Go ka kaonefatšwa bjang go ganetša ga go gagabela le go tsepama ga go swara ga nako ye telele ga theipi ya themperetšha ya godimo ya Teflon yeo e swarago kudu?

I.Topology ya Neteweke ya DimolekuleGo kaonefatšaLegato la Sekgomaretši sa Silicone–Go kaonafatšaKganetšo ya BulkCreep

1.HighMQResin / SiliconeRubberRatioand 'Hard-Core ' Sebopeho

Motšweletši o amogelwa MQsiliconere bjalo ka sedirišwa sa go swara gape le sedirišwa sa go gapeletša, o oketša MQ/gumratioto1.2:1–2:1(e phagame kudu go feta mephato ye e tlwaelegilego).ThishighMQratioform e tšwela pele rigid'hard-phase'microdomainswithinheadhesivelayer, tse thibelang motsamao wa siloxaneketane dikarolo le haholo ntlafatsa polokomodule le cree presistance ya dithempereichara phahameng.

2.IncorporationofMocheso-ResistantRigidGroupsandHigh-Bond-EnergyCrosslinkingMafelo

Phenyl,diphenyl,goba dihlopha tša khaborane di tsenywa ka gare ga mokokotlo wa polydimethylsiloxane(mohlala, 20–30mol% ya diteng tša phenyl) go šitiša tšhišinyego ya ketane ya phišo le go godiša bobedi themperetšha ya kgatelelo ya galase le rmaldecompositiontemperature.Tshepedišo ya go kgokaganya sefapano ka go kgetha e šomiša tlaleletšo-phodišo ya hydrosilylation (Pt-catalyzed), e bopa–C–C–goba–Si–C–crosslinkingbridgewithsuperiorthermalstability.

3.Taolo yaBoima bja MolekhuleMagareng ga Dikgokagano tša Sefapano (Mc) le Diphošo tša Neteweke

Ka go beakanya ka nepo diteng tša hydrogen tše di šomago le botelele bja ketane ya siliconeoil yeo e nago le hydrogen, e fihleletšwe Mc ye nnyane ye e swanago (e ka bago 5,000–15,000g/mol), go netefatša gore nete mošomo o boloka go kgotlelela mo go phagamego go lekana le dithemperetšha tše dinyenyane.Go atološwa ka morago ga go fodiša goba themperetšha ya godimo e dirišetšwa go dihlopha tša karabelo tša mašaledi a bareki le go fokotša go iketla ga kgateletšego mo go bakwago ke diphošo tša netweke.

II.GradientModulusMultilayerSebopego sa Sekgomaretši–Go LekalekanyaTackandCreepResistance

'Primer-anchoringlayer + High-moduluscohesivelayer + Viscoelasticfunctionallayer 'tlhamo ya lera-tharo.'

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2.High-moduluscohesivelayer (mainbody, approx.30-50μm): Useshigh-MQ-karolelano, phahameng-phenyl-diteng, phahameng-crosslink-segokanyipalosiliconeadhesivetofurnisarobustshear-resistantskeleton.

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III.Di-NanofillersforGoAgaKgokagano ya Sefapano ya Mmele leSkeleton ye e Kganelago Mogote

1.In-SituReinforcementandSurfacePhetošo ya Nano-Silica

Batšweletši ba na le silika ya go nkga muši (lefelo le le itšego la bokagodimo la 200–380m²/g), bokagodimo bjo bo alafilwego ka vinyltriethoxysilanegoba hexamethyldisilazane, go rwala 10–25wt%.Thenano-SiO2 e bopa ditlemo tša hydrogen le go monya mmele ka diketane tša siloxane, go hlola neteweke ya go kgokaganya ya mmele ye e ka bušetšwago morago yeo e phatlalatšago maatla le go thibela diketane tša dimolekule tša go ropa matlakala a dithemperetšha tše ditelele.Go phatlalala ga go kuta mo go phagamego go netefatša gore silika e gona e le'dihlopha'ka bogolo bja dikgolo ka fase ga 100nm, go efoga go tsepama ga kgateletšego.

2.TlhahloCreepResistancevia2DNanomaterials

Tlaleletšo ya1–5wt% ya legato ye mmalwa ya graphenegoba organic-modifiednano-montmorillonite, yeo e lebišitšwego ka legato la peakanyo ya go ba le legato ka go logaganya mo go hlohleleditšwego ke go kuta nakong ya go tlotša, e bopa'mazeeffect'parallel tothetapep lane,go oketša kudu kganetšo go tšhišinyego ya ketane ya dimolekule ka lehlakoreng la go kuta.Graphenealsofferseexcellentthermalconductivity, go fokotša mafelo a go fiša ka gare ga legato la sekgomaretši le go bea go nolofala ga phišo.

IV.Segokaganyi sa Substrate–Sekgomaretši se se Kopantšwego ka Dikhemikhale le Taolo ya Tshepetšo

1.SurfaceActivationandBfunctionalPrimerfor Kgokagano ya Dikhemikhale

Bokagodimo bja PTFE bo alafša pele ka sodium–naphthalene–THFsolutiongoba argon/oxygenplasma ya kgatelelo ya fase go tšweletša legato le le šomišitšwego leo le nago le dihlopha tša carboxylandhydroxyl.Tlhollo ya aprimer ye e nago le dimolekule tše di šomago tše pedi(mohlala, isocyanatesilane,titanatecouplingent+epoxysilane)ke yona e lego ka pela ated.Onendoftheprimerreactwith–OH/–COOHonthePTFEsurface,mola e nngwe e tšea karolo ka hydrosilylation goba condensationcrosslinkingle siliconeadhesive, e bopa chemical bondnetwork yeo e tsenago ka gare ga segokanyimmediamentsi sa sebolokigolo.Mokgwa wo o ka oketša maatla a go swara themperetšha ya godimo (go 260°C) ka makga a 3–5.

2.RampedCuringandPost-KalafogoFesa Diphošo

Profaele ya go fodiša ye e aramped e šomišitšwe: sa mathomo, disolvent di a otlelwa le legato la sekgomaretši di lekaletšwe ka 80–100°C;ke moka hydrosilylation le go phuthelwa ga MQresina e phethilwe ka 150–170°C;mafelelong, poso -curingiscarriedoutat200–220°Cfors severalhourstofedisa kgateletšego ya ka gare le go tsepamiša dintlha tša go kgokaganya tša mmele.Go fodiša ka go nanya go thibela go phatloga ga microcack ka lebaka la go fokotšega ga phišo ya go fapana.

Tshedimošo ye e lego ka mo godimo e fiwa keJiangsuAokaiTheknolotši ya Didirišwa tše MpshaCo.,Ltd.

Ge o rata go hwetša tsebo ye e tseneletšego ya mohuta ka moka wa ditšweletšwa–go akaretšwa lešela la Teflon ya themperetšha ya godimo,theipi ya themperetšha ya godimo ya Teflon, lebanta la letlooa la themperetšha ya godimo ya Teflon, mapanta a go sepetša a seamless bakeng sa metšhene ya go kgokaganya, lešela la lehlakore le tee laPTFE, phahameng-mochesoresistantconveyorbelts,phahameng-mochesoresistantfiberglassfabric,le ho feta–gotee ledetailedspecifications,dikopo scenarios,and customizationsolutions,ka kōpo ikutloa lokolohiletocontactusthroughthefollowingchannels:

Mogala wa go fiša:

Mna.Guo:+86 18944819998

Mna.Liu:+86 13705266308 Mohlakanelwa

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