Mokhoa oa ho Thibela Masala a Adhesive & Adhesive Bleed of PTFE High-Temperature Tape Ha U Sireletsa PCB Menoana ea Khauta ho SMT Mounting

Jiangsu Aokai New Materials, moetsi ea hloahloa oa tepi ea mocheso o phahameng oa PTFE, o fana ka tataiso ea litsebi. Ha tepi ea mocheso o phahameng oa PTFE e sebelisetsoa ho sireletsa menoana ea khauta ea PCB nakong ea kopano ea SMT, masala a sekhomaretsi (li-deposit tse khomarelang tse setseng menoaneng ea khauta ka mor'a ho phunya tape) le ho tsoa mali a sekhomaretsi (sekhomaretsi se nolofatsa le ho phalla ka tlas'a mocheso o phahameng, ho silafatsa libaka tse sa sireletsoeng kapa libaka tsa PCB) ka mor'a hore reflow soldering e bakiloe haholo ke mokhoa o fosahetseng oa ho khetha parameter kapa mokhoa o fosahetseng. Ka tlase ke sete e hlophisitsoeng ea tharollo:

I. Motso oa Lebaka Analysis ea Adhesive Residue & Bleed

1. Sekhomaretsi Residue  E etsahala ha sekhomaretsi se utloa bohloko ho hloleha ha momahano (ho taboha ka hare ho lera la sekhomaretsi) kapa ho hloleha ha phetisetso ea sefahleho (sekhomaretsi se kopanya ho tloha substrate ebe se khomarela menoana ea khauta). Lintho tse susumetsang tse tloaelehileng li kenyelletsa ho hanyetsa mocheso o lekaneng oa tepi, sekhomaretsi sa khale, kapa nako e sa lokelang ea ho ebola.

2. Adhesive Bleed  The viscosity ea sekhomaretsi e theoha haholo tlas'a mocheso o phahameng oa ho phalla, e leng se lebisang ho phallo e matla ea metsi. Tlas'a khatello ea lamination le ketso ea capillary, sekhomaretsi se tšela moeli oa tepi. Hangata sena se bakoa ke sekhomaretsi sa sekhomaretsi se teteaneng haholo, ho phahama ha mocheso ka potlako, kapa sekhomaretsi ka bosona se hanana le mocheso o matla.

II. Khetho e nepahetseng ea Tape - The Core Solution

Theipi e tloaelehileng ea PTFE ha e khone ho fihlela litlhoko tse feteletseng tsa mekhoa ea SMT. Lihlahisoa tse etselitsoeng ka ho khetheha ts'ireletso ea menoana ea khauta ea SMT li tlameha ho khethoa, ho etelletsoe pele ts'ebetso ea sistimi e khomarelang:

 

· Temperature Resistance Grade : Ho hanyetsa mocheso oa nako e khutšoanyane ≥ 300 ° C, mocheso o tsoelang pele oa tšebeletso ≥ 260 ° C, o fetang hōle mocheso oa tlhōrō ea li-lead-free reflow soldering (245-250 ° C).

· Adhesive Layer Thickness : Botenya bo phahameng ha bo lekane le ho khomarela ka matla. Khetha litheipi tse nang le botenya bohle ba 0.08–0.13mm, tse nang le likarolo tse tšesaane tse homahantsoeng haholo ho fokotsa kotsi ea ho tsoa mali.

· Setifikeiti sa Sethibela ho Tsoa Mali le Masala a Mahala : Kopa litlaleho tsa liteko tse thibelang ho tsoa mali le ho se na masala tse etselitsoeng tšireletso ea menoana ea khauta ea SMT ho tsoa ho barekisi, 'me u etse tlhahlobo ea sebōpi ka lisampole.

III. Maemo a Mehato a Tšeletseng a Taolo ea Ts'ebetso

1. Pele ho Lamination: Ho Hloekisa Sefahleho & Phekolo ea Pele

· Ho tlosa mafura ka ho feletseng: Menoana ea khauta le libaka tse pota-potileng PCB li tlameha ho se be le matheba a mofufutso, litšila tsa oli le masalla a phallo. Hlakola ka lesela le se nang lesela le kentsoeng ka har'a anhydrous ethanol kapa isopropyl alcohol (IPA), ebe u omella ka ho feletseng moeeng.

· Dry substrate: Etsa bonnete ba hore li-PCB ha li na mongobo ka ho feletseng pele u sebelisa teipi.

2. Lamination: Zero Tension & Full Air Vacuation

· Se ke oa otlolla theipi: PTFE substrate e na le ductility e ntle. Ho otlolla nakong ea lamination ho baka khatello ea kelello e ka hare e etsang hore ho fokotsehe tlas'a mocheso o phahameng, ho fella ka ho taboha ha sekhomaretsi, masalla kapa ho tsoa mali ka tsela e itseng. Beha theipi ka mokhoa oa tlhaho holim'a menoana ea khauta 'me u hatelle hanyenyane bakeng sa ho khomarela qalong.

· Ho tlosa moea o feletseng: Sebelisa rolara e inehetseng kapa hard scraper ho sututsa butle unidirectionally ho tloha bohareng ho ea mahlakoreng ka bobeli bakeng sa ho tiisa ka ho feletseng. Etsa bonnete ba ho khomarela ka ho feletseng ntle le li-bubble tsa moea tse qabeletsoeng; li-bubble li atoloha tlas'a mocheso 'me li phahamisa litšepe tsa theipi, li baka sekhomaretsi se khaphatsehang.

• Peakanyo e nepahetseng: Lulahanya metshehla ya theipi e tlokomang ka menwana ya kgauta kapa o kenngwe hanyane ka 0.2–0.5mm (haeba moralo o dumela). Le ka mohla u se ke ua koahela li-pads kapa vias, kaha capillary siphonage e tla hula sekhomaretsi se entsoeng ka ho qhibilihisoa ka ntle.

3. Reflow Soldering: Ntlafatsa Boemo ba Mocheso

• Latela ka tieo lintlha tsa mocheso oa theipi: Lekanya mocheso oa 'nete oa boto ho netefatsa mocheso o phahameng le nako eohle ea ho futhumatsa ho lula ka har'a maemo a mamello a theipi.

· Tsela e bonolo ea ho futhumatsa: Boloka mocheso o liehang ho futhumatsa (<2°C/s) pele o fihla sebakeng sa ho nolofatsa sekhomaretsi (150°C–200°C). Li-spikes tsa mocheso tse bohale ka tšohanyetso li nolofatsa sekhomaretsi 'me li senya viscosity ea sona, e leng se lebisang ho tsoa mali ho matla.

4. Nako ea ho Peeling: Cold Peeling e Fana ka Liphetho tse Ntle

· Fokotsa ka ho feletseng ho mocheso oa kamore: Ka mor'a ho soasoa, ema ho fihlela mocheso oa PCB o theohela ka tlase ho 50 ° C (mocheso o loketseng oa tikoloho) pele o ebola theipi. Sekhomaretsi se lula se le bonolo ebile se kopane ka mocheso o phahameng; ho qobelloa ho chesoa ho chesa habonolo ho baka karohano ea lera le sekhomaretsi se setseng.

· Mokhoa oa ho ebola: Ebola butle ka angle e tlase ea 180 ° ka matla a tšoanang. U se ke ua hula ka thata haeba ho hanyetsoa.

5. Tsamaiso ea Ts'ebetso: Laola Shelf Life & Reuse Cycles

· Etsa kopo le ho sebetsa hang-hang: Li-PCB tse nang le theipi ea laminated li lokela ho kena ka sebōping sa reflow hang-hang. Qoba ho boloka nako e telele (ho feta lihora tse 24) ka har'a workshop ho thibela ho kenngoa ha mongobo le ho bokella lerōle.

· Tšebeliso e le 'ngoe feela bakeng sa ho feta sebōpi: Theipi ea mocheso o phahameng oa SMT ke ntho e ka sebelisoang. Esita le haeba tepi e bonahala e tiile ka mor'a hore sebōpi se le seng se fete, sekhomaretsi se 'nile sa kopana le ho tsofala; potoloho ea bobeli ea ho futhumatsa ka sebele e tla baka masala a sekhomaretsi kapa ho hloleha ho khomarela. Bakeng sa li-PCB tse kentsoeng mahlakoreng a mabeli, nkela sebaka ka theipi e ncha pele u sebetsana le lehlakore la bobeli ka mor'a ho feta pele.

6. Ho hloleha ho sebetsana le maemo a tšohanyetso le ho netefatsa

• Ho lahloa ha sekhomaretsi se senyenyane: Emisa tlhahiso hang hang ha masalla a fumanoa. Hlakola ka bonolo ka lesela le se nang lesela le kolobisitsoeng la IPA; romela mapolanka bakeng sa ho hloekisa litsebi maemong a boima. Le ka mohla u se ke ua senya ka lisebelisoa tse thata.

· Tiisetso e ncha ea ho tšoaneleha ha theipi: Etsa tlhahiso e felletseng ea liteko ka 1:1 li-PCB tsa 'nete. Ka mor'a hore sebōpi se fete, ebola theipi 'me u hlahlobe libaka tsa menoana ea khauta tlas'a se hōlisa 40-50x ho netefatsa masala a zero le sekhomaretsi sa zero se phallang.

Lintlha tse ka holimo tsa tekheniki li fanoa ke Jiangsu Aokai New Materials Technology Co., Ltd.

If you wish to obtain detailed specifications, application scenarios and customized solutions for our full product portfolio including PTFE high-temperature cloth, PTFE high-temperature adhesive tape, PTFE high-temperature mesh belt, seamless heat press belt, single-sided PTFE fabric, high-temperature resistant conveyor belt and heat-resistant fiberglass cloth, please contact us via the information below:

· Mohala oa Ts'ebeletso: Mong Guo +86 18944819998

· Mohala oa Ts'ebeletso: Monghali Liu +86 13705266308

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