2026-07-16
Dis atikul de egzamin di ifekt dɛm we wɛb tɛnsiɔn kɔntrol gɛt di tɛm we Teflon ay-tɛmpracha tep kɔtin de pan PTFE sabstret flatnɛs ɛn adhesive kɔtin yunifɔmiti. ifekt dεm pan di sabstεrayt flat: tεnshכn we pas εlastik limit de mek i de mek plastic strεch εn nεk we i nכ de rivεrsibl (lכnjitudinal εlongeshכn, transvas narכw), we de fכm slackness, wrinkles εn wev patεn; PTFE krip ɔnda sustayn tɛnsiɔn kin bi 'frɔzɛn' afta i dɔn kol, we kin mek di sɔfa nɔ ivin; di tεnshכn we nכ ivin transvas frכm pwεl rכla paralelism de mek di ed dεm we kכl, sεntri blistεr, εn tayt-lכs mak dεm we de apin wan wan tεm.
Rid Mɔ
2026-07-15, di 2026-07-15
Dis atikul de egzamin strɔkchɔral chenj dɛn na PTFE ay-tɛmpracha fabrik we i de ol. Fo aspek: PTFE kotin maykrostrכkchכ — mכlikul chen scission εn כksidεshכn (kabכnyl/kabכksil grup fכmeshכn), kristaliniti chenj (εli rayz dεn kכlaps), maykro-krak εn pinhol fכmeshכn, sכfayz pauda; Glas fayba sabstret ɛn intafɛs — sayzin/kɔpl ɛjɛn dikɔmpɔzishɔn we de mek di bɔnd lɔs, intafays dibɔnd ɛn delamination (blistering, wayt eria), glas fayba nɛtwɔk eroshɔn ɛn embrittlement, alkali mɛtal ɔksayd prɛsipitashɔn we de mek strɛs kɔrɛshɔn; Makroskopik strכkchכ εn apinεns — kכla chenj (wayt→bεj→brawn→blak), shrinkage difכmeshכn εn kכl, surface roughening εn gloss lכs, pauda we yu tכch, komplit lכs fכ fleksibiliti. Esεns fכ ol: progrεsiv prכsεs fכ 'kכtin dεgradashכn → intafεys fεil → sabstεrayt dεgradashכn.'
Rid Mɔ
2026-07-15, di 2026-07-15
Dis atikul de kɔba aw fɔ kɔntrol sintering tɛm fɔ PTFE ay-tɛmpracha fabrik. Kor kɔntrol we: layn spid ajɔstmɛnt. Sintering tεm = ifektiv hεtin sekshכn lεngth ÷ fabrik travul spid. Ifektiv sintering threshold na 350°C (abov dis temperechur de kaunt as sintering taim). Mɔlti-zon tɛmpracha distribyushɔn: prɛhitin (100-250°C), sinta (360-395°C), ay-tɛmpracha sɛtin (380-390°C), kol (dɔwn 300°C). rεfrεns tεm dεm na 380-390°C: laytwεyt (0.08-0.13mm) 30-60 sεkכnd; standad (0.18-0.25mm) 1.5-3 minit; hεvi (≥0.35mm) 3-5 minit. Identify ɛn ajɔstmɛnt: ɔnda-sintering (lɔ trɛnk, pauda shed, maykro-krak) → ridyus spid fɔ ɛkstɛnd tɛm; ova-sintering (yכlכ, brit, wayt fכm) → inkrεs spid fכ sכt di rεsidεns. Tεmprachכ-taym ikwal de alaw fכ hεy-tεmp fast sinta (395-405°C, sεkכnd) כ lכw-tεmp slo sinter (360-375°C, 5-8 minit).
Rid Mɔ
2026-07-15, di 2026-07-15
Dis atikul de diskraib di patεn we di chenj in kכhεsiv trεnk fכ PTFE hεy-tεmprachכ tep adhesive layεr afta hεy-tεmprachכr εj. tri stej patεn: di stej we de rayz afta di kכriכn (di εli hεy tεmprachכ εkspכzכn na 200-260°C, rεsidyual riaktiv grup dεm de kכntinyu fכ kכroslink, kכhεshכn de inkrεs bכku bכku wan); Stebul ikwilbɔri stej (krɔslinkin de aproch fɔ kɔmplit, kɔhyeshɔn de stil stebul fɔ lɔng tɛm); di dεgradashכn εn dεklin stej (we pasmak tεm/tεmpratura de mek di men chen dεgradashכn, di kכhεshכn de dכn, di adhesive de sכft εn i de tכk). di rut kכz dεm fכ kכhεsiv fεil (intanεt tearing lεf rεsidyu) εn swεl-כt (kol fכ fכm frכm ed dεm bikoz fכ di dεkrεshכn mכdulus) dεn analכz.
Rid Mɔ
2026-07-14
Dis atikul de tɔk mɔ bɔt aw fɔ yuz Teflon ay-tɛmpracha fabrik na di solar ɛnaji industri. Kor aplikeshɔn insay modul lamination: rilis fabrik we dɛn put ɔp/dɔwn PV modul dɛn de mek di molten EVA (140-150°C) nɔ de adhe to hitin plet ɔ rɔba plet, protɛkt di ikwipmɛnt ɛn mek shɔ se di modul sɔfays dɛn smol; laminator kɔnvayɔr bɛlt fɔ ɔtomɛtik lod/ɔnlod; rɔba platen protɛktiv fabrik we de ɛkstɛnd savis layf. Sεl stringer sכlda: kכnvayכr bεlt dεm we de kכri sεl dεm εn ribin tru hεt zon, wit nכn-stik sεf we de rεsist fכ fכlכ εn sכlda splash; hitin pletfɔm kusɛn fɔ sɔlda wok steshɔn dɛn. Insuleshɔn we gɛt ay tɛmpracha: rap fɔ ɔt tyub, tɛmokɔpl, kebul dɛn we de insay laminatɔ ɛn ɔvin fɔ mɛn; ikwipmɛnt tɛmal insuleshɔn kɔtin ɛn shild dɛn.
Rid Mɔ
2026-07-14
Dis atikul de kɔba di prɛtritmɛnt stɛp dɛn we dɛn nid fɔ fayv glas fabrik bifo PTFE ɛmulshɔn impregnashɔn. Step 1: Hɛt tritmɛnt/diwaks na 300-450°C fɔ pul parafin waks ɛn ɔyl frɔm fayv sɔfa (parafin waks, stach derivatives), rɛsɛdyual sayzin kɔntinyu we dɛn nid fɔ bi dɔŋ 0.2%, we de prodyuz 'heat-dewaxed fabric.' Step 2: Surface chemical treatment — application of silane coupling agents (KH-550, KH-560, A-174) fכ fכm kεmikכl bכndin film pan fayv sεf, we de mek mכlikul brij bitwin inכgεnik glas fayb dεm εn כrganik PTFE; di klos dɛn we dɛn dɔn trit bifo tɛm we dɛn kin sɛl kin skip dis step bɔt dɛn fɔ chɛk dɛn. Step 3: Dray ɛn prɛhɛt — drɛy na 80-120°C fɔ 1-2 awa fɔ ridyus di mɔstɔ kɔntinyu dɔŋ 0.1%, we go mek bɔbul/voyd nɔ fɔm we yu de mɛn.
Rid Mɔ
2026-07-14
Dis atikul de prɛzɛnt di we dɛn fɔ impɔtant krip rɛsistɛns ɛn lɔng tɛm holdin stebiliti fɔ ay-hold Teflon ay-tɛmpracha tep. Strateji dεm inklud: Mכlikul nεtwכk tכpכlכji optimayzεshכn — hεy MQ silikon rεsin/gכm rεshכ (1.2:1–2:1) fכm rigid had-fεz domεn dεm; inkכrporεshכn fכ fεnyl grup dεm (20-30 mol%) de hεndεr chen mכshכn; kroslink mכlikul wet we dεn kכntrol na 5,000-15,000 g/mol; Gradient modulus multilayer adhesive structure — praymer-anchoring layεr (1-3μm) wit silane kכplεn ejen, hεy-modulus kohεsiv layεr (30-50μm) as shia-rεsistant skel, viskoelastik fכnshכnal layεr (3-8μm) fכ surface wetting; Nanofillers — fumed silica (10-25 wt%) wit surface modifyeshɔn de mek rivεrsibl fyzikal kroslinkin.
Rid Mɔ
2026-07-13
Dis atikul de egzamin strɔkchɔral chenj dɛn na PTFE-kɔt fayv glas fabrik na kemikal kɔrosiv ɛnvayrɔmɛnt. PTFE kotin na ekstrim stebul in mכst midia (inklud aqua regia, kכnsantreyt asid, כrganik sכlvεnt dεm) — mכlikul chen dεm de stil nכ chenj. Eksepshכn dεm: mכlt alkali mεtal dεm de εkstrakt fluorin we de mek kabכnayzεshכn (brawn/blak, brital); strכng fluorinating ejen dεm (F2, ClF3) de brok kabכn-kabכn bakbon; sɔm Friɔn-tayp sɔlvɛnt dɛn kin mek pɔsin swel; hot kכnsantreyt כksidayzin asid dεm de introdכks pכlar grup dεm sכmtεm na di sכfa.
Rid Mɔ
2026-07-13
Dis atikul de tɔk mɔ bɔt aw fɔ yuz fayv glas klos we dɛn kɔt wit PTFE na di ilɛktronik ɛn ilɛktrik industri. Siks men eria dɛn: Ay-tɛmpracha insuleshɔn ɛn protɛkshɔn — moto inta-tɔn/slɔt/faz insuleshɔn, transfɔma layt insuleshɔn, kɔyl rap, ilɛktrik itin ikwipmɛnt ayzolayshɔn; Kɔpa-klad laminat ɛn PCB manufakchurin — rilis klos insay PCB lamineshɔn, prɛpreg ɛn CCL klin kɔnvɛyshɔn; Ilɛktronik sɔlda — sɔlda mask fɔ wev/riflɔ sɔlda (gold finga protɛkshɔn), riflɔ ɔvin kɔnvaysɔ bɛlt, sɔlda wok steshɔn mat, ɔt ɛya gɔn protɛktiv kɔva; Kebul ɛn waya hans — ay-tɛmpracha kebul rap tep, tɛmal sliv ɛn fayapruf kɔva, ɔt-shrink tubing ɛkspɛnshɔn prɔsesin kɔnvayɔr bɛlt; Anti-statik ɛn klin rum — klin rum kɔnvaysɔ bɛlt ɛn wok steshɔn mat, sɛmikɔndɔkta ɛn fotovoltayk ay-tɛmpracha kɔnvaysɔ.
Rid Mɔ
2026-07-13
Dis atikul de prizent evalueshɔn we fɔ anti-stik ɛn izi-klin prɔpati dɛm fɔ PTFE-kɔt fayvglas fabrik agens ɔyl stɛyn ɛn dɔst. di mεtכd dεm inklud: kכntakt εngl εn sכfayz εnεji tεst — wata kכntakt εngl tipikכl >110°, rכlin angle越小越好, sכfayz εnεji we i fayn fכ 18-20 mN/m; Mekanikal peel testin — 180° peel fos wit standad tep, ideal <0.1 N/25 mm; Simulated oil resistance tests — oil stain sliding/residue method, kwantiti wayp klin efyushɔn yuz kɔlɔ difrɛns ΔE mɛzhɔmɛnt (smɔl ΔE = bɛtɛ klin), ɛn kwik ɔyl mak tɛst (ink shrinkage de sho se gud anti-fouling); Anti-dɔst tɛst — dɔst sɛtul mɛtɔd wit imej analisis, ɛyaflɔ dɔst rimɔv we de mɛzhɔ minim blo-ɔf velositi, ɛn ilɛktrɔstatik adsɔpshɔn ɛvalueshɔn via sɔfays rɛsistiviti; Durability evaluation — ripit ɔl di tɛst dɛn afta ay-tɛmpracha ol (260°C/300°C) ɔ Taber abrasion fɔ mek shɔ se lɔng tɛm pefɔmɛns stebiliti.
Rid Mɔ