I.MolecularNetworkTopologyOptimizationoftheSiliconeAdhesiveLayer-KunatsiridzaBulkCreepResistance
1.HighMQResin/SiliconeRubberRatiouye'Hard-Core'Structure
Magadzirirwo ezvigadzirwaMQsiliconeresinasthetackifier uye inosimbisa mugadziri,inowedzeraMQ/gumratioto1.2:1–2:1(yakanyanya kukwirira kupfuura emazuva ese). yakaoma'yakaoma-chikamu'microdomains inemusoro wehesivelayer, iyo inomanikidza kufamba kwezvikamu zvesiloxane cheni uye kuvandudza zvakanyanya kuchengetera modulusa uye kunyura kunopesana nematembiricha.
2.Kubatanidzwa kweMapoka Akasimba-Kupisa-Kupisa uyeMakuru-Bond-EnergyKubatanidzaSite
Phenyl, diphenyl, orcarboranegroups zvinounzwa muthepolydimethylsiloxanebackbone(eg,20–30mol%phenylcontent)kudzivisa cheni yemafuta inofamba uye nesese zviri zviviri kushanduka kwegirazi tembiricha uye rmaldecompositiontemperature.Thecrosslinkingsystempreferentiallyemploysaddition-curehydrosilylation(Pt-catalyzed),forming-C-C-or-Si-C-crosslinkingbridges withsuperiorthermalstability.
3.Kudzora Molecular WeightBetweenCrosslinks(Mc) neNetworkDefects
Nekunyatsogadzirisa iyo inoshanda yehydrogencontent uye cheni kureba yehydrogen-inesiliconeoil, yakaenzana zvishoma shomaniformMc (inenge 5,000–15,000g/mol) yawanikwa, kuve nechokwadi kuti mambure basa rinochengetedza kusimba kwepamusoro-pamwe nematembiricha asina kusimba.Yakawedzerwa post-kupora kana tembiricha yakakwira-inogadziriswa kudyira mamwe mapoka maviri ekushanda uye inoderedza kuzorora kuzorora kunokonzerwa nenetwork defects.
II.GradientModulusMultilayerAdhesiveStructure–BancingTackandCreepResistance
'Primer-anchoringlayer+High-moduluscohesivelayer+Viscoelasticfunctionallayer'three-layerdesign
1.Primer-anchoringlayer(1–3μm): Shandisasasilanecouplingagentinepoxyoracryloyloxygroups,pre-polymerized withMQresin,kupa bothchemicalbonding tothePTFEsubstrate andco-crosslinking withtheuppersiliconelayer.
2.High-moduluscohesivelayer(mainbody, approx.30–50μm): Useshigh-MQ-ratio, high-phenyl-content, high-crosslink-densitysiliconeadhesivetofurnisharobustshear-resistantskeleton.
3.Viscoelasticfunctional layer
III.NanofillersforConstructingPhysicalCrossdambudzikondHeat-ResistantSkeleton
1.In-SituReinforcementandSurfaceModification yeNano-Silica
Themanufacturerusesfumedsilica(specificsurfacearea200–380m²/g),surface-treated withvinyltriethoxysilaneorhexamethyldisilazane,ataloadingof10–25wt%.Thenano-SiO₂inoumbahydrogenbondandphysicaladsorption withsiloxaanechains reversible physicalcrosslinking network inoparadza simba uye inodzivirira kuti molecular cheni lippepeji isingaremekedze tembiricha.High-sheardispersionensures that the silicaexistas' clusters'anetagglomeratesizes under 100nm, avoidingtress concentration.
2.DirectionalCreepResistancevia2DNanomaterials
Additionof1–5wt%shoma-layergrapheneororgano-modifiednano-montmorillonite,iyo yaitungamirakuronganayekuronganakuburikidza neshear-inducedalignment panguva yekugadzira,formsa'mazeeffect'paralleltothetapep mukoto, zvakanyanya kuwedzera kushorwa nemamolecular cheni kufamba mukati mesheardirection. Grapheneinopawo yakanakisa thethermalconductivity, inoderedza kupisa mapoto paganda rakasiyana uye kunonoka kunyorova.
IV.ChemicallyIntegratedSubstrate–AdhesiveInterfaceandProcessControl
1.SurfaceActivationuyeBifunctionalPrimerforChemicalBonding
ThePTFEuso inotanga kurapwa nethasodium–naphthalene–THFsolutionkana-low-pressureargon/oxygenplasmatogenerateineactivatedlayer inecarboxylandhydroxylgroups ated.Mumwe wepekutanga anopindirana ne–OH/–COOHonthePTFE pamusoro, ukuwo iwowo achitora chikamu muhydrosilylation kana condensation crosslinking nesiliconeadhesive, inoumbakemikari bondnetwork inopinda mukati meinterface.Maitiro aya anogona kuwedzera-tembiricha yekubatisisa (pa260°C-nguvaC260°C).
2.RampedCuringandPost-KurapwaToKubvisa Kukanganisa
Chimiro cheArampedcuring chinoshandiswa: chekutanga, chinogadziriswa chinofambiswa uye chepamusoro chinobuda chiyero chakaenzana ne80-100 ° C; zvino hydrosilylation uye kurongedza kweMQresina inopedzwa pa150-170 ° C; pekupedzisira, post. -kuporeswa kwepamuviri kunosvika200–220°C kwemaawa akati wandei kuti bvisai mukati memukadzi uye dzikamisa hunhu hwemambure ekubatanidza.
Ruzivo rwuri pamusoro rwunopihwa naJiangsuAokaiNewMaterialTechnologyCo.,Ltd.
Kana uchida kuwana-ruzivo rwakadzama rwezvinhu zvizere-zvinosanganisira Teflonhigh-temperature tape,Teflonhigh-temperature tepi,Teflonhigh-temperature meshbelt,seamlessconveyor mabhandi emichina yekubatanidza,nedivi rimwe chetePTFEfabric, mabhandi ekutakurisa anodzivirira kutonhora kwepamusoro-tembiricha, uye nezvimwe-pamwe chete nezvakatsanangurwa, maitiro ekushandisa, uye magadzirirwo ekugadzirisa, ndapota inzwa wakasununguka kubata kuburikidza neanotevera nzira:
Nharembozha:
Mr.Guo:+86 18944819998
Mr.Liu:+86 13705266308
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