Uyivimbela Kanjani Insalela Enamathelayo kanye Nokopha Okunamathelayo kwe-PTFE High-Temperature Tape Lapho Uvikela Iminwe Yegolide ye-PCB ekukhwezeni kwe-SMT

I-Jiangsu Aokai New Materials, umkhiqizi ochwepheshe we-PTFE itheyiphu yezinga lokushisa eliphezulu, unikeza isiqondiso sochwepheshe. Uma i-PTFE itheyiphu yokushisa ephezulu isetshenziselwa ukuvikela iminwe yegolide ye-PCB ngesikhathi somhlangano we-SMT, izinsalela zokunamathisela (amadiphozithi anamathelayo ashiywe eminwe yegolide ngemva kokucwecwa kwe-tape) kanye ne-adhesive bleed (i-adhesive ithambisa futhi ichichime ngaphansi kwezinga lokushisa eliphezulu, ukungcolisa izindawo ezingavikelekile noma izindawo ze-PCB) ngemva kokudayiswa kabusha kwe-reflow kubangelwa ngokuyinhloko ukukhethwa kwe-tape engalungile noma inqubo engalungile. Ngezansi isethi ehlelekile yezixazululo:

I. Umsuka Ukuhlaziywa Kwezinsalela Ezinamathelayo & Nokopha

1. I-Adhesive Residue  Kwenzeka lapho i-adhesive ihluleka ukuhlangana (ukudabuka kwangaphakathi kwesendlalelo se-adhesive) noma ukwehluleka kokudlulisa okuhlangene (okunamathiselwe okunamathiselwe ku-substrate futhi kunamathele eminwe yegolide). Izibangeli ezivamile zifaka ukumelana nezinga lokushisa okunganele kwetheyiphu, okunamathelayo okugugile, noma isikhathi sokuxebuka esingafanele.

2. I-Adhesive Bleed  I-viscosity ye-adhesive yehla kakhulu ngaphansi kwezinga lokushisa eliphakeme lokugeleza kabusha, okuholela ekukhuphukeni kwe-fluidity kakhulu. Ngaphansi kwengcindezi ye-lamination kanye nesenzo se-capillary, i-adhesive igcwala umkhawulo we-tape. Lokhu kuvame ukubangelwa ukunamathiswa okunamathelayo okuminyene ngokweqile, ukukhuphuka kwezinga lokushisa ngokushesha, noma ukungezwani kahle kokunyakazisa okushisayo kwe-adhesive ngokwayo.

II. Ukukhetha Okufanelekile Kwetheyiphu - Isixazululo Esiyinhloko

Itheyiphu ye-PTFE evamile ayikwazi ukuhlangabezana nezimfuneko ezidlulele zezinqubo ze-SMT. Imikhiqizo eklanyelwe ngokukhethekile ukuvikela iminwe yegolide ye-SMT kufanele ikhethwe, kunikezwe kuqala ukusebenza kwesistimu yokunamathela:

 

· Ibanga Lokumelana Nezinga Lokushisa : Ukumelana nezinga lokushisa eliphakeme lesikhathi esifushane ≥ 300°C, izinga lokushisa lesevisi eqhubekayo ≥ 260°C, elidlula kude izinga lokushisa eliphakeme le-reflow soldering engenamthofu (245–250°C).

· Ugqinsi Lwesendlalelo Esinamathelayo : Ukujiya okuphezulu akufani nokunamathela okuqinile. Uncamela amateyipu anogqinsi oluphelele luka-0.08–0.13mm, afaka izendlalelo zokunamathela ezincanyana kodwa ezinamathele kakhulu ukuze kwehliswe kakhulu ingozi yokopha.

· Isitifiketi Sokungakophi Nezinsalela : Cela imibiko yokuhlola evimbela ukopha nensalela enikezelwe ekuvikelweni kweminwe yegolide ye-SMT kubahlinzeki, futhi wenze ukuhlola kwangempela kwesithando somlilo ngamasampula.

III. Izinga Lokulawula Izinyathelo Eziyisithupha

1. I-Pre-Lamination: Ukuhlanza Ubuso Nokwelashwa Kwangaphambili

· Ukususa amafutha okuphelele: Iminwe yegolide nezindawo ezizungezile ze-PCB kufanele zingabi namabala omjuluko, izingcolisi zikawoyela nezinsalela ezigelezayo. Sula ngendwangu engenayo i-lint ecwiliswe ku-ethanol anhydrous noma i-isopropyl alcohol (IPA), bese womisa ngokuphelele emoyeni.

· I-substrate eyomile: Qinisekisa ukuthi ama-PCB awanawo umswakama ngokuphelele ngaphambi kokufaka itheyiphu.

2. Lamination: Zero Tension & Full Air Emocuation

· Ungayeluli itheyiphu: I-PTFE substrate ine-ductility enhle. Ukwelula ngesikhathi se-lamination kudala ukucindezeleka kwangaphakathi okubangela ukuncipha ngaphansi kwezinga lokushisa eliphezulu, okuholela ekudabukeni kwe-adhesive, insalela noma ukopha ngendlela ethile. Beka itheyiphu isicaba ngokwemvelo phezu kweminwe esagolide bese ucindezela kancane ukuze unamathele ekuqaleni.

· Ukukhipha umoya ogcwele: Sebenzisa i-roller ezinikele noma i-hard scraper ukuze usunduze kancane kancane ungaqondile usuka phakathi nendawo uye ezinhlangothini zombili ukuze uhlangane ngokugcwele. Qinisekisa ukunamathela okuphelele konqenqemeni ngaphandle kwamabhamuza omoya avaleleke; amabhamuza anda ngaphansi kokushisa futhi aphakamise imiphetho yetheyiphu, okubangela ukuchichima kokunamathela.

· Ukuqondanisa okunembayo: Qondanisa amaphethelo etheyiphu aguqe ngomunwe osagolide noma afakwe kancane ngo-0.2–0.5mm (uma umklamo uvuma). Ungalokothi umboze amaphedi noma ama-vias, njengoba i-capillary siphonage izodonsela ingcina encibilikisiwe ngaphandle.

3. I-Reflow Soldering: Lungiselela Iphrofayili Yezinga Lokushisa

· Landela ngokuqinile imiyalelo yetheyiphu yokushisa: Kala izinga lokushisa langempela lebhodi ukuze uqinisekise izinga lokushisa eliphakeme kanye nobude besikhathi sokushisisa buhlala phakathi kwebanga lokubekezelela itheyiphu.

· Irempu yokushisa ethambile: Gcina izinga lokushisa eliphansi (<2°C/s) ngaphambi kokufinyelela indawo yokuthambisa yokunamathela (150°C–200°C). Izinga lokushisa elibukhali kungazelelwe lithambisa ngokushesha ingcina futhi libhidlize i-viscosity yayo, okuholela ekopheni okukhulu.

4. Ukucwecwa Isikhathi: Ukucwecwa Okubandayo Kuletha Imiphumela Elungile

· Pholisa ngokuphelele ekamelweni lokushisa: Ngemva kokusoda, linda kuze kube yilapho izinga lokushisa le-PCB lehla ngaphansi kuka-50°C (izinga lokushisa elikahle le-ambient) ngaphambi kokucwecwa itheyipu. I-Adhesive ihlala ithambile futhi ihlangene kancane ekushiseni okuphezulu; ukuxebuka okuphoqelekile okushisayo kubangela kalula ukuhlukaniswa kwezingqimba kanye neglue esele.

· Indlela yokucwecwa: Hlula kancane nge-engeli engu-180° ephansi ngamandla afanayo. Ungadonsi kanzima uma uhlangabezana nokuphikiswa.

5. Ukuphathwa Kwenqubo: Lawula Impilo Yeshelufu & Imijikelezo Yokusebenzisa Kabusha

Faka isicelo futhi usebenze ngokushesha: Ama-PCB anetheyiphu elamiwe kufanele angene esithandweni sokugeleza kabusha ngokushesha. Gwema ukugcina isikhathi eside (ngaphezu kwamahora angu-24) endaweni yokusebenzela ukuze uvimbele ukumuncwa komswakama kanye nokunqwabelana kothuli.

· Ukusetshenziswa kanye kuphela kwephasi yomlilo: Itheyiphu yokushisa ephezulu ye-SMT iyinto esebenzisekayo. Ngisho noma i-tape ibonakala iphelele ngemva kokudlula kwesithando somlilo, i-adhesive iye yahlangana futhi yaguga; umjikelezo wesibili wokushisa ngokuqinisekile uzobangela izinsalela zokunamathela noma ukwehluleka kokunamathela. Kuma-PCB afakwe emaceleni amabili, buyisela itheyiphu entsha sha ngaphambi kokucubungula uhlangothi lwesibili ngemva kokudlula kokuqala.

6. Ukwehluleka Ukuphatha Isimo Esiphuthumayo Nokuqinisekisa

· Ukulahlwa kweglue eyinsalela encane: Misa ukukhiqiza ngokushesha uma kutholakala insalela. Sula ngobumnene ngendwangu engenantambo ye-IPA; thumela amabhodi okuhlanzwa kochwepheshe ezimweni ezinzima. Ungalokothi ukhuhle ngamathuluzi aqinile.

· Ukuqinisekiswa kwetheyiphu entsha yokufaneleka: Yenza ukukhiqizwa kwesivivinyo esigcwele nge-PCB yangempela engu-1:1. Ngemva kokudlula kwesithando somlilo, cwecwa itheyiphu bese uhlola izindawo zeminwe yegolide ngaphansi kwesikhulisi esingu-40–50x ukuze uqinisekise ukuthi izinsalela eziyiziro nezinamathelayo eziyiziro ziyachichima.

Okuqukethwe okungenhla kwezobuchwepheshe kunikezwa ngu I-Jiangsu Aokai New Materials Technology Co., Ltd.

Uma ufisa ukuthola imininingwane eningiliziwe, izimo zohlelo lokusebenza nezixazululo ezenziwe ngokwezifiso zephothifoliyo yethu yomkhiqizo ogcwele ohlanganisa indwangu ye-PTFE yokushisa okuphezulu, i-PTFE high-temperature adhesive tape, PTFE high-temperature mesh belt, ibhande lokucindezela ukushisa elingenamthungo, indwangu ye-PTFE enohlangothi olulodwa, ulwazi oluthe xaxa lokushisa oluphezulu kanye nengilazi ekwazi ukumelana nokushisa sicela usithinte:

· Inombolo Yezinkonzo: Mnu. Guo +86 18944819998

· Inombolo Yezinkonzo: Mnu. Liu +86 13705266308

Sihlala sinamathela kufilosofi yesevisi egxile ekuqeqesheni nasekuthembekeni, sinikeza ngenhliziyo yonke izixazululo zezimboni kanye nenkonzo yamakhasimende ecabangelayo kubo bonke ozakwethu!