Sɛnea Wobesiw Adhesive Residue & Adhesive Bleed of PTFE High-Temperature Tape Bere a Worebɔ PCB Sikakɔkɔɔ Nsateaa Ho Ban wɔ SMT Mounting mu

Jiangsu Aokai New Materials, adwumayɛfo a wɔyɛ PTFE teyp a ɛyɛ hyew kɛse no de adwumayɛfo akwankyerɛ ma. Sɛ wɔde PTFE teyp a ɛyɛ hyew kɛse di dwuma de bɔ PCB sika kɔkɔɔ nsateaa ho ban bere a wɔreboaboa SMT ano a, ade a wɔde nkata so (nneɛma a ɛyɛ nnam a wogyaw wɔ sika kɔkɔɔ nsateaa so bere a wɔapete teyp no akyi) ne mogya a wɔde nkata so (ade a wɔde nkata so no yɛ mmerɛw na ɛboro so wɔ ɔhyew a ɛkɔ soro mu, ɛde efĩ ba mmeae a wɔmmɔ ho ban anaa PCB ani) wɔ reflow soldering akyi titiriw ne teyp a wɔpaw no yiye anaasɛ ɛnhyia nhyehyɛe parameters. Ase hɔ no yɛ ano aduru ahorow a wɔahyehyɛ:

I. Ntini a Ɛde Ba Nhwehwɛmu a Ɛfa Adhesive Residue & Bleed Ho

1. Adhesive Residue  Ɛba bere a adhesive no di nkogu wɔ cohesive failure (adhesive layer no mu tetew) anaasɛ interfacial transfer failure (adhesive no tetew fi substrate no ho na ɛbata sika kɔkɔɔ nsateaa ho). Nea ɛtaa kanyan no bi ne teyp a ɛmma ɔhyew ntumi nkɔ mu sɛnea ɛsɛ, ade a wɔde nkata so dedaw, anaa bere a ɛmfata a wɔde yiyi.

2. Adhesive Bleed  Adhesive no viscosity so tew kɛse wɔ reflow ɔhyew a ɛkorɔn ase, na ɛma nsu a ɛkɔ soro kɛse. Wɔ lamination nhyɛso ne capillary adeyɛ ase no, adhesive no bura teyp no ano. Mpɛn pii no, eyi fi ade a wɔde kata so a ɛyɛ den dodo, ɔhyew a ɛkɔ soro ntɛmntɛm, anaasɛ ɔhyew a ɛtwetwe ade a ade no ankasa ntumi nkɔ so yiye no so.

II. Teyp a Wɔpaw no Yiye – Ano aduru Titiriw

PTFE teapɔn a ɛyɛ daa no ntumi nni SMT nhyehyɛe ahorow no ahwehwɛde a ɛtra so no ho dwuma. Ɛsɛ sɛ wɔpaw nneɛma a wɔayɛ titiriw ama SMT sika kɔkɔɔ nsateaa ahobammɔ, na wɔde adhesive nhyehyɛe no adwumayɛ di kan:

 

· Ɔhyew a ɛko tia Grade : Bere tiaa mu ɔhyew a ɛsen biara a ɛko tia ≥ 300°C, ɔsom hyew a ɛkɔ so ≥ 260°C, ɛboro ɔhyew a ɛsen biara a kɔbere nnim reflow soldering (245–250°C) so koraa.

· Adhesive Layer Thickness : Thickness a ɛkorɔn no nyɛ pɛ adhesive a emu yɛ den. Pɛ teyp a ne nyinaa mu duru yɛ 0.08–0.13mm, a ɛwɔ ntama a ɛyɛ tratraa nanso ɛyɛ biako kɛse na ama mogya a ɛbɛtɔ no so atew kɛse.

· Anti-Bleed & Residue-Free Certification : Bisa anti-bleed ne residue-free sɔhwɛ amanneɛbɔ a wɔahyira so ama SMT sika kɔkɔɔ nsateaa ahobammɔ fi suppliers, na yɛ ankasa fononoo sɔhwɛ ne nhwɛsode.

III. Anamɔn Nsia Adeyɛ a Wɔde Di Dwuma Gyinapɛn

1. Pre-Lamination: Surface Cleaning & Pre-Ayaresa

· Degreasing koraa: Ɛsɛ sɛ sika kɔkɔɔ nsateaa ne PCB a atwa ho ahyia no yɛ nea fifiri nkekae, ngo a ɛyɛ fĩ ne flux nkae biara nni mu. Fa ntama a nsõ nnim a wɔde ahyɛ ethanol a nsu nnim anaa isopropyl alcohol (IPA) mu popa, afei ma mframa nwo koraa.

· Dry substrate: Hwɛ sɛ PCBs no nni nsuo koraa ansa na wode teyp ahyɛ mu.

2. Lamination: Zero Tension & Mframa a Ɛma Nnipa Nyinaa

· Ntrɛw teyp no mu: PTFE substrate wɔ ductility pa. Sɛ wɔtrɛw mu bere a wɔreyɛ lamination no de emu nhyɛso ba a ɛkanyan shrinkage wɔ ɔhyew a ɛkɔ soro mu, na ɛde adhesive tetetew, nkae anaa mogya a ɛba wɔ gyinabea ba. Fa teyp no to sika kɔkɔɔ nsateaa so sɛnea ɛte no petee na mia so kakra na ama abata ho mfiase no.

· Mframa a woyi fi hɔ nyinaa: Fa roller anaa hard scraper a wɔatu ho ama di dwuma de pia no brɛoo wɔ ɔkwan biako so fi mfinimfini kɔ afã abien no nyinaa ma ɛyɛ compaction koraa. Hwɛ hu sɛ anoano no bɛbata ho koraa a mframa ahurututu a ɛkyeree biara nni mu; ahurututu trɛw wɔ ɔhyew ase na ɛma teyp anoano so, na ɛma ntama a wɔde nkata so no boro so.

· Pɛpɛɛpɛ a ɛne ne ho hyia: Fa teyp anoano yɛ pɛpɛɛpɛ ne sika kɔkɔɔ nsateaa anoano anaasɛ fa hyɛ mu kakra 0.2–0.5mm (sɛ nhyehyɛe ma kwan a). Mma nkata pads anaa vias so da, efisɛ capillary siphonage bɛtwe ade a wɔde nkata so a wɔabɔ no akɔ abɔnten.

3. Reflow Soldering: Yɛ Ɔhyew Ho Nsɛm a Ɛyɛ Fɛ

· Di teyp hyew ho nkyerɛkyerɛmu so katee: Sua board no ani hyew ankasa na ama woanya awerɛhyem sɛ ɔhyew a ɛsen biara ne ɔhyew bere nyinaa bɛtra teyp no abodwokyɛre mu.

· Ɔhyew a ɛkɔ brɛoo: Kɔ so yɛ hyew brɛoo (<2°C/s) ansa na woadu baabi a wɔde ntama a ɛyɛ mmerɛw no yɛ mmerɛw (150°C–200°C). Ɔhyew a ano yɛ den mpofirim no ma ade a wɔde nkata so no yɛ mmerɛw ntɛmntɛm na ɛma ne ntini a ɛyɛ den no bubu, na ɛma mogya tu kɛse.

4. Bere a Wɔde Peeling: Peeling a Ɛyɛ Nwini no Ma Nea Ɛyɛ Paara

· Onwini koraa ma dan mu hyew: Sɛ wobɔ solder wie a, twɛn kosi sɛ PCB hyew bɛkɔ fam asen 50°C (ɛyɛ papa sɛ ɛhɔ yɛ hyew) ansa na woapepa teyp no. Adhesive kɔ so yɛ mmerɛw na ɛnyɛ den pii wɔ ɔhyew a ɛkɔ soro mu; ɛnyɛ den sɛ wɔhyɛ ɔhyew a wɔde yiyi no ma layer no mu tetew ne gluu a aka.

· Peeling technique: Peel brɛoo wɔ 180° anim a ɛba fam a ahoɔden a ɛyɛ pɛ. Sɛ wuhyia ɔsɔretia a, ntwe denneennen.

5. Adeyɛ ho nhyehyɛe: Control Shelf Life & Reuse Cycles

· Fa gu so na yɛ ho adwuma ntɛm ara: Ɛsɛ sɛ PCB ahorow a wɔde laminated tape ahyɛ mu no hyɛn reflow fononoo no mu ntɛm ara. Kwati sɛ wode sie bere tenten (bɛboro nnɔnhwerew 24) wɔ adwumayɛbea hɔ na amma nsu a ɛbɛtwetwe ne mfutuma anboaboa ano.

· Single-de di dwuma nkutoo ma fononoo pass: SMT high-temperature tape yɛ disposable consumable. Sɛ ɛte sɛ nea teyp no yɛ nea enni dɛm bere a fononoo biako atwam akyi mpo a, ade a wɔde nkata so no ayɛ crosslinking na ayɛ dedaw; akyinnye biara nni ho sɛ ɔhyew kyinhyia a ɛto so abien bɛma adhesive nkae anaasɛ adhesion adi nkogu. Sɛ wopɛ PCB ahorow a wɔde ahyɛ afã abien a, fa teyp foforo koraa si ananmu ansa na woadi ɔfã a ɛto so abien no ho dwuma wɔ bere a edi kan no akyi.

6. Nkonimdi Emergency Handling & Validation

· Glue a aka kakraa bi a wɔtow gu: Gyae ne yɛ ntɛm ara bere a woahu nkae no. Fa ntama a IPA ayɛ no nwini a ɛnyɛ nea ɛho ntew popa brɛoo; fa board ahorow kɔma adwumayɛfo a wɔyɛ adwumaden wɔ tebea horow a emu yɛ den mu. Mfa nnwinnade a ɛyɛ den ntwitwiw da.

· Teyp foforo a wɔfata ho adansedi: Yɛ sɔhwɛ a edi mũ a wɔde 1:1 PCB ankasa. Sɛ fononoo no twam wie a, yi teyp no na hwɛ sika kɔkɔɔ nsateaa mmeae wɔ 40–50x magnifier ase de si so dua sɛ zero residue ne zero adhesive overflow.

Mfiridwuma ho nsɛm a ɛwɔ atifi hɔ no, wɔde ma Jiangsu Aokai Nneɛma Foforo Mfiridwuma Co., Ltd.

Sɛ wopɛ sɛ wunya nsɛm a ɛkɔ akyiri, dwumadie tebea ne ano aduru a wɔayɛ ama yɛn nneɛma nyinaa portfolio a PTFE ntama a ɛyɛ hyew a ɛkorɔn, PTFE ɔhyew a ɛkorɔn adhesive tape, PTFE ɔhyew a ɛkorɔn mesh abɔso, seamless ɔhyew press abɔso, ɔfã biako PTFE ntama, ɔhyew a ɛkorɔn a ɛko tia conveyor belt ne ɔhyew-resistant fiberglass ka ho ntama, yɛsrɛ sɛ fa nsɛm a ɛwɔ aseɛ ha yi so di yɛn ho nkɔmmɔ:

· Ɔsom Ntrɛwmu: Owura Guo +86 18944819998

· Ɔsom Ntrɛwmu: Owura Liu +86 13705266308

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