Solder Creeping Causes & Ano aduru a PTFE Ɔhyew a Ɛkorɔn Teyp

Sɛ́ adwumayɛfo fibea a wɔyɛ PTFE ntama a ɛyɛ hyew kɛse no, Jiangsu Aokai New Materials kyɛ adwumayɛfo nnwuma insights.In PCB mframa a ɛyɛ hyew solder leveling, sika kɔkɔɔ plating ne immersion sika kɔkɔɔ akwan, solder creeping wɔ shielding anoano PTFE high-temperature tape titiriw fi nkɛntɛnso a wɔaka abom a honam fam huammɔdi a tape ne extreme process environments.

I. Nneɛma a ɛde Solder Creeping ba

Edge warping of PTFE high-temperature tape forming gaps Bere a wɔreyɛ ɔhyew a ɛkorɔn no, tumi a ɛbata teyp no ho no so tew bere a ɔhyew no kɔ soro no. Sɛ adhesion no nnɔɔso sɛ ɛbɛko atia ɔhyew nhyɛso a, teyp no anoano bɛkyinkyin kakra na ayɛ capillary gaps, na ama nsu solder atumi akɔ mu.

Wicking effect ne solder dam accumulation Solder taa twe kɔ mmeae a ɛhɔ yɛ hyew kɛse honam fam. Sɛ beae a wɔabɔ ho ban no wɔ ɔhyew a ɛkɔ soro kakra a, nsu solder foro kɔ soro wɔ teyp no mu ntam kwan so wɔ wicking a wɔtaa yɛ mu effect.In addition, PTFE tape a ɛyɛ den dodo no bɛyɛ anammɔn wɔ anoano, na ama solder aboaboa ano ayɛ solder dam, a ɛma solder creeping yɛ kɛse bio.

Mismatched material quality of PTFE high-temperature tape PTFE tape a ɛba fam no adhesive layer no taa sen, sɛe na adhesive nkae wɔ ɔhyew a ɛkorɔn mu. Ɛnyɛ sɛ ɛsɛe akwanside a ɛbɔ ho ban no nko, na mmom ɛde efĩ ba pads no nso, na ɛma asiane a ɛwɔ hɔ sɛ solder bɛwea no yɛ kɛse.

Efĩ a ɛtwa PTFE teyp no ho hyia Sɛ mpo teyp no nni dɛm a, solder beads a ɛpae na ɛpetepete a aka wɔ PCB vias mu, anaasɛ solder nketenkete a ɛnam flux vaporization so ba bere a wɔresan de solder no, betumi akɔ anaasɛ atwa baabi a wɔde kyɛm no ho ban na ɛde efĩ aba.

Lamination ne process fluctuation a ɛnsɛ Sɛ wɔanhohoro shielding no ani anaasɛ wɔanmia no sɛnea ɛsɛ bere a wɔde teyp rehyɛ mu no a, ɛbɛma kwan a ɛbɛma solder akɔ mu.Ɔhyew a ɛkɔ soro ntɛmntɛm dodo bere a wɔde reflow soldering no kɔ soro kɛse no ma solder fluidity kɔ soro kɛse, na ɛma ɛyɛ mmerɛw sɛ wobebu PTFE tape no hye so.

High wettability of gold plating surfaces a ɛma ɔhaw no yɛ kɛse Gold-plated ne immersion sika kɔkɔɔ ani da solder wettability a ɛkyɛn so adi. Sɛ solder di sika kɔkɔɔ no ani pɛ a, ɛtrɛw ntɛmntɛm wɔ tape no anoano, na ɛde creeping range kɛse ba sen OSP ne ordinary hot air solder leveling processes.Defects te sɛ gold layer pinholes ne nickel corrosion bɛma local wettability a ɛnteɛ na ɛbɛma edge solder creeping asɛe bio.

II. Ano aduru: Nhyehyɛe a Wɔde Di Dwuma a Wɔde Ma PTFE Teapɔn a Ɛyɛ Paara

Paw nneɛma a ɛfata na yɛ standardize lamination adwumayɛ Adopt high-quality PTFE high-temperature tape titiriw a wɔayɛ ama PCB high-temperature akwan, a ɔhyew a ɛko tia 250 ~ 260 °C di ho dwuma kɔbere-free production requirements.Clean the shielding surface yiye denam isopropanol ansa na wode adi dwuma na ama woahwɛ ahu sɛ ɛfata koraa a edge warping anaasɛ gaps. Hyɛ nsateaa bere a woreyɛ adwuma no na amma srade ankɔ mu.

Siw solder bead splashing kwan sɛ ɛbɛbubu wɔ shielding mu Fa low-splashing solder paste formula na ma reflow temperature curve no yɛ papa. Sɛ wodi kan yɛ hyew sɛnea ɛsɛ a, ɛmma solvent a ɛyɛ basabasa no nsɛe na ɛtew asiane a ɛwɔ hɔ sɛ solder beads nketenkete bebubu fa tape shielding no mu no so.

Hyɛ tintim ne nnwinnade a wɔde tew ho nhyehyɛe mu den Hohoro stencil no ho bere a woatintim PCB biara 2–3 awie no, na fa dry wiping + vacuum cleaning mode no tom na amma solder paste no anpetepete tape no so.Daa yi solder powder a aka wɔ tintim afiri, mounter tracks ne fixtures so na ama efĩ a ɛto so abien no afi hɔ.

Strict incoming and process quality control to make up for material limitations Hwehwɛ sɛ PCB a wɔde ma no de plugging quality adansedi nkrataa a ɛfata ma na ama wɔahwɛ ahu sɛ vias ahyɛ mu ma koraa na wɔasiw solder beads a ahintaw no kwan sɛ wɔrentwa shielding tape no ho.Arrange random solderability inspection for gold-plated boards. Sɛ wohu ɔhaw ahorow te sɛ sika kɔkɔɔ a ɛyɛ tratraa ne nikel a ɛyɛ mmerɛw a, siw nneɛma a asɛe ano na woakwati solder a ɛbɛwea kɛse a solder a ɛtrɛw a ɛnteɛ de ba no.

Fa akwan foforo a wɔfa so tew teyp a wɔde wɔn ho to so no so tew Sɛ nneɛma a wɔyɛ no ma kwan a, fa aduru a wɔpaw di dwuma wɔ soro, te sɛ sika kɔkɔɔ a wɔde bɛkata so wɔ mpɔtam hɔ nkutoo wɔ pads nkutoo so ne sika kɔkɔɔ nsateaa a wɔde di dwuma akyi. Eyi yi hia a ehia sɛ wɔde PTFE teyp bɛbɔ anoano ho ban no fi hɔ na edi solder creeping asɛm no ho dwuma titiriw.

Nteaseɛ mu paw, standardized lamination ne full-process collaborative control of PTFE high-temperature tape yɛ nneɛma atitiriw a ɛbɛma wɔayi solder creeping afi hɔ. Sɛ wɔma application ho nsɛm yɛ papa a, ebetumi ama nneɛma a wɔyɛ no atu mpɔn yiye na atew ɛka a wɔbɔ wɔ adwuma a wɔsan yɛ no so.

Atifi hɔ mfiridwuma ho nsɛm no yɛ nea Jiangsu Aokai New Materials Technology Co., Ltd. na ɛde mae.

Sɛ wuhia parameters a ɛkɔ akyiri, application nsɛm ne ano aduru a wɔayɛ ama PTFE high-temperature ntama, PTFE high-temperature tape, PTFE mesh belt, seamless fusing machine belt, single-sided PTFE coated ntama, high-temperature resistant conveyor belt ne fiberglass ntama, yɛsrɛ wo, di yɛn ho nkɔmmɔ:

·  Owura Guo: +86 18944819998 Ɔde ne nsa kyerɛɛ ne so

·  Owura Liu: +86 13705266308 Ɔde ne nsa kyerɛɛ ne so

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