I-I.MolecularNetworkTopologyUkwezeliswa kweSiliconeAdhesiveLayer–UkuphuculaIBulkCreepResistance
1.HighMQResin/SiliconeRubber Ratioand'Hard-Core'Structure
Iimveliso zezadoptsMQsiliconeresinasthecoretackifierand reinforcingagent,yandisa iMQ/gumratioto1.2:1–2:1(iphezulu kakhulu kunemigangatho yesiqhelo). eqinile'isigaba esinzima'isizinda esinentloko hesivelayer, esinyanzelela intshukumo yamacandelo e-siloxane amatyathanga kwaye iphucule kakhulu ugcinomodyuli kunye nokumelana nokunyuka kwamaqondo obushushu ashushu.
2.Ukudityaniswa kwamaQela aZimayo anganyangekiyo kubushushu kunye neZiza eziNxulumanisayo eziNxibelelayo zeBond-ePhezulu
I-Phenyl, i-diphenyl, i-orcarborane amaqela angeniswa kwi-thepolydimethylsiloxanebackbone(umz.,20–30mol% phenylcontent) ukunqanda intshukumo yobushushu bobushushu kunye ne-zombini kwiglasi yokutshintsha kweqondo lobushushu kunye rmaldecompositiontemperature.Thecrosslinkingsystempreferentiallyemploysaddition-curehydrosilylation(Pt-catalyzed),iform-C-C-or-Si-C-crosslinkingbridgeswithsuperiorthermalstability.
3.Ukulawulwa kobunzima beMolekyuliPhakathi kweziQhakamshelwano (Mc) kunye neziphene zeNetwork
Ngokuchaneka ngokuchanekileyo uhlengahlengiso olusebenzayo lwehydrogencontent kunye nobude bekhonkco kwihydrogen-equlathe isiliconeoil, irelativelysmallanduniformMc(malunga ne5,000–15,000g/mol) iphunyeziwe, iqinisekisa ukuba inet umsebenzi ugcina ukukwazi ukumelana nobushushu obuphezulu.Ubushushu obandisiweyo emva kokunyanga okanye ubushushu obuphezulu ukuya kwanelisasetyenziswa ukutyela iqela eliseleyo elisebenzayo kwaye linciphisa ukuphumla ukukhululeka okubangelwa ziziphene zenethiwekhi.
II.GradientModulusMultilayerAdhesiveStructure-BalancingTackandCreepResistance
'I-Primer-anchoringlayer+High-moduluscohesivelayer+Viscoelasticfunctionallayer'uyilo olunemigangatho emithathu
1.I-Primer-anchoringlayer (1–3μm): Sebenzisa isasilanecouplingagent equlathe amaqela epoxyoracryloyloxy, pre-polymerized ngeMQresin, ukubonelela ngebothchemicalbondingtothePTFEsubstrate andco-crosslinking withtheuppersiliconelayer.
2.I-High-moduluscohesivelayer (i-mainbody, malunga ne-30-50μm): I-Useshigh-MQ-ratio, i-phenyl-content, i-high-crosslink-densitysiliconeadhesivetofurnisharobustshear-resistantskeleton.
3.I-Viscoelasticfunctionallayer(engadibananga nentloko-herend,3–8μm): Employslow-MQ-ratioorhydroxy-terminatedsilicone-oyile-modifiedsoftsiliconeadhesivetolowersurfacemodulusandensurerapidwettingandconformabilitytot head herendatelevated lobushushu.
III.NanofillersforConstructingPhysicalCrosslingxakindHeat-ResistantSkeleton
1.In-SituReinforcementandSurfaceModification yeNano-Silica
I-Themanufacturerusesfumedsilica(specificsurfacearea200–380m²/g),surface-treated withvinyltriethoxysilaneorhexamethyldisilazane,ataloadingof10–25wt%.I-Thenano-SiO₂ibumba iibhondi ze-hydrogen kunye ne-physicaladsorption nge-siloxaneinani ireversiblephysicalcrosslinkingnetwork echitha amandla kwaye inqanda imolekyuli ukuguquguquka kwephepha amaqondo ashushu.I-high-sheardispersionensures thatthesilicaexistass'amaqela'anayo igglomeratesizes below100nm,ukuphepha ukuxinanisa.
2.DirectionalCreepResistancevia2DNanomaterials
Ukongezwa kwe-1–5wt%imbalwa-umaleko we-eororgano-modifiednano-montmorillonite,indlela ejolise kuyo i-layereyidarangendlela yokucheba-ikhuthaza ulungelelwaniso ngexesha lokucofa,ifomu'mazeeffect' paralleltothetapep Umzila,ukwandisa kakhulu ukuxhathisa kwintshukumo yemolekyulakwindlela yokucheba.Igrafine ikwabonelela ngokugqwesileyo ekuqhubeni ubushushu bobushushu,ukunciphisa imiphunga kwindalo yohlobo kunye nokulibazisa ukuthambisa okushushu.
IV.ChemicallyIntegratedSubstrate–AdhesiveInterfaceandProcessControl
1.Ukusebenza koMphezulu kunye nokuSebenza ngokuBini okuPrimerforChemicalBonding
Ubuso bePTFE buqale baphathwe ngethasodium–naphthalene–THFsolutionorlow-pressureargon/oxygenplasmatogenerateinactivatedlayercontainingcarboxylandhydroxylgroups.I-Aprimersolutioniqulathe iimolekyuli ezingasebenziyo(umzekelo,isocyanatesilane,titanatecouplanegently medialy couplanexy+etheni) i-ated.Inye kwi-primer idibana-OH/–COOHonthePTFE umphezulu, ngeli lixa inye ithatha inxaxheba kwi-hydrosilylationorcondensationcrosslinking ne-siliconeancamatheliswayo, yenza i-chemicalbondnetwork egqobhoza kumjongano.Le ndlela yokwandisa amandla okubamba ubushushu obuphezulu(nge-260-°C ngamaxesha angama-260°C).
2.I-RampedCuringandPost-UnyangoukuzeKupheliswe iziphene
Iprofayile ye-Arampedcuring iyasebenza: okokuqala, i-solvents iyaqhutywa kwaye incamatheliswa isivela kwinqanaba elingu-80-100 ° C; emva koko i-hydrosilylation kunye nokupakishwa kwe-MQresina igqitywe nge-150-170 ° C; ekugqibeleni, isithuba -i-curingiscariedoutat at200–220°Cforsevers hours toelinginternalstress and stabilisephysicalcrosslinkingpoints
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