Alesi Nàxe Mɔ Ðe Adhesive Residue & Adhesive Bleed of PTFE High-Temperature Tape Ne Wole PCB Sika Asibidɛwo Ta kpɔm le SMT Mounting

Jiangsu Aokai New Materials, si nye PTFE ƒe dzoxɔxɔ gã ƒe kasɛt wɔla bibi aɖe, naa mɔfiame dɔwɔla bibiwo. Ne wozã PTFE ƒe dzoxɔxɔ gã ƒe kasɛt tsɔ kpɔ PCB sika asibidɛwo ta le SMT ƒe kpekpe me la, nusiwo wotsɔ léa nu ɖe nu ŋu ƒe nugbagbevi (nu siwo léna ɖe sika asibidɛwo ŋu siwo wogblẽ ɖe sika ƒe asibidɛwo dzi le kasɛt ƒe ʋuʋu vɔ megbe) kple nusiwo léna ɖe nu ŋu ƒe ʋu (nulénu la fa eye wòyɔa fũ le dzoxɔxɔ gã me, ɖiƒoƒo teƒe siwo womekpɔ ta na o alo PCB ƒe anyigbawo dzi) le reflow soldering megbe koŋ tsoa tape tiatia si mesɔ o alo esi mesɔ o gbɔ dɔwɔwɔ ƒe nɔnɔmetatawo. Egbɔkpɔnu siwo wowɔ ɖe ɖoɖo nu le ete:

I. Ke si gbɔ wòtso ƒe numekuku le Adhesive Residue & Bleed ŋu

1. Adhesive Residue  Edzɔna ne adhesive la kpe fu le cohesive failure (adhesive layer ƒe ememe vuvu) alo interfacial transfer failure (adhesive ɖe eɖokui ɖa le substrate la ŋu eye wòléna ɖe sika asibidɛwo ŋu). Nusiwo gbɔ wòtsona zi geɖe dometɔ aɖewoe nye dzoxɔxɔ si mete ŋu nɔa te ɖe dzoxɔxɔ nu nyuie o, nusi léna ɖe nu ŋu si tsi, alo ɣeyiɣi si mesɔ o be wòaɖee.

2. Adhesive Bleed  Adhesive ƒe ʋeʋẽ ɖiɖina ŋutɔ le reflow ƒe dzoxɔxɔ gã me, si wɔnɛ be tsi ƒe sisi dzina ɖe edzi ŋutɔ. Le lamination ƒe nyaƒoɖeamenu kple capillary action te la, adhesive la yɔa tape la ƒe go dzi. Zi geɖe la, nusi hea esia vɛ to nusi wotsɔ blaa nu si le kpekpem akpa, dzoxɔxɔ ƒe dziyiyi kabakaba, alo aŋea ŋutɔ ƒe dzoxɔxɔ ƒe ʋuʋu nyuie o gbɔ.

II. Tape Tiatia Nyui – Egbɔkpɔnu Vevitɔ

PTFE kasɛt dzrowo mate ŋu aɖo SMT ƒe dɔwɔwɔwo ƒe nudidi siwo gbɔ eme gbɔ o. Ele be woatia nusiwo wowɔ etɔxɛe na SMT sika asibidɛwo takpɔkpɔ, eye woatsɔ nusiwo wotsɔna léa nu ɖe ​​nu ŋu ƒe dɔwɔwɔ aɖo nɔƒe gbãtɔ:

 

· Dzoxɔxɔ ƒe Tsitretsitsi ƒe Dzeside : Ɣeyiɣi kpui aɖe ƒe dzoxɔxɔ ƒe kɔkɔƒe ƒe tsitretsitsi ≥ 300°C, subɔsubɔ ƒe dzoxɔxɔ si yia edzi ≥ 260°C, si wu dzoxɔxɔ ƒe kɔkɔƒe si le lead-free reflow soldering (245–250°C) ŋu sã.

· Adhesive Layer Thickness : Titrime si kɔkɔ wu mesɔ kple adhesive sesẽ o. Milɔ̃a kasɛt siwo ƒe titrime katã nye 0.08–0.13mm, siwo me wotsɔa nulénu siwo le tsɛ gake wowɔa ɖeka ŋutɔ la le be woaɖe ʋu ƒe dodo ƒe afɔkua dzi akpɔtɔ ŋutɔ.

· Anti-Bleed & Residue-Free Certification : Bia anti-bleed kple residue-free dodokpɔ nyatakaka siwo wotsɔ ɖe adzɔgbe na SMT sika asibidɛ takpɔkpɔ tso nudzralawo gbɔ, eye nàwɔ dzodoƒe dodokpɔ ŋutɔŋutɔ kple kpɔɖeŋuwo.

III. Afɔɖeɖe Ade ƒe Dɔwɔwɔ Dzi Kpɔkpɔ ƒe Dzidzenu

1. Do ŋgɔ na Lamination: Anyigba dzi Dzadzɛnyenye & Do ŋgɔ na Atikewɔwɔ

· Ami ɖeɖe ɖa keŋkeŋ: Ele be sika ƒe asibidɛwo kple PCB ƒe anyigba siwo ƒo xlãe nanye esiwo me fifia ƒe ɖiƒoƒo, ami ƒe ɖiƒoƒo kple flux ƒe nugbagbevi siwo susɔ nanɔ o. Tsɔ avɔ si me ʋuʋudedi mele o si wotsɔ nyrɔ ɖe ethanol si me tsi mele o alo isopropyl alcohol (IPA) me, emegbe nàtsɔ ya aƒu gbe bliboe.

· Dry substrate: Kpɔ egbɔ be PCB-wo me tsi mele kura o hafi nàde kasɛt dzi.

2. Lamination: Zero Tension & Blibo Ya Ʋuʋu

· Mègakeke tape la o: PTFE substrate ƒe ductility nyui le esi. Kekeɖenudɔwɔwɔ le lamination me hea ememe nuteɖeamedzi si hea ʋuʋudedi vɛ le dzoxɔxɔ gã me, si wɔnɛ be adhesive vuvu, nusiwo susɔ alo ʋu si dona le teƒe aɖe. Da kasɛt la ɖe sika asibidɛwo dzi le dzɔdzɔme nu eye nàzi edzi vie be wòalé ɖe eŋu le gɔmedzedzea me.

· Ya ɖeɖe ɖa bliboe: Zã roller alo hard scraper si woɖo ɖi nàtsɔ atutu blewuu le mɔ ɖeka nu tso titina yi axa eveawo be wòaƒoe bliboe. Kpɔ egbɔ be nugbɔa lé ɖe nu ŋu bliboe ya ƒe kuɖɔ siwo xaxa manɔmee; kuɖɔwo kekena ɖe enu le dzoxɔxɔ te eye wodoa kasɛt ƒe goawo ɖe dzi, si wɔnɛ be nusiwo léna ɖe nu ŋu la yɔa wo me fũ.

· Woaɖoe ɖe ɖoɖo nu pɛpɛpɛ: Trɔ asi le kasɛt ƒe goawo ŋu wòasɔ kple sika asibidɛ ƒe gowo alo nàtsɔ wo ade eme vie 0.2–0.5mm (ne alesi wowɔe ɖe mɔ). Mègatsyɔ nu aŋekotokuwo alo ʋuƒo siwo wotsɔna toa nu dzi gbeɖe o, elabena ʋuka siwo me ʋu sina tona la ahe aŋenu si wotsɔ ƒo ƒui la ayi gota.

3. Reflow Soldering: Trɔ asi le dzoxɔxɔ ƒe nɔnɔmetata ŋu wòanyo wu

· Wɔ ɖe tape ƒe dzoxɔxɔ ƒe nɔnɔmewo dzi pɛpɛpɛ: Dzidze ʋuƒoa ƒe anyigba ƒe dzoxɔxɔ ŋutɔŋutɔ be nàka ɖe edzi be dzoxɔxɔ si de ŋgɔ wu kple dzoxɔxɔ ƒe ɣeyiɣi didime katã anɔ tepe la ƒe mɔɖeɖe ɖe nu ŋu ƒe didime nu.

· Dzoxɔxɔ ƒe mɔ fafɛ: Na dzoxɔxɔ ƒe tsɔtsɔme nanɔ blewu (<2°C/s) hafi nàɖo afisi wotsɔa nu léna ɖe nu ŋu fa (150°C–200°C). Dzoxɔxɔ si nu sẽ kpata la nana nusi léna ɖe nu ŋu la fa kabakaba eye wògbãa eƒe ʋeʋẽ, si wɔnɛ be ʋu dona vevie.

4. Ɣeyiɣi Si Woaɖe Aŋe: Aŋeɖeɖe Fafɛ Naa Nu Nyuitɔ Kekeake

· Fae bliboe va ɖo xɔme ƒe dzoxɔxɔ: Ne ètsɔ ga ƒoe vɔ la, lala vaseɖe esime PCB ƒe dzoxɔxɔ naɖiɖi va anyi wu 50°C (enyo wu be yame ƒe dzoxɔxɔ) hafi nàɖe kasɛt la ɖa. Atike si wotsɔna léa nu ɖe ​​nu ŋu la nɔa fafɛ eye mewɔa ɖeka boo o le dzoxɔxɔ si nu sẽ me; zitɔtɔ dzoe ɖeɖe bɔbɔe nana layer mamã kple residual glue.

· Peeling mɔnu: Peeling blewuu le dzogoe si bɔbɔ 180° kple ŋusẽ ɖeka. Mègahe sesĩe ne èdo go tsitretsiɖeŋu o.

5. Dɔwɔwɔ Dzikpɔkpɔ: Dziɖuɖu Shelf Agbenɔƒe & Gbugbɔgazã Tsitrenuwo

· Tsɔe de eme eye nàtrɔ asi le eŋu enumake: Ele be PCB siwo ŋu laminated tape le la nage ɖe reflow furnace la me enumake. Ƒo asa na edzadzraɖo ɣeyiɣi didi (si wu gaƒoƒo 24) le dɔwɔƒea be tsi nagaxɔe o eye ke nagaƒo ƒu o.

· Zi ɖeka-zazã ɖeɖeko na dzodoƒe yiyi: SMT dzoxɔxɔ gã tape nye disposable consumable. Ne kasɛt la dze abe ɖe wòle dedie le dzodoƒe ɖeka ƒe yiyi megbe gɔ̃ hã la, woto aŋenu la ƒe kadodo me eye wòtsi; dzoxɔxɔ ƒe tsatsam evelia ana nusiwo léna ɖe nu ŋu ƒe akpa si susɔ alo nusi léna ɖe nu ŋu nado kpo nu godoo. Le PCB siwo wotu ɖe axa eve dzi gome la, tsɔ kasɛt yeye ŋutɔ ɖɔ li wo hafi nàtrɔ asi le axa evelia ŋu le mɔzɔzɔ gbãtɔ megbe.

6. Dodokpɔ Kpatawo Gbɔkpɔkpɔ & Validation

· Glue si susɔ suesuesuewo tsɔtsɔ ƒu gbe: Dzudzɔ ewɔwɔ enumake ne wonya de dzesi nusiwo susɔ ko. Tsɔ avɔ si me ʋuʋudedi mele o si wotsɔ IPA ƒo tsii tutue blewu; ɖo ɖakawo ɖa be woatsɔ akɔ wo ŋu dɔnyala bibiwo le nɔnɔme sesẽwo me. Mègatsɔ dɔwɔnu sesẽwo ƒoe gbeɖe o.

· Tepe yeye ƒe dzeside ƒe kpeɖodzi: Wɔ dodokpɔ blibo wɔwɔ kple 1:1 PCB ŋutɔŋutɔwo. Ne dzodoƒea to vɔ la, ɖe kasɛt la ɖa eye nàlé ŋku ɖe sika asibidɛ ƒe teƒe siwo le 40–50x ƒe nudzidzenu te ŋu be nàɖo kpe zero residue kple zero adhesive overflow dzi.

Mɔ̃ɖaŋunyatakaka siwo le etame la tso Jiangsu Aokai Nu Yeyewo Mɔ̃ɖaŋununya Co., Ltd.

Ne èdi be yeaxɔ nyatakaka tsitotsito, dɔwɔwɔ ƒe nɔnɔmewo kple egbɔkpɔnu siwo wowɔ ɖe ɖoɖo nu na míaƒe adzɔnuwo ƒe ƒuƒoƒo bliboa siwo dometɔ aɖewoe nye PTFE dzoxɔxɔ gã avɔ, PTFE dzoxɔxɔ gã adhesive tape, PTFE dzoxɔxɔ gã mesh alidziblanu, seamless dzoxɔxɔ press alidziblanu, akpa ɖeka PTFE avɔ, dzoxɔxɔ kɔkɔ tsitretsitsi conveyor belt kple dzoxɔxɔ-tsitretsitsi fiberglass avɔ, taflatse te ɖe mía ŋu to nyatakaka siwo le ete dzi:

· Subɔsubɔdɔ ƒe Telefon: Aƒetɔ Guo +86 18944819998

· Subɔsubɔdɔ ƒe Telefon: Aƒetɔ Liu +86 13705266308

Míewɔna ɖe dɔnyala kple fɔmaɖimaɖi ƒe subɔsubɔ ƒe xexemenunya dzi ɣesiaɣi, eye míetsɔa dzi blibo naa dɔwɔƒewo ƒe kuxiwo gbɔ kpɔnu siwo woate ŋu akpɔ le teƒe ɖeka kple asisiwo subɔsubɔ si ŋu wobu nyuie na hadɔwɔlawo katã!