Kedu ka esi eme ka nkwụsi ike nke na-akpụ akpụ na nkwụsi ike nke ogologo oge nke Teflon dị elu nke teepu okpomọkụ ga-eme ka ọ dịkwuo mma?

I.MolecularNetworkTopologyMbulite nke SiliconeAdhesiveLayer–Na-emelite Nnukwu MgbochiCreep

1.HighMQResin/SiliconeRubberRatioand'Hard-Core' Structure

Ihe nrụpụta MQsiliconeresinasthecoretackifier na ihe na-agba ume, na-abawanye MQ/gumratioto1.2:1–2:1 (dị elu karịa ọkwa ọkọlọtọ).Nke a dị eluMQratio na-aga n'ihu na-aga n'ihu. siri ike' usoro siri ike 'microdomains n'ime isi ihe na-eme ihe, nke na-egbochi mmegharị nke siloxanechains na-eme ka usoro nchekwa ahụ dịkwuo elu na ihe na-eme ka ọ dịkwuo elu.

2.Mbabata nke Okpomọkụ-Na-eguzogide Otu Ndị Na-ahụ Maka Ọkụ na High-Bond-EnergyCrosslinking Saịtị.

Phenyl, diphenyl, ma ọ bụ carborane otu a na-ewebata na polydimethylsiloxane azụ ọkpụkpụ (dịka, 20-30mol% phenylcontent) na-egbochi ọkụ ọkụ ma na-ewepụ ma iko iko mgbanwe okpomọkụ na nke ahụ. Okpomọkụ rmaldecomposition.The crosslinking na-ahọrọ nke ọma n'ịrụ ọrụ mgbakwunye-curehydrosilylation (Pt-catalyzed), na-akpụ-C-C-ma ọ bụ-Si-C-crosslinkingbridges nwere oke okpomọkụ.

3.ControlofMolecular arọ n'etitiCrosslinks(Mc) na NetworkDefects

Site kpọmkwem na-edozi ihe dị n'ime hydrogenogen yana ogologo ogologo nke mmanụ silikone dị na ya, nke dịkarịsịrị smallanduniformMc (ihe dị ka 5,000-15,000g/mol) enwetara, na-ahụta na net na-arụ ọrụ na-arụ ọrụ dị elu na-enwekwa oke ọkụ. Mgbatị-mkpesa-ịgwọta oke-okpomọkụ-okpomọkụ anụ ahụ na-etinyere ya n'otu oriri na-eri nri ma na-eme ka ntụrụndụ na-eme ka ahụ ghara ịdị nro kpatara mmebi nke netwọk.

II.GradientModulusMultiyerAdhesive Structure–BalancingTack andCreep Resistance

'Primer-anchoringlayer+Elu-moduluscohesivelayer+Viscoelasticfunctionallayer' atọ oyi akwa nhazi

1.Primer-anchoringlayer(1–3μm): na-ejisasilanecouplingagent nwereepoxyoracryloyloxygroups, tupu-polymerized naMQresin, inye kemịkalụ njikọ na PTFE substrate na ngalaba-crosslinking na elusiliconelayer.

2.High-moduluscohesivelayer (isi, approx.30-50μm): Jiri oke-MQ-ratio, elu-phenyl-ọdịnaya, elu-crosslink-densitysiliconeadhesivetofurnisharobustshear-eguzogide ọkpụkpụ.

3.Viscoelasticfunctionallayer(incontactwiththeadherend,3-8μm): Na-arụrụ ọrụ-MQ-ratioorhydroxy-treminatedsilicone-mmanụ-modifiedsoftsiliconeadhesivetolowersurfacemodulusandensurerapidwettingandconformabilitytotheadherendatelevatedtemperatures.

III.Nanofillers maka iwulite njikọ anụ ahụ yana ọkpụkpụ na-eguzogide okpomọkụ.

1.In-SituReinforcement andSurfaceMgbanwe nke Nano-Silica

Themanufacturerusesfumedsilica (kpọmkwem ihu ihu200-380m²/g), elu-agwọ ya na vinyltriethoxysilaneorhexamethyldisilazane,ataloading nke10-25wt%Thenano-SiO₂formshydrogenbonds na anụ ahụ na-agwọ ọrịa na siloxanechains. netwok ngbanwe nke anụ ahụ nke na-ekesanergyana na-egbochi molecularchainslippageathight. Mgbasa ozi dị elu na-eme ka ahụ sie ike na-adị “ụyọkọ” na agglomerates dị n'okpuru 100nm, na-ezere itinye uche.

2.DirectionalCreepResistancevia2DNanomaterials

Mgbakwunye nke 1–5wt% ole na ole-layergrapheneororgano-modifiednano-montmorillonite,nke na-adabere na nhazi nhazi site na ịkwanye akwa akwa n'oge mkpuchi mkpuchi, ụdị 'mazeeffect' paralleltothetapep. uzo, nke ukwuu na-abawanye nguzogide na molecularchainmotion n'ime ntụzịaka nke shear. Graphine na-enye oke arụrụ arụ arụrụ arụ, na-ebelata oghere dị n'ime ihe na-eme ka ọ dị nro ma na-egbu oge dị nro.

IV.ChemicallyIntegrated Substrate–AdhesiveInterface and ProcessControl

1.SurfaceActivation na BifunctionalPrimer makaChemicalBonding

A na-emezi PTFE elu ya na asodium-naphthalene-THFsolutionorlow-pressureargon/oxygenplasmatogenerateanactivatedlayer nwere carbonboxylandhydroxylgroups.Aprimersolution nwere ihe na-arụ ọrụ ụmụ irighiri ihe (dịka, isocyanatesilane, titanatecouplingagent+theepoxymedialy) ated.Oneendof nke izizi na-OH/-COOHonthePTFE elu, ebe nke ọzọ na-ekere òkè na hydrosilylation ma ọ bụ condensationcrosss njikọ na siliconeadhesive, na-eme a kemịkalụ network nke na-abanye n'ime interface. Nke a na-abịaru nso nwere ike ime ka elu-okpomọkụ2 ° 5.

2.RampedCuring na-ọgwụgwọ-ọgwụgwọ ga-ewepụ ntụpọ

A na-arụ ọrụ profaịlụ ngwa ngwa: nke mbụ, ihe mgbaze na-apụ na nke adhesivelayeris dị n'ogo 80-100C; mgbe ahụ hydrosilylation na nchikota nke MQresinere agwụla 150-170ºC; n'ikpeazụ, post -ịgwọ ọrịa nke 200-220 ° C ruo ọtụtụ awa ga-ewepụ ihe nrụgide dị n'ime ma na-edozi isi ihe jikọrọ anụ ahụ.

A na-enye ozi ndị dị n'eluJiangsuAokaiNewMaterialTechnologyCo.,Ltd.

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