I-I.MolecularNetworkTopologyUkwezeliswa kweSiliconeAdhesiveLayer–UkuphuculaIBulkCreepResistance 1.HighMQResin/SiliconeRubber Ratioand'Hard-Core'Structure Iimveliso zezadoptsMQsiliconeresinasthecoretackifierand reinforcingagent,yandisa iMQ/gumratioto1.2:1–2:1(iphezulu kakhulu kunesiqhelo). eqinile'isigaba esinzima'isizinda esinentloko hesivelayer, esinyanzelela intshukumo yamacandelo e-siloxane amatyathanga kwaye iphucule kakhulu ugcinomodyuli kunye nokumelana nokunyuka kwamaqondo obushushu aphakamileyo.
2.Ukudityaniswa kwamaQela aZimayo anganyangekiyo kubushushu kunye neZiza eziNxulumanisayo eziNxibelelayo zeBond-ePhezulu I-Phenyl, i-diphenyl, i-orcarborane amaqela angeniswa kwi-thepolydimethylsiloxanebackbone(umz.,20–30mol% phenylcontent) ukunqanda intshukumo yobushushu bobushushu kunye ne-zombini kwiglasi yokutshintsha kweqondo lobushushu kunye rmaldecompositiontemperature.Thecrosslinkingsystempreferentiallyemploysaddition-curehydrosilylation(Pt-catalyzed),ukwenza-C-C-or-Si-C-C-crosslinkingbridgeswithsuperiorthermalstability.
3.Ukulawulwa kobunzima beMolekyuliPhakathi kweziQhakamshelwano (Mc) kunye neziphene zeNetwork Ngokuchaneka ngokuchanekileyo uhlengahlengiso olusebenzayo lwehydrogencontent kunye nobude bekhonkco kwihydrogen-equlathe isiliconeoil, irelativelysmallanduniformMc(malunga ne-5,000–15,000g/mol) iphunyeziwe, iqinisekisa ukuba umnatha umsebenzi ugcina ukukwazi ukumelana nobushushu obuphezulu.Ubushushu obandisiweyo emva kokunyanga okanye ubushushu obuphezulu ukuya kwanelisasetyenziswa ekutyeni intsalela esebenzayo yamaqela kwaye inciphisa ukuphumla ukukhululeka okubangelwa ziziphene zenethiwekhi.
II.GradientModulusMultilayerAdhesiveStructure-BalancingTackandCreepResistance 'I-Primer-anchoringlayer+High-moduluscohesivelayer+Viscoelasticfunctionallayer'uyilo olunemigangatho emithathu 1.I-Primer-anchoringlayer (1–3μm): Sebenzisa isasilanecouplingagent equlathe amaqela epoxyoracryloyloxy, pre-polymerized ngeMQresin, ukubonelela ngebothchemicalbondingtothePTFEsubstrate andco-crosslinking withtheuppersiliconelayer.
2.I-High-moduluscohesivelayer (i-mainbody, malunga ne-30-50μm): I-Useshigh-MQ-ratio, i-phenyl-content, i-high-crosslink-densitysiliconeadhesivetofurnisharobustshear-resistantskeleton.
3.I-Viscoelasticfunctionallayer(incontactwiththeheadherend,3–8μm): Employslow-MQ-ratioorhydroxy-terminatedsilicone-oyile-modifiedsoftsiliconeadhesivetolowersurfacemodulusandensurerapidwettingandconformabilitytot head herendatelevatedthemperatures.
III.NanofillersforConstructingPhysicalCrossngxakindHeat-ResistantSkeleton 1.In-SituReinforcementandSurfaceUkuguqulwa kweNano-Silica I-Themanufacturerusesfumedsilica(specificsurfacearea200–380m²/g),surface-treated withvinyltriethoxysilaneorhexamethyldisilazane,ataloadingof10–25wt%.I-Thenano-SiO₂ibumba iibhondi ze-hydrogen kunye ne-physicaladsorption kunye ne-siloxaneinani ireversiblephysicalcrosslinkingnetwork echitha amandla kwaye inqanda imolekyuli ukugudlana kwephepha ubushushu obushushu.I-high-sheardispersioninsures thatthesilicaexistass'amaqela'anayo igglomeratesizes below100nm,ukuphepha ukuxinanisa.
2.DirectionalCreepResistancevia2DNanomaterials Ukongezwa kwe-1–5wt%imbalwa-umaleko we-eororgano-modifiednano-montmorillonite,indlela ejongiswe ngayo i-layereyidarangendlela ngeshear-ikhuthaza ulungelelwaniso ngexesha lokucofa,ifomu'mazeeffect' paralleltothetapep Umzila,ukwandisa kakhulu ukuxhathisa ukuya kwintshukumo yemolekyulakwindlela yokucheba.Igrafine ikwabonelela ngokugqwesileyo ekuqhubeni ubushushu bobushushu,ukunciphisa imbiza yobushushu kwindalo kunye nokulibazisa ukuthambisa okushushu.
IV.ChemicallyIntegratedSubstrate–AdhesiveInterfaceandProcessControl 1.Ukusebenza koMphezulu kunye nokuSebenza ngokuBini okuPrimerforChemicalBonding Ubuso bePTFE buqale baphathwe ngethasodium–naphthalene–THFsolutionorlow-pressureargon/oxygenplasmatogenerateinactivatedlayercontainingcarboxylandhydroxylgroups.I-Aprimersolutioniqulathe iimolekyuli ezingasebenziyo(umzekelo,isocyanatesilane,titanatecouplanegentlycouplanexympotheni) i-ated.Inye kwi-primer idibana no-OH/–COOHonthePTFE umphezulu, ngeli lixa inye ithatha inxaxheba kwi-hydrosilylationorcondensationcrosslinking ne-siliconeancamatheliswayo, yenza i-chemicalbondnetwork egqobhoza kumjongano.Le ndlela yokwandisa ubushushu bobushushu obuphezulu(nge-260°C-nge-C260°C)
2.I-RampedCuringandPost-UnyangoukuzeKupheliswe iziphene Iprofayile ye-Arampedcuring iyasebenza: okokuqala, i-solvent iyaqhutywa kwaye intlan- thiselwa ivelela umphakamo ongu-80-100°C; emva koko i-hydrosilylation kunye nokupakishwa kwe-MQresina igqitywe nge-150-170°C; ekugqibeleni, isithuba -i-curingiscariedoutat at200–220°Cforsevers hours toelinginternalstress and stabilisephysical crosslinkingpoints.Ukupholisa okucothayo kuthintela ukuqhekeka kancinci ngenxa eyohlukileyo ukushwabana okushushu.
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