UyiNqanda Njani iNtsalela encamathelayo kunye nokuphuma kwegazi okuncamathelayo kwe-PTFE iteyiphu yobushushu obuphezulu xa ukhusela iMinwe yeGolide yePCB kwi-SMT Mounting

I-Jiangsu Aokai New Materials, umenzi oqeqeshiweyo we-PTFE iteyiphu yobushushu obuphezulu, ubonelela ngesikhokelo sobuchule. Xa itheyiphu ye-PTFE yobushushu obuphezulu isetyenziselwa ukukhusela iminwe yegolide ye-PCB ngexesha lendibano ye-SMT, i-adhesive residue (i-adhesive deposits eshiywe kwiminwe yegolide emva kokuxothwa kwe-tape) kunye ne-adhesive bleed (i-adhesive ithambile kwaye iphuphuma phantsi kobushushu obuphezulu, ukungcolisa iindawo ezingakhuselekanga okanye imiphezulu ye-PCB) emva kokuba i-reflow soldering ibangelwa ngokungafanelekanga inkqubo yokukhetha i-tape okanye i-tape engafanelekanga. Apha ngezantsi kukho iseti yezisombululo ezicwangcisiweyo:

I. Ingcambu yeMbangela yoHlalutyo lweNtsalela encamathelayo kunye nokuBopha

1. I-Adhesive Residue  Kwenzeka xa i-adhesive ihlupheka ukungaphumeleli kokubambisana (ukukrazula kwangaphakathi kwe-adhesive layer) okanye ukungaphumeleli kokudluliselwa kwe-interfacial (i-adhesive detaches kwi-substrate kwaye inamathele kwiminwe yegolide). Izinto ezibangela ukuba zixhaphake zibandakanya ukungonelanga kokumelana nobushushu beteyiphu, ukuncamathela okugugileyo, okanye ixesha lokupeya elingafanelekanga.

2. I-Adhesive Bleed  I-viscosity ye-adhesive yehla ngokukhawuleza phantsi kobushushu obuphezulu bokuhamba kwakhona, okukhokelela ekwandiseni ulwelo olunamandla. Ngaphantsi koxinzelelo lwe-lamination kunye nesenzo se-capillary, i-adhesive igqithisa i-tape edge. Oku kudla ngokubangelwa kukuncamathisela okuncamathele kakhulu, ukunyuka kwamaqondo obushushu okukhawulezayo, okanye ukunganyangeki kakuhle kwe-thermal yokuncamathela.

II. Ukukhethwa kweTape ngokufanelekileyo - Isisombululo esiPhambili

Iteyiphu ye-PTFE eqhelekileyo ayinakuhlangabezana neemfuno ezigqithisileyo zeenkqubo ze-SMT. Iimveliso ezilungiselelwe ngokukodwa ukhuseleko lweminwe yegolide ye-SMT kufuneka zikhethwe, kuqalwe kuqatshelwe ukusebenza kwenkqubo yokuncamathelisa:

 

· IBanga lokumelana nobushushu : Ukumelana nobushushu bexesha elifutshane ≥ 300 ° C, ubushushu benkonzo eqhubekayo ≥ 260 ° C, bugqithise kakhulu ubushushu obuphezulu be-lead-free reflow soldering (245-250 ° C).

· Ukutyeba koMaleko okuncamathelayo : Ubukhulu obuphezulu abulingani nokuncamathela okunamandla. Khetha iiteyiphu ezinobukhulu obupheleleyo obuyi-0.08–0.13mm, ezinomaleko wokuncamathelisa obhityileyo kodwa obambeneyo kakhulu ukunciphisa kakhulu umngcipheko wokopha.

· ISiqinisekiso esichasene nokopha kunye neNxala-eSimahla : Cela ukuchasana nokopha kunye neengxelo zovavanyo ezingenazo intsalela ezinikezelwe kukhuseleko lomnwe wegolide we-SMT kubaboneleli, kwaye wenze uvavanyo lokwenene lwesithando somlilo ngeesampulu.

III. ImiGangatho emithandathu yoLawulo lweNkqubo

1. I-Pre-Lamination: Ukucocwa komphezulu kunye noNyango lwangaphambili

· Ukuphelisa ngokupheleleyo amafutha: Iminwe yegolide kunye nemiphezulu ye-PCB ejikelezileyo kufuneka ingabi namabala ombilo, izingcolisi ze-oyile kunye neentsalela eziguquguqukayo. Sula ngelaphu elingena-lint elifakwe kwi-ethanol ye-anhydrous okanye kwi-isopropyl alcohol (IPA), emva koko wome ngokupheleleyo emoyeni.

• I-substrate eyomileyo: Qinisekisa ukuba ii-PCBs azinamanzi ngokupheleleyo phambi kokuba ufake iteyiphu.

2. Lamination: Zero Tension & Full Air Ecuation

· Musa ukuyolula iteyiphu: I-PTFE substrate ine-ductility elungileyo. Ukolula ngexesha le-lamination kudala uxinzelelo lwangaphakathi olubangela ukushwabana phantsi kobushushu obuphezulu, okukhokelela ekukrazukeni kwe-adhesive, intsalela okanye ukopha. Beka itheyiphu ibe mcaba ngokwendalo phezu kweminwe yegolide kwaye ucinezele kancinci ukuze uncamathisele ekuqaleni.

· Ukususwa komoya ogcweleyo: Sebenzisa irola ezinikeleyo okanye i-hard scraper ukutyhala ngokucothayo ngokungangqalanga ukusuka embindini ukuya kumacala omabini ukuze kuxinaniswe ngokupheleleyo. Qinisekisa ukubambelela ngokupheleleyo komphetho ngaphandle kwamaqamza omoya avalelweyo; amaqamza akhula phantsi kobushushu kwaye aphakamise imiphetho yeteyiphu, ebangela ukugcwala okuncamathelayo.

· Ulungelelwaniso oluchanekileyo: Lungelelanisa imiphetho yeteyiphu egungxulwayo ngemiphetho yeminwe yegolide okanye ifakwe kancinci nge-0.2–0.5mm (ukuba uyilo luyavuma). Ungaze ugqume iipads okanye ii-vias, njengoko i-capillary siphonage izakuzoba incangathi etyhidiweyo ngaphandle.

3. I-Reflow Soldering: Lungiselela iProfayili yoBubushushu

• Thobela ngokungqongqo imilinganiselo yobushushu beteyiphu: Linganisa iqondo lobushushu bomphezulu webhodi ukuqinisekisa ubushushu obuphezulu kunye nobude bexesha lokufudumeza bubonke buhlala phakathi koluhlu lonyamezelo lweteyiphu.

· Irempu yokufudumeza ethambileyo: Gcina isantya esicothayo sokufudumeza (<2°C/s) phambi kokuba ufikelele kwindawo yokuncamathela encamathelayo (150°C–200°C). I-spikes yobushushu ebukhali ngokukhawuleza ithambisa i-adhesive kwaye idilize i-viscosity yayo, ekhokelela ekopheni okukhulu.

4. Ukucheba Ixesha: Ukuzixovula okubandayo kuzisa iziphumo eziNgcono

· Pholisa ngokupheleleyo kwiqondo lobushushu begumbi: Emva kokutywinwa, linda de ubushushu bePCB behle ngaphantsi kwe-50°C (ubushushu obufanelekileyo be-ambient) phambi kokuxobula iteyiphu. I-Adhesive ihlala ithambile kwaye iphantsi-intsebenziswano kwiqondo lokushisa eliphezulu; ukunyanzeliswa okutshisa okutshisa ngokulula kubangela ukuhlukana komgangatho kunye neglue eseleyo.

· Ubuchule bokukrazula: Khubula kancinane nge-engile ye-180° ephantsi ngamandla afanayo. Musa ukutsala nzima ukuba kukho ukuxhathisa.

5. Ulawulo lweNkqubo: Ukulawula Ubomi beShelf & Ukuphinda Usebenzise Imijikelo

· Faka isicelo kwaye usebenze ngokukhawuleza: IiPCB ezineteyiphu elaminethiweyo kufuneka zingene kwiziko lokubuyisela ngokukhawuleza. Kuphephe ukugcina ixesha elide (ngaphezu kweeyure ezingama-24) kwindawo yokusebenzela ukuthintela ukufunxwa komswakama kunye nokuqokelelana kothuli.

· Ukusetyenziswa kanye kuphela kwiziko lokugqitha: Iteyiphu yobushushu obuphezulu ye-SMT yinto enokulahlwa. Nangona i-tape ibonakala ilungile emva kokudlula kwesinye isithando somlilo, i-adhesive iye yawela i-crosslink kunye nokuguga; umjikelo wesibini wokufudumeza ngokuqinisekileyo uya kubangela intsalela yokuncamathelisa okanye ukungaphumeleli kokubambelela. KwiiPCB ezinyuswe macala amabini, buyisela iteyiphu entsha kraca phambi kokuba kulungiswe icala lesibini emva kokupasa kokuqala.

6. Ukungaphumeleli ukuPhathwa okuNgxamisekileyo kunye nokuQinisekisa

· Ukulahlwa kweglu eyintsalela encinci: Misa imveliso ngoko nangoko xa kubhaqiwe intsalela. Sula ngobunono ngelaphu le-IPA elimanzi; thumela iibhodi zokucoca ngobuchule kwiimeko ezinzima. Ungaze ukhuhle ngezixhobo ezinzima.

· Ukuqinisekiswa kweteyiphu entsha: Ukuqhuba imveliso yolingo olupheleleyo nge-1:1 iiPCB ezizizo. Emva kokudlula kwesithando somlilo, hlambulula iteyiphu kwaye ujonge iindawo zeminwe yegolide phantsi kwe-40-50x yesikhulisi ukuze uqinisekise intsalela ye-zero kunye ne-zero encamathelayo ephuphumayo.

Lo mxholo wobugcisa ungentla unikwe ngu I-Jiangsu Aokai yeZixhobo eziNtsha zeTekhnoloji Co., Ltd.

Ukuba unqwenela ukufumana iinkcukacha ezicacileyo, iimeko zesicelo kunye nezisombululo ezilungiselelwe ipotifoliyo yethu epheleleyo kubandakanya i-PTFE ilaphu elinobushushu obuphezulu, i-PTFE iteyiphu encamathelayo yobushushu obuphezulu, i-PTFE high-temperature mesh belt, ibhanti lokucinezela ubushushu obungenamthungo, ilaphu le-PTFE elinamacala elinye, ubushushu obuphezulu obunganyangekiyo kunye ne-fiberglass ekwazi ukumelana nobushushu

· INombolo yomnxeba weNkonzo: Mnu. Guo +86 18944819998

· Umnxeba weNkonzo: Mnu. Liu +86 13705266308

Sihlala sibambelela kubuchwephesha kunye nefilosofi yenkonzo ejolise kwintembeko, sinikezela ngeentliziyo ezipheleleyo izisombululo zamashishini kunye nenkonzo yabathengi ecingayo kuwo onke amaqabane!