Jiangsu Aokai New Materials, inyanzvi inogadzira PTFE yakakwirira-tembiricha tepi, inopa hutungamiriri hwehunyanzvi. Apo PTFE high-temperature tepi inoshandiswa kuchengetedza PCB zvigunwe zvegoridhe panguva yeSMT musangano, zvakanamatira zvakasara (zvinonamatira zvakasara pazvigunwe zvegoridhe mushure mekutambisa tepi) uye kubuda kweropa (kunamatira kunonyorovesa uye kunoputika pasi pekushisa kwepamusoro, kusvibisa nzvimbo dzisina kudzivirirwa kana nzvimbo dzePCB) mushure mokunge reflow soldering inokonzerwa nekusarudzwa kweparameter kusina kunaka kana kusarudzwa kweparameter kusina kunaka. Pazasi pane yakarongeka seti yemhinduro:
I. Root Cause Analysis yeAdhesive Residue & Bleed 1. Adhesive Residue Inoitika apo iyo inonamira inotambura kutadza kwakabatana (kubvaruka kwemukati kweiyo adhesive layer) kana interfacial kutamisa kutadza (adhesive inobvisa kubva kune substrate uye inonamatira kune zvigunwe zvegoridhe). Zvinokonzeresa zvinokonzeresa zvinosanganisira kusakwana tembiricha kuramba tepi, zera rekunamira, kana nguva isina kufanira yekupepeta.
2. Adhesive Bleed Iyo viscosity yeadhesive inodonha zvakanyanya pasi pekuyerera kwekushisa kwepamusoro, zvichikonzera kuwedzera zvakanyanya fluidity. Pasi pe lamination pressure uye capillary action, iyo inonamira inopfachukira tepi kumucheto. Izvi zvinowanzokonzereswa nekunyanya kukora kunamira kunamira, kukurumidza kukwira kwekushisa, kana kushomeka kwekushisa kwemhepo inonamira pachayo.
II. Yakakodzera Tape Sarudzo - Iyo Core Solution Yakajairika PTFE tepi haigone kusangana nezvinodiwa zvakanyanya zveSMT maitiro. Zvigadzirwa zvakagadzirirwa SMT goridhe chengetedzo yemunwe zvinofanirwa kusarudzwa, nekutanga kupihwa kune adhesive system kuita:
Adhesive Type
Features
Recommended Scenarios
Notes
Silicone Pressure-Sensitive Adhesive (Silicone PSA)
Kudzivirira kupisa kusvika 260-300 ° C, kuenderana kwakanaka
Yakanyanya kushandiswa kune lead-isina reflow soldering
Chete chemhando yepamusoro-yakaderera-outgassing mamakisi anogamuchirwa; low-molecular silicone zvikamu zvichabuda ropa uye zvichikonzera kusvibiswa neimwe nzira.
Silicone-Yemahara / Acrylic Adhesive
Hapana silicon kusvibiswa njodzi
Silicon-sensitive maitiro (anotevera kupenda / kupfekedza mashandiro)
General kupisa kusagadzikana kunogumira 200-260 ° C; tarisa peak tembiricha kushivirira usati washandisa.
· Temperature Resistance Giredhi : Yenguva pfupi-yepamusoro tembiricha yekudzivirira ≥ 300 ° C, inoenderera sevhisi tembiricha ≥ 260 ° C, inopfuura nekure tembiricha yepamusoro ye lead-isina reflow soldering (245-250 ° C).
· Adhesive Layer Ukobvu : Ukobvu hwepamusoro hauna kuenzana nekunamatira kwakasimba. Sarudze matepi ane ukobvu hwese hwe 0.08–0.13mm, ane akatetepa asi akabatana-anonamira ma layer kuti aderedze zvakanyanya njodzi yekubuda ropa.
· Anti-Bleed & Residue-Yemahara Certification : Kumbira anti-kubuda ropa uye yakasara-yemahara bvunzo mishumo yakatsaurirwa kune SMT goridhe kuchengetedzwa kwemunwe kubva kune vatengesi, uye ita chaiyo yekuyedza yevira nemasampuli.
III. Nhanho Nhanhatu Kudzora Maitiro 1. Pre-Lamination: Surface Cleaning & Pre-Kurapwa · Kupedza degreasing: Zvigunwe zvegoridhe nenzvimbo dzakatenderedza PCB dzinofanirwa kunge dzisina tsvina dzekudikitira, zvinosvibisa oiri uye zvinoyerera. Pukuta nemucheka usina-lint wakanyikwa muanhydrous ethanol kana isopropyl alcohol (IPA), wozoomesa mhepo.
· Dry substrate: Ita shuwa kuti maPCB haana hunyoro zvachose pamberi pekushandisa tepi.
2. Lamination: Zero Tension & Full Air Evacuation · Usatambanudza tepi: PTFE substrate ine yakanaka ductility. Kutambanudza panguva yelamination kunogadzira kushushikana kwemukati izvo zvinokonzeresa shrinkage pasi pekupisa kwakanyanya, zvichikonzera kunamira kubvaruka, kusarira kana kubuda ropa. Isa tepi yakatsetseka pamusoro pezvigunwe zvegoridhe uye wodzvanya zvishoma kuti utange kunamira.
· Kubvisa mweya wakazara: Shandisa roller yakatsaurirwa kana hard scraper kusunda zvishoma nezvishoma unidirectionally kubva pakati kuenda kumativi ese kuti izere compaction. Iva nechokwadi chekunamatira kumucheto kwakazara pasina kuvharirwa mabhuru emhepo; mabubbles anowedzera pasi pekupisa uye anosimudza tepi edges, zvichikonzera kunamira kufashukira.
· Kurongeka chaiko: Rongedza tepi mipendero inotsvedza negoridhe mipendero yemunwe kana kuisa zvishoma ne 0.2-0.5mm (kana dhizaini ichibvumidza). Usambofa wakavhara mapedhi kana vias, sezvo capillary siphonage inokwevera yakanyungudutswa inonamira kunze.
3. Reflow Soldering: Optimize Temperature Profile · Nyatsoteerera tepi tembiricha zvakatemwa: Yera chaiyo bhodhi tembiricha kuvimbisa tembiricha yepamusoro uye yakazara kupisa nguva kugara mukati meiyo tepi yekushivirira.
· Nyoro yekudziisa rampu: Chengetedza kunonoka kupisa mwero (<2°C/s) usati wasvika painonamira inopfavisa nzvimbo (150°C–200°C). Kamwe kamwe inopinza tembiricha spikes inokurumidza kupfavisa kunamira uye kudonha viscosity yayo, zvichitungamira mukubuda ropa kwakanyanya.
4. Peeling Nguva: Cold Peeling Inopa Migumisiro Yakanaka Kutonhodza zvakakwana kusvika mutembiricha yemumba: Mushure mekunyungudusa, mirira kusvika tembiricha yePCB yadzika pasi pe50°C (tembiricha yakanaka) usati wapepeta tepi. Adhesive inoramba yakapfava uye yakaderera-kubatana pakupisa kwepamusoro; kumanikidzirwa kupisa peeling kunokonzera nyore kuparadzanisa kupatsanurwa uye inosara glue.
· Peeling technique: Pera zvishoma nezvishoma pakona yakaderera 180° nesimba rakafanana. Usakweva zvine simba kana kushorwa kwasangana.
5. Maitiro Ekugadzirisa: Kudzora Shelf Hupenyu & Reuse Cycles Nyorera uye gadzira nekukurumidza: maPCB ane laminated tepi anofanirwa kupinda muvira reflow nekukasira. Dzivisa kuchengetedza kwenguva refu (kupfuura maawa makumi maviri nemana) mumusangano kudzivirira kunyura kwehunyoro uye kuunganidzwa kweguruva.
· Kushandisa kamwe chete kwechoto pass: SMT yakakwirira-tembiricha tepi chinhu chinoraswa chinodyiwa. Kunyangwe kana tepi ichiita seyakasimba mushure mekupfuura kwechoto, iyo yekunamatira yakapfuura nekuchembera; yechipiri yekudziya kutenderera ichanyatso kukonzeresa anonamatira zvakasara kana kutadza kunamatira. Kune maPCB akaiswa mativi maviri, tsiva nematepi-nyowani usati wagadzirisa rutivi rwechipiri mushure mekupfuura kwekutanga.
6. Kukundikana Emergency Handling & Validation · Diki residual glue disposal: Mira kugadzirwa nekukasira kana masara aonekwa. Pukuta zvinyoronyoro ne IPA-yakanyoroveswa lint-isina jira; tumira mabhodhi ekucheneswa kwehunyanzvi mumatambudziko akaomarara. Usambokwesha nemidziyo yakaoma.
· Itsva tepi qualification yekusimbisa: Ita yakazara muyedzo kugadzirwa ne1: 1 chaiyo PCB. Mushure mechoto chapfuura, svuura tepi uye woongorora nzvimbo dzemunwe dzegoridhe pasi pe 40-50x magnifier kuratidza zero yasara uye zero inonamira kufashukira.
Izvo zviri pamusoro pehunyanzvi zvemukati zvinopihwa ne Jiangsu Aokai New Materials Technology Co., Ltd.
Kana iwe uchida kuwana tsanangudzo dzakadzama, mamiriro ekushandisa uye zvigadziriso zvakagadziridzwa zvechigadzirwa chedu chizere chepodfolio chinosanganisira PTFE yakakwirira-tembiricha jira, PTFE yakakwirira-temperature adhesive tepi, PTFE yakakwirira-temperature mesh bhandi, seamless kupisa kupisa bhandi, single-sided PTFE jira, yakakwirira-tembiricha inodzivirira pazasi inodzivirira girazi, tapota taura nesu pazasi-inodzivirira girazi.
· Nharembozha Yebasa: VaGuo + 86 18944819998
· Nharembozha Yebasa: VaLiu + 86 13705266308
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