Lesi sihloko sihlola imiphumela yokulawula ukungezwani kwewebhu phakathi ne-Teflon itheyiphu yetheyiphu yokushisa ephezulu yokushisa ku-PTFE substrate flatness kanye nokufana kwenamathela okunamathelayo. Imithelela ekucabani kwe-substrate: ukungezwani okudlula umkhawulo onwebekayo kubangela ukwelula kwepulasitiki okungenakulungiseka (ukwelulwa kwe-longitudinal, ukufinyela okunqamulayo), ukwakha ukuxega, imibimbi namaphethini angamagagasi; I-PTFE ingena ngaphansi kwengcindezi eqhubekayo iba 'iqhwa' ngemva kokupholisa, ibangele ukungalingani kwendawo; ukungezwani okuguquguqukayo okungalingani okuvela ekufananeni kwama-roller okungalungile kudala imiphetho egobile, amabhamuza amaphakathi, namamaki axegayo aqinile.

Lesi sihloko sihlola izinguquko zesakhiwo kwindwangu ye-PTFE ephezulu yokushisa ngesikhathi sokuguga. Izici ezine: PTFE enamathela microstructure — molecular chain scission and oxidation (carbonyl/carboxyl group ukwakheka), crystallinity izinguquko (ukuvuka ekuseni bese kuyawa), micro-crack kanye pinhole ukwakheka, surface powdering; I-fiber substrate yengilazi nesixhumi esibonakalayo — ukubola kosayizi/okuhlanganisayo okubangela ukulahleka kwesibopho, ukuqaqanjiswa kobuso kanye ne-delamination (amabhamuza, izindawo ezimhlophe), ukuguguleka kwenethiwekhi ye-glass fibre kanye ne-embrittlement, imvula ye-alkali metal oxide ebangela ukugqwala kwengcindezi; Ukwakheka nokubukeka kwe-macroscopic — ukushintsha kombala (omhlophe→obeige→onsundu→omnyama), ukuwohloka kokuncipha nokugoqeka, ukonakala kwendawo kanye nokulahlekelwa isicwebezelisi, ukuba yimpuphu lapho uthintwa, ukulahlekelwa ngokuphelele ukuguquguquka. Ingqikithi yokuguga: inqubo eqhubekayo 'yokonakaliswa kokumboza → ukwehluleka kwesixhumi esibonakalayo → ukuwohloka kwe-substrate.'

Lesi sihloko sihlanganisa indlela yokulawula isikhathi se-sintering sendwangu ye-PTFE ephezulu yokushisa. Indlela yokulawula eyinhloko: ukulungiswa kwesivinini somugqa. Isikhathi sokushisisa = ubude besigaba sokushisisa esisebenzayo ÷ isivinini sokuhamba kwendwangu. I-sintering threshold esebenzayo ingu-350°C (ngaphezulu kwaleli zinga lokushisa libalwa njengesikhathi sokushisa). Ukusabalalisa izinga lokushisa kwezindawo eziningi: ukushisa ngaphambili (100-250°C), i-sintering (360-395°C), ukulungiselelwa kwezinga lokushisa eliphezulu (380-390°C), ukupholisa (ngaphansi kuka-300°C). Izikhathi zokubhekisela ku-380-390 ° C: engasindi (0.08-0.13mm) imizuzwana engu-30-60; ejwayelekile (0.18-0.25mm) 1.5-3 imizuzu; isisindo (≥0.35mm) imizuzu engu-3-5. Ukuhlonza nokulungiswa: i-sintering ngaphansi (amandla aphansi, ukuchithwa kwempushana, imifantu emincane) → nciphisa isivinini ukuze kwandiswe isikhathi; i-sintering ngokweqile (iphuzi, i-brittleness, intuthu emhlophe) → khulisa isivinini ukuze unciphise indawo yokuhlala. Ukulingana kwesikhathi sezinga lokushisa kuvumela ukucwiliswa kwezinga lokushisa okuphezulu (395-405°C, imizuzwana) noma ukucwiliswa kancane kwezinga lokushisa eliphansi (360-375°C, amaminithi angu-5-8).

Lesi sihloko sichaza iphethini yoshintsho emandleni ahlangene we-PTFE ungqimba olunamathelayo lwetheyiphu yokushisa ephezulu ngemva kokuguga okuphezulu. Iphethini yezigaba ezintathu: Isiteji esikhuphukayo sokuphulukisa (ukuchayeka emazingeni okushisa aphezulu ku-200-260 ° C, amaqembu asalayo asebenzayo ayaqhubeka nokuphambana, ukuhlangana kuyanda kakhulu); Isiteji sokulingana esizinzile (izindlela zokuphambana maqondana nokuqedwa, ukubumbana kuhlala kuzinzile isikhathi eside); Ukuwohloka nokwehla kwesigaba (isikhathi esiningi/izinga lokushisa eleqile lidala ukuwohloka kweketango eliyinhloko, ukubumbana kuncipha, okunamathelayo kuyathamba futhi kuba nzima). Izimbangela eziyinhloko zokwehluleka ukuhlangana (ukudabuka kwangaphakathi okushiya insalela) kanye nokuminyanisa (ukugeleza okubandayo okuvela emaphethelweni ngenxa yokuncipha kwemodulus) kuyahlaziywa.

Lesi sihloko sichaza ngokusetshenziswa kwendwangu ye-Teflon enezinga eliphezulu lokushisa embonini yamandla elanga. Ukusetshenziswa okuyisisekelo ku-module lamination: indwangu yokukhululwa ebekwe ngenhla / ngezansi kwamamojula e-PV ivimbela i-EVA encibilikisiwe (140-150 ° C) ekubambeleleni ku-platen yokushisa noma ipuleti yerabha, ukuvikela imishini nokuqinisekisa izindawo ezibushelelezi zemojula; amabhande okuhambisa i-laminator okulayisha/ukulayishwa okuzenzakalelayo; Indwangu evikelayo ye-rubber platen enweba impilo yesevisi. I-cell stringer soldering: amabhande okuthutha athwala amaseli kanye neribhoni endaweni yokushisisa, anendawo engeyona induku emelana nokuguquguquka kanye nama-solder splash; ama-cushions epulatifomu yokufudumeza ama-soldering workstations. Ukushisa okuphezulu kokushisa: ukugoqa amashubhu okushisa, ama-thermocouples, izintambo kuma-laminator namahhavini okwelapha; imishini amakhethini okushisa okushisa kanye nezihlangu.

Lesi sihloko sihlanganisa izinyathelo zokwelashwa ezidingekayo zendwangu ye-fiberglass ngaphambi kwe-PTFE emulsion impregnation. Isinyathelo 1: Ukushisa/ukukhipha iwaxisi ku-300-450°C ukuze kususwe ngokuphelele i-wax kapharafini namafutha endaweni yefayibha (i-wax kapharafini, okuphuma kusitashi), okuqukethwe kwensalela yokulinganisa okudingekayo ngaphansi kuka-0.2%, kukhiqiza 'indwangu ekhishwa ukushisa.' Isinyathelo 2: Ukwelashwa ngamakhemikhali angaphezulu - ukusetshenziswa kwe-silane, i-KH-50 yokuhlanganisa i-KH-50 A-174) ukwakha ifilimu yokuhlanganisa amakhemikhali endaweni yefayibha, evumela ibhuloho lamangqamuzana phakathi kwemicu yengilazi ye-inorganic glass kanye ne-organic PTFE; izindwangu ezitholakala ngokudayisa eselashwe ngaphambilini zingaseqa lesi sinyathelo kodwa kufanele ziqinisekiswe. Isinyathelo sesi-3: Ukomisa nokushisa kuqala — ukomisa ku-80-120°C amahora angu-1-2 ukuze kuncishiswe umswakama ongaphansi kuka-0.1%, ukuvimbela ukwakheka kwamabhamuza/okungenalutho ngesikhathi sokwelashwa.

Lesi sihloko sinikeza izindlela zokuthuthukisa ukumelana nokukhasa kanye nokuzinza kwesikhathi eside kwe-teflon high-hold-temperature tape. Amasu ahlanganisa: Ukuthuthukiswa kwe-topology yenethiwekhi ye-molecular — high MQ silicone resin/gum ratio (1.2:1–2:1) yakha izizinda eziqinile zesigaba esiqinile; ukufakwa kwamaqembu e-phenyl (20-30 mol%) kuvimbela ukunyakaza kweketango; I-crosslink isisindo se-molecular elawulwa ku-5,000-15,000 g / mol; I-Gradient modulus multilayer adhesive structure — primer-anchoring layer (1-3μm) ene-silane coupling agent, high-modulus cohesive layer (30-50μm) njengohlaka lwamathambo olumelana ne-shear, ungqimba olusebenzayo lwe-viscoelastic (3-8μm) lokumanzisa phezulu; Ama-Nanofillers - i-silica evuthayo (10-25 wt%) enokuguqulwa kwendawo idala ukuphambana komzimba okubuyiselekayo.

Lesi sihloko sihlola izinguquko zesakhiwo sendwangu ye-fiberglass ehlanganiswe ne-PTFE ezindaweni ezigqwalile ngamakhemikhali. Ukufakwa kwe-PTFE kuzinze ngokwedlulele emithonjeni eminingi yezindaba (okuhlanganisa i-aqua regia, ama-acid agxilile, izinyibilikisi eziphilayo) - amaketanga wamangqamuzana ahlala engashintshile. Okuhlukile: izinsimbi ze-alkali ezincibilikisiwe zikhipha i-fluorine ebangela i-carbonization (nsundu/emnyama, eshwabene); ama-fluorinating agents aqinile (F₂, ClF₃) aphula umgogodla we-carbon-carbon; ezinye izinyibilikisi zohlobo lwe-Freon zibangela ukuvuvukala; ama-acid oxidizing agxilile ashisayo ethula kancane kancane amaqembu asezindaweni ezishisayo.

Lesi sihloko sichaza ngokusetshenziswa kwendwangu ye-fiberglass ehlanganiswe ne-PTFE embonini yezogesi kanye nogesi. Izindawo eziyisithupha eziyinhloko: Ukushisa nokushisa okuphezulu kakhulu - ukufakwa kwe-motor inter-turn/slot/phase insulation, i-transformer layer insulation, ukugoqa ikhoyili, ukuhlukaniswa kwemishini yokushisisa kagesi; Ukukhiqizwa kwe-copper-clad laminate kanye ne-PCB - indwangu yokukhulula ku-PCB lamination, prepreg kanye ne-CCL ehlanzekile yokudlulisa; I-elekthronikhi i-soldering — imaski ye-solder ye-wave/reflow soldering (ukuvikela umunwe wegolide), amabhande okuhambisa kuhhavini agelezayo, omata bendawo yokusebenzela, amakhava okuvikela isibhamu somoya oshisayo; Ikhebula nezintambo zokubopha — itheyiphu yokugoqa ikhebula lokushisa eliphezulu, imikhono eshisayo kanye namakhava angashi, amabhande okuhambisa amashubhu ancipha ukushisa; I-Anti-static kanye ne-cleanroom - amabhande okuthutha egumbi elihlanzekile kanye nomata bendawo yokusebenza, i-semiconductor kanye ne-photovoltaic ephezulu yokushisa yokushisa.

Lesi sihloko sethula izindlela zokuhlola zokunqanda ukunamathela kanye nezakhiwo zokuhlanza kalula zendwangu ye-fiberglass ehlanganiswe ne-PTFE ngokumelene namabala kawoyela nothuli. Izindlela zifaka: I-engeli yokuxhumana kanye nokuhlola amandla angaphezulu — i-engeli yokuthinta amanzi ngokuvamile >110°, i-rolling angle越小越好, amandla angaphezulu ku-18-20 mN/m; Ukuhlolwa kwekhasi lomshini — amandla e-peel angu-180° anetheyiphu evamile, ekahle <0.1 N/25 mm; Ukuhlolwa okulingisiwe kokumelana nowoyela — indlela yokushelela/yensalela yebala likawoyela, ukusebenza kahle kokuhlanza kokusula kusetshenziswa umehluko wombala ΔE isilinganiso (esincane ΔE = ukuhlanzwa okungcono), kanye nokuhlola komaka okunamafutha okusheshayo (ukuncipha kukayinki kubonisa ukunqanda ukungcola); Ukuhlola uthuli - indlela yokulungisa uthuli ngokuhlaziywa kwesithombe, ukususwa kothuli lokugeleza komoya okulinganisa ubuncane besivinini sokuphehla, kanye nokuhlolwa kwe-electrostatic adsorption ngokusebenzisa ukumelana nendawo; Ukuhlola ukuqina — phinda zonke izivivinyo ngemva kokuguga okunezinga lokushisa eliphezulu (260°C/300°C) noma ukuhuzuka kwe-Taber ukuze kuqinisekiswe ukuqina kokusebenza kwesikhathi eside.