Solder Creeping Causes & Solutions of PTFE kasɛti min bɛ funteni caman sɔrɔ

I n’a fɔ PTFE fini funteniman dilanbaga ŋana, Jiangsu Aokai New Materials bɛ baarakɛlaw ka baarakɛyɔrɔ tila ɲɔgɔn na insights.PCB fiɲɛ sumalen solder leveling, gold plating ani immersion gold processes kɔnɔ, solder creeping at the shielding edges of PTFE high-temperature tape, o sababu bɛ bɔ kosɛbɛ kaseti farikolo dɛsɛ ni baarakɛcogo dantɛmɛnenw nɔfɛkow faralen ɲɔgɔn kan.

I. Solder Creeping sababuw

Edge warping of PTFE high-temperature tape forming gaps Funteni caman dilanni senfɛ, kase nɔrɔli fanga bɛ dɔgɔya ni funteni bɛ wuli. Ni nɔrɔli ma se ka funteni degun kɛlɛ, kaseti dakunw bɛna wuli dɔɔni ka kɛ ka ɲɛgɛnɛsiraw kɛ, o bɛ kɛ sababu ye ka solder jilama don ka don kɔnɔna na.

Wicking effect ani solder dam accumulation Solder ka teli ka wuli ka taa yɔrɔw la minnu funteni ka bon farikolo la. Ni yɔrɔ lakananen bɛ funteni caman na, solder jilama bɛ wuli ka taa sanfɛ kaseti cɛmancɛw fɛ wicking (wicking) cogoya la effect.Ka fara o kan, PTFE kaseti min ka bon kojugu, o bɛna senna-tɛgɛrɛw kɛ a dakunw na, o bɛ kɛ sababu ye ka solder dalajɛ ka kɛ solder barazi ye, o bɛ solder creeping juguya ka taa a fɛ.

Mismatched material quality of PTFE high-temperature tape PTFE kaseti duguma nɔrɔlen bɛ se ka woyo, ka tiɲɛ ani ka nɔrɔ tolenw sɔrɔ funteni caman na. A tɛ dan dɔrɔn ka lakana barika tiɲɛ, nka a bɛ pads fana nɔgɔ, o bɛ dɔ fara solder creeping farati kan kosɛbɛ.

Nɔgɔ minnu bɛ PTFE kaseti tɛmɛ Hali ni kaseti ma tiɲɛ, solder biɲɛ minnu tora PCB vias kɔnɔ, olu bɛ pɛrɛn ani ka u sɔgɔsɔgɔ, walima solder fɛnɲɛnamafagalan misɛnnin minnu bɛ sɔrɔ flux vaporization fɛ reflow soldering waati, olu bɛ se ka don walima ka tɛmɛ shielding yɔrɔ la, ka nɔgɔ bila mɔgɔ la.

Lamini ni baarakɛcogo jiginni jugu Ni i ma se ka lakana yɔrɔ saniya walima ni i ma digi ka ɲɛ kaseti kɛtuma na, o bɛna yɔrɔw to solder doncogo la.Fura wuli teliya kojugu soldering reflow waati la, o bɛ dɔ fara solder fluidity kan kosɛbɛ, o bɛ a to a ka nɔgɔn ka PTFE kase dancɛ tigɛ.

Sanu dabɔyɔrɔw ɲigincogo ka bon min bɛ gɛlɛya juguya Sanu dabɔlenw ni u su ji la sanu yɔrɔw jibɔcogo ɲuman bɛ ni solder ye. Ni solder ye sanu sanfɛla sɔrɔ dɔrɔn, a bɛ jɛnsɛn joona kaseti dawolow la, o bɛ na ni jirisunba ye min ka bon kosɛbɛ ka tɛmɛ OSP ni fiɲɛ sumalen solder leveling processes gansanw kan.Nafamafɛnw i n’a fɔ sanu lamini pinɛw ni nikɛri sɔgɔli bɛna kɛ sababu ye ka sigida jisigicogo juguya ani ka dawolo solder sɔgɔli juguya ka taa a fɛ.

II. Fɛnɲɛnɛmaw: Aplikasiyɔn bolodacogo sigilen ka ɲɛsin PTFE kasɛti ɲumanba ma

Aw bɛ fɛnw sugandi minnu bɛ se ka kɛ ani ka lamini baarakɛcogo kɛ cogo kelen na Aw bɛ PTFE kasɛti ɲumanba ta min dilannen don kɛrɛnkɛrɛnnenya la PCB funteni caman taabolow kama, ni funteni kunbɛncogo ye 250~260 °C ye walasa ka fɛnw dilanni wajibiyalenw dafa minnu tɛ plɔmu sɔrɔ.Aw bɛ lakanani yɔrɔ saniya ka ɲɛ ni isoporopanɔli ye sani aw ka a kɛ walasa ka a la ko a bɛ don a la kosɛbɛ, k’a sɔrɔ a dakunw ma wuli walima ka a kɛ yɔrɔw la. Aw bɛ ganw don baara kɛtuma na walasa aw kana tulumafɛnw nɔgɔ.

Aw bɛ solder biɲɛ sɔgɔli bali ka kari ka tɛmɛ shielding fɛ Aw bɛ solder paste formula ta min bɛ sɔgɔsɔgɔ dɔɔnin ani ka reflow temperature curve kɛcogo ɲɛ. Ni aw ye a sumaya ka ɲɛ, o bɛ kɛ sababu ye ka furajiw labɔ ni fanga ye, wa a bɛ dɔ bɔ solder biɲɛ misɛnninw ka kari la kaseti lakanani na.

Aw bɛ sɛbɛnni ni minɛnw saniyacogo barika bonya Aw bɛ stensili saniya sɛbɛn bɔlen kɔfɛ PCB 2–3 o 2–3, ani ka dry wiping + vacuum cleaning mode ta walasa ka solder paste bali ka wuli kasɛti yɔrɔ la.Aw bɛ to ka solder powder tolenw bɔ sɛbɛnnikɛlan kan, mounter siraw ani fixtures kan walasa ka nɔgɔ filanan ban.

Donni ni baarakɛcogo jogoɲini kɔlɔsili gɛlɛn walasa ka fɛnw dantigɛliw dafa A ɲini PCB feerelaw fɛ u ka plugging jogo seereyaw di minnu bɛ se ka kɛ walasa ka viaw fa ka dafa ani ka solder biɲɛ dogolenw bali ka tɛmɛ shielding tape fɛ.Arrange random solderability inspection for gold-plated boards. Ni gɛlɛyaw sɔrɔla i n’a fɔ sanu sɔgɔlen finman ni nikɛri sɔgɔli, aw bɛ fɛn nafamaw datugu walasa ka aw tanga solder (solder) jiginni jugumanba ma min bɛ sɔrɔ solder (solder) jɛnsɛnni fɛ cogo la min tɛ cogo la.

Aw bɛ fɛɛrɛ wɛrɛw ta walasa ka dɔ bɔ kaseti tali la Ni fɛn dilannenw dilanni bɛ sira di, aw bɛ a ɲɛda furakɛcogo sugandilenw kɛ, i n’a fɔ sigida sanu dabɔli padw dɔrɔn kan ani sanu bolokɔninw baara kɔfɛ. O bɛ kɛ sababu ye ka dakunw tanga ni PTFE kaseti ye ani ka solder creeping ko ɲɛnabɔ kosɛbɛ.

Sugandili bɛnnen, lamination standardisé ani PTFE kaseti funteni caman kɔlɔsili baarakɛcogo dafalen na, olu ye fɛn kolomaw ye walasa ka solder creeping ban. Ni aw ye baarakɛcogo ɲɛfɔlenw ɲɛnabɔ ka ɲɛ, o bɛ se ka sɛnɛfɛnw sɔrɔta ɲɛ ka ɲɛ ani ka dɔ bɔ baara seginni musakaw la.

Sanfɛla fɛɛrɛko kɔnɔkow bɛ di Jiangsu Aokai New Materials Technology Co., Ltd fɛ.

Ni aw mago bɛ paramɛtiriw ɲɛfɔlenw na, baarakɛminɛnw ani furaw la minnu bɛ kɛ ka kɛɲɛ ni PTFE fini ye min funteni ka bon, PTFE kase min bɛ funteni caman bɔ, PTFE cɛsirilan min bɛ kɛ ni mesh ye, cɛsirilan min tɛ sɔgɔsɔgɔ, fini min bɛ kɛ ni PTFE ye, fini min bɛ kɛ ni PTFE ye, fini min bɛ se ka funteni caman kɛlɛ ani fini min bɛ kɛ ni fibreglasi ye, aw bɛ se ka anw sɔrɔ:

·  Guo : +86 18944819998 , Mali

·  Cɛ Liu: +86 13705266308

An bɛ tugu jago hakilila la min ye baarakɛcogo ɲuman ni danbe ye, ani ka izini dɛmɛni fɛɛrɛw di yɔrɔ kelen na ani feereli kɔfɛ baara jateminɛlen diɲɛ kiliyanw ye.