Ndlela Yo Sivela Masalela ya Adhesive & Adhesive Bleed ya PTFE High-Temperature Tape Loko U Sirhelela Tintiho ta Nsuku ta PCB eka SMT Mounting

Jiangsu Aokai New Materials, muendli wa xiphurofexinali wa thepi ya mahiselo ya le henhla ya PTFE, u nyika nkongomiso wa xiphurofexinali. Loko PTFE high-temperature tape yitirhisiwa ku sirhelela tintiho ta PCB gold hinkarhi wa nhlengeletano ya SMT, masalela ya adhesive (sticky deposits leyi siyiweke eka tintiho ta nsuku endzhaku ka tape peeling) na adhesive bleed (adhesive yi olova no tala ehansi ka mahiselo yale henhla, ku thyakisa tindzhawu letinga sirhelelekangiki kumbe PCB surfaces) endzhaku ka reflow soldering swivangiwa ngopfu hiku hlawuriwa ka tape lokunga fanelangiki kumbe ku nga fambelani tipharamitha ta phurosese. Laha hansi ku na sete leyi hlelekeke ya swintshuxo:

I. Nxopaxopo wa Xivangelo xa Rimitsu ra Masalela ya Namarheta & Bleed

1. Masalela ya Adhesive  Swihumelela loko adhesive yi xaniseka hi cohesive failure (ku handzuka ka le ndzeni ka adhesive layer) kumbe interfacial transfer failure (adhesive yi hambana kusuka eka substrate naswona yi namarhela eka tintiho ta nsuku). Swilo leswi tolovelekeke leswi hlohlotelaka swikatsa ku tsandzeka loku ringaneleke ka mahiselo ya thepi, xinamarheti lexi dyuhaleke, kumbe nkarhi lowu nga fanelangiki wo rhurhumela.

2. Adhesive Bleed  Viscosity ya adhesive yi hunguteka swinene ehansi ka reflow high temperature, leswi tisaka ku tlakuka swinene ka fluidity. Ehansi ka ntshikelelo wa lamination xikan’we na capillary action, adhesive yi khuluka ehenhla ka tape edge. Leswi switala kuva swivangiwa hiku peta xinamarheti lexi tiyeke ngopfu, ku tlakuka ka mahiselo hiku hatlisa, kumbe ku tsandzeka ku lwisana na thermal creep ka xinamarheti hi xoxe.

II. Ku Hlawula Thepi loku Faneleke – Ntlhantlho wa Nkoka

Thepi ya PTFE leyi tolovelekeke a yi nge swi koti ku fikelela swilaveko swo tlula mpimo swa maendlelo ya SMT. Switirhisiwa leswi endleriweke ngopfu nsirhelelo wa tintiho ta nsuku wa SMT swifanele ku hlawuriwa, laha ku rhangisaka emahlweni matirhelo ya sisiteme ya namarheta:

 

· Giredi ya ku Tiyisela Mahiselo : Ku tiya ka mahiselo ya nhlohlorhi ya nkarhi wo koma ≥ 300°C, mahiselo ya vukorhokeri lebyi yaka emahlweni ≥ 260°C, ku tlula swinene mahiselo ya le henhla ya soldering ya reflow leyi nga riki na ntsopfu (245–250°C).

· Adhesive Layer Thickness : Ku enta ka le henhla a ku ringani na ku namarhela loku tiyeke. Hlawula ti tapes letingana vukulu hinkwabyo bya 0.08–0.13mm, letingana ti layers to olova kambe letingana high-cohesion adhesive layers kuva ti hunguta swinene khombo ro huma ngati.

· Xitifikheti xa Anti-Bleed & Residue-Free : Kombela swiviko swa swikambelo swa anti-bleed na residue-free leswi nyiketeriweke eka nsirhelelo wa tintiho ta nsuku wa SMT eka vaphakeri, na ku endla ku kamberiwa ka xiviri ka furniture hi swikombiso.

III. Xiyimo xa Vulawuri bya Maendlelo ya Magoza ya Tsevu

1. Pre-Lamination: Ku basisiwa ka le henhla & Ku tshungula ka ha ri emahlweni

· Ku susa mafurha hiku hetiseka: Tintiho ta nsuku na swiphemu swa PCB leswi rhendzeleke swifanele kuva swinga ri na swivati ​​swa nyuku, swilo leswi thyakeke oyili na masalela ya flux. Sula hi lapi leri nga riki na lint leri cheriweke eka ethanol leyi nga riki na mati kumbe isopropyl alcohol (IPA), kutani u omisa hi moya hi ku helela.

· Dry substrate: Tiyisisa leswaku ti PCBs ati na ndzhongho hiku hetiseka loko kungase cheriwa thepi.

2. Lamination: Zero Tension & Ku Humesiwa ka Moya Hinkwawo

· Unga olovi thepi: PTFE substrate yina ductility ya kahle. Ku olola hinkarhi wa lamination swiendla leswaku kuva na ntshikelelo wale ndzeni lowu hlohletelaka kuhunguteka ehansi ka mahiselo yale henhla, leswi endlaka leswaku kuva na ku handzuka ka adhesive, masalela kumbe positional bleed. Veka thepi yi flat hi ntumbuluko ehenhla ka tintiho ta nsuku kutani u tshikelela nyana leswaku yita namarhela rosungula.

· Ku susiwa ka moya hiku hetiseka: Tirhisa roller leyi tinyiketeleke kumbe hard scraper ku susumeta hiku nonoka hi tlhelo rin’we kusuka exikarhi kuya eka matlhelo hamambirhi kuva yi hlanganisiwa hiku hetiseka. Tiyisisa ku namarhela loku heleleke ka makumu handle ka swiphemuphemu swa moya leswi khomiweke; ti bubbles ti andlala ehansi ka ku hisa naswona ti tlakusa matlhelo ya thepi, leswi endlaka leswaku ku tala ka namarheta.

· Ku ringanisa loku kongomeke: Lulamisa matlhelo ya thepi hi ku fambisana na makumu ya tintiho ta nsuku kutani u nghenisiwa nyana hi 0.2–0.5mm (loko dizayini yi pfumela). Unga tshuki u funengeta ti pads kumbe ti vias, tani hileswi capillary siphonage yingata koka molten adhesive kuya ehandle.

3. Reflow Soldering: Ku antswisa Profayile ya Mahiselo

· Landzelela hi ku hetiseka swihlawulekisi swa mahiselo ya thepi: Pima mahiselo ya xiviri ya le henhla ka bodo ku tiyisisa mahiselo ya nhlohlorhi na nkarhi hinkwawo wa ku hisa ku tshama endzeni ka mpimo wa ku tiyisela ka thepi.

· Ramp yo hisa yo olova: Hlayisa mpimo wo hisa hiku nonoka (<2°C/s) loko unga se fika eka ndzhawu yo olova ya adhesive (150°C–200°C). Ku tlakuka ka mahiselo loku tlhavaka hi xitshuketa ku olovisa xinamarheti hi ku hatlisa naswona ku wisa ku tsindziyela ka xona, leswi endlaka leswaku ku huma ngati swinene.

4. Nkarhi wo Peeling: Ku Peeling Hi Xirhami Swi Tisa Vuyelo Lebyinene

· Pfuxeta hiku hetiseka kuya eka mahiselo ya kamara: Endzhaku ko solder, yimela kufikela loko mahiselo ya PCB ya hunguteka ehansi ka 50°C (hindlela leyinene mahiselo ya ndzhawu) loko unga se rhurhumela thepi. Xinamarheti xitshama xiri olovile naswona xiri ehansi ka ku hlangana eka mahiselo yale henhla; ku sindzisiwa ku hisa hi ku olova swi vanga ku hambanisiwa ka leyara na masalela ya glue.

· Thekiniki yo hlantswa: Hluvula hiku nonoka eka angle yale hansi ya 180° hi matimba yofana. U nga kokeli hi matimba loko ku hlangana na ku lwisana.

5. Vulawuri bya Maendlelo: Vulawuri bya Vutomi bya Xefele & Swiyenge swa ku Tirhisa Nakambe

· Chela no lulamisa hiku hatlisa: Ti PCBs letingana laminated tape tifanele ku nghena eka reflow furnace hiku hatlisa. Papalata ku hlayisiwa nkarhi woleha (ku tlula 24 wa tiawara) eka workshop ku sivela ku amukeriwa ka ndzhongho xikan’we naku hlengeletiwa ka ntshuri.

· Ku tirhisiwa kan’we ntsena eka ku hundza ka furniture: SMT thepi ya mahiselo yale henhla i xitirhisiwa lexi lahliwaka. Hambiloko thepi yi vonaka yi nga onhakanga endzhaku ka loko ku hundze furniture kan’we, xinamarheti lexi xi endliwe hi crosslinking naswona xi dyuharile; xirhendzevutani xa vumbirhi xo kufumeta hakunene xi ta vanga masalela ya namarhela kumbe ku tsandzeka ka ku namarhela. Eka ti PCB leti vekiweke hi matlhelo mambirhi, cinca hi thepi leyintshwa swinene loko unga se tirhisa tlhelo ra vumbirhi endzhaku ka ku hundza kosungula.

6. Ku Hluleka Ku Khoma & Ku Tiyisisa ka Xihatla

· Ku lahliwa ka glue leyintsongo leyi saleke: Yimisa vuhumelerisi hiku hatlisa loko masalela ya kumiwile. Sula hi vukheta hi lapi leri nga riki na lint leri tsakamisiweke hi IPA; rhumela tibodo ta ku basisiwa ka xiphurofexinali eka swiyimo swo tika. U nga tshuki u khwaxa hi switirhisiwa swo tika.

· Ku tiyisisiwa ka vuswikoti bya thepi leyintshwa: Endla vuhumelerisi bya swikambelo leswi heleleke hi 1:1 ya ti-PCB ta xiviri. Endzhaku ka loko furnace pass, hlantswa tape kutani u kambela tindzhawu ta tintiho ta nsuku ehansi ka 40–50x magnifier ku tiyisisa zero residue xikan’we na zero adhesive overflow.

Vuxokoxoko bya xithekiniki lebyi nga laha henhla byi nyikiwa hi Jiangsu Aokai Switirhisiwa Leswintshwa Thekinoloji Co., Ltd.

Loko u lava ku kuma swihlawulekisi leswi nga na vuxokoxoko, swiyimo swa xikombelo na swintshuxo leswi endleriweke photifoliyo ya hina leyi heleleke ya swikumiwa ku katsa na lapi ra mahiselo ya le henhla ya PTFE, thepi yo namarhela ya mahiselo ya le henhla ya PTFE, bandi ra mesh ra mahiselo ya le henhla ya PTFE, bandi ro kandziyisa ku hisa leri nga na swirhabyani, lapi ra PTFE ra tlhelo rin’we, bandi ro fambisa leri nga lwisaniki na mahiselo ya le henhla na fiberglass leyi tiyiselaka ku hisa lapi, hi kombela u hi tihlanganisa hi ku tirhisa vuxokoxoko lebyi nga laha hansi:

· Nomboro ya Vukorhokeri: Tatana Guo +86 18944819998

· Nomboro ya Vukorhokeri: Tatana Liu +86 13705266308

Minkarhi hinkwayo hi namarhela filosofi ya vukorhokeri bya xiphurofexinali na vutshembeki, hi mbilu hinkwayo hi nyika swintshuxo swa tiindasitiri swa xiyimo xin’we na vukorhokeri bya vaxavi lebyi anakanyisisiweke eka vatirhisani hinkwavo!