviri kuyambuka.

Ichi chinyorwa chinotarisa maitiro eiyo microporous chimiro dhizaini yeinofema Teflon (PTFE) yakakwirira-tembiricha tepi inoyera kupindirana kwemhepo nekudzivirira uye kusanamatira zvivakwa. Kupokana kwepakati: kupindira kwemhepo kunoda mapores akavhurika, nepo insulation ichida kuwanda uye isiri-tsvimbo inoda nzvimbo dzakatsetseka. Kuenzanisa magadzirirwo mazano: kudzora avhareji pore dhayamita (0.1-2μm, zvakanaka <0.5μm) kudzivirira kunyunguduka kupinda uye kuchengetedza kuparara voltage; kudzora porosity pa50-70% (≈60% yakakwana) kubudirira Gurley 20-100s / 100cc uye dielectric simba ≥2kV ye0.13mm firimu; tora yakakwirira-tortuosity 3D network pore chimiro (τ≈2.5-4) kudzvanyirira yakatwasuka-kuburikidza nekuburitsa nzira; kuvaka asymmetric gradient pore chimiro chine dense pamusoro peganda layer (1-5μm) kune isiri-tsvimbo / insulation uye ine porous mukati mekufema; shandisa super-oleophobic/hydrophobic surface post-treatment pasina pore blockage.

Ichi chinyorwa chinopa mhinduro dzakarongeka dzekudzivirira masara ekunamatira uye kubuda kweropa kana uchishandisa PTFE high-temperature tepi kuchengetedza PCB zvigunwe zvegoridhe panguva yeSMT musangano. Root chikonzero chekuongorora: zvakasara zvinoitika kubva pakukundikana kwakabatana kana kutamisa kwemukati; kubuda ropa kunoitika kubva pakudonha kweviscosity uye kunamira kunofashukira pasi pekupisa kwekuyerera. Mushonga wepakati wakakodzera tepi kusarudzwa: silicone PSA ine peak yenguva pfupi ≥300 ° C, inoenderera ≥260 ° C, yakazara ukobvu 0.08-0.13mm ine yakatetepa yakakwirira-yakabatana adhesive layers, uye anti-kubuda ropa / kusasara-isina chitupa. Nhanho-nhanho yekudzora maitiro: pre-lamination kuchenesa ne IPA; zero-tension lamination ine full air evacuation; optimized reflow tembiricha mbiri nekudziisa zvinyoro (<2°C/s); kutonhora kunoputika pasi pe50 ° C pa 180 ° angle; kukurumidza kugadzirisa mukati maawa makumi maviri nemana uye kamwe-kushandisa chete; kutadza kubata ne IPA kupukuta uye 40-50x magnifier kuongorora. Kune maviri-mativi maPCB, tsiva nematepi nyowani pamberi pechipiri divi kugadzirisa.