Reba: 0 Umwanditsi: Muhinduzi wurubuga Gutangaza Igihe: 2026-07-14 Inkomoko: Urubuga
Imbonerahamwe
ThemanufactureradoptsMQsiliconeresinasthecoretackifierandreinforcingagent, yongeraMQ / gumratioto1.2: 1-2: 1 (cyane cyanehigherthanconventionalgrade). rigid 'icyiciro-gikomeye ' microdomains hamwe na headheadhesivelayer, ibyo bikaba byerekana ko bigenda neza cyane cyane
Fenyl, diphenyl, orcarboranegroupsareintroducedintothepolydimethylsiloxanebackbone (urugero, 20-30mol% fenilcontent) tohinderthermalchainmotionandraiseboththeglasstransitiontemperature nathe rmaldecompositiontemperature.
Bypreciselyadguhindura hydhydrogencontentandchainlengthofthehydrogen-irimo -iliconeoil, arelativelysmallanduniformMc (hafi 5.000-15,000g / mol) iragerwaho, ikanabyemeza. Akazi keza
1.Primer-anchoringlayer (1–3μm): Gukoreshaasilanecouplingagentcontainingepoxyoracryloyloxygroups, pre-polymerizedwithMQresin, toprovidebothchemicalbondingtothePTFEsubstrateandco-crosslinking hamwe nauppersiliconelayer.
2.High-moduluscohesivelayer (mainbody, hafi.30-50μm): Useshigh-MQ-igereranyo, fenili-yuzuye, ibirimo-guhuza-densitysiliconeadhesivetofurnisharobustshear-ristantskeleton.
3.Viscoelasticfunctionallayer (idahuye neza, 3-8 mm): Employslow-MQ-ratioorhydroxy-yarangiye-silicone-amavuta-yahinduwe -siliconeadhesivetolowersurfacemodulusandensurerapidwettingandconformabilitytotheadherendatelevatedtemperatures.
Uruganda rukora fumedsilica (spesurfacearea20038080⊃2; reversiblephysicalcrosslinkingnetworkthatdissipatesenergyandpreventsmolecularchainslippageathightemperature.
Ongeraho1–5wt% bike-layergrapheneororgano-yahinduwenano-montmorillonite, whichareorientedinalayeredarrangementthshear-inducedalignmentduringcoating, formsa 'mazeeffect ' paralleltothetapep umurongo, cyane cyane byongeraresistancetomolecularchainmotioninthesheardirection.Graphenealsooffersexcellentthermalconductivity, kugabanya ibibanza byibanze
ThePTFEsurfaceisfirsttreatedwithasodium - naphthalene - THFsolutionorlow-pressureargon / ogisijeneplasmatogenerateanactivatedlayercontaincarcarxyxydhydroxylgroups. kuri
Arampedcuringprofileisempleded: ubanza, solventaredrivenoffandtheadhesivelayerisleveledat80-100 ° C; -kwakira neza -200220 °
TheaboveinformationisprovidedbyJiangsuAokaiNewMaterialIkoranabuhangaCo., Ltd.
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