Hoʻopili ka mea hana i ka MQsiliconere i ka mea hoʻopaʻa paʻa a me ka mea hoʻoikaika ikaika, e hoʻonui ana i ka MQ/gum ratio1.2:1–2:1 (ʻoi aku ka kiʻekiʻe ma mua o nā pae kuʻuna). 'o'ole'a'paa-paa' microdomains i loko o ke po'o pa'a pa'a, ka mea e kaohi i ka ne'e 'ana i na kaulahao siloksane a me ka ho'omaika'i nui 'ana i ka waihona waihona a me ka ho'oki'eki'e 'ana i ka wela.
2. Hoʻohui ʻia o nā Pūʻulu Kūʻai Kūʻai Kūʻē wela a me nā Pūnaewele Hoʻohui Kiʻekiʻe
Hoʻokomo ʻia ka Phenyl, diphenyl, a i ʻole nā hui carborane i loko o ka iwi kuamoʻopolydimethylsiloxane (e laʻa, 20–30mol% phenyl maʻiʻo) i mea e pale ai i ke kaulahao wela a hoʻāla i ka mahana hoʻololi aniani a me ka rmaldecompositiontemperature.Thecrosslinkingsystempreferentiallyemploysaddition-curehydrosilylation(Pt-catalyzed),forming–C–C–or–Si–C–crosslinking bridges with superiorthermalstability.
3. Ka hoomalu ana i naMolecular WeightBetweenCrosslinks(Mc)and NetworkDefects
Ma ka hoʻoponopono pololei ʻana i ka ʻiʻo hydrogen a me ka lōʻihi o ka ʻaila silikone i loko o ka hydrogen, ʻano liʻiliʻi like ʻoleMc (ma kahi o 5,000–15,000g/mol) i loaʻa, e hōʻoiaʻiʻo ana i ka ʻupena. Hoʻohana ʻia ka hoʻomaʻamaʻa kiʻekiʻe ma hope o nā wela.
1.Primer-anchoringlayer(1–3μm): E hoʻohana i ka sasilanecouplingagentcontainingepoxyoracryloyloxygroups,pre-polymerized with MQresin,to provide bothchemicalbondingtothePTFEsubstrateandco-crosslinkingwiththeuppersiliconelayer.
2.High-moduluscohesivelayer (mea nui, approx.30–50μm): Hoʻohana i ka nui-MQ-ratio, kiʻekiʻe-phenyl-content, high-crosslink-densitysiliconeadhesivetofurnisharobustshear-resistantskeleton.
Hoʻohana ʻia ka mea hoʻohana i ka fumedsilica (kahi ʻili he 200–380m²/g), mālama ʻia i ka ʻili me ka vinyltriethoxysilane orhexamethyldisilazane, ka hoʻouka ʻana o 10–25wt%. Hiki ke hoʻohuli ʻia ka ʻupena hoʻopili kino e hoʻopau i ka ikehu a pale i nā kaulahao molekula a me ka ʻoi aku ka ikaika o ka wela.
2.DirectionalCreepResistancevia2DNanomaterials
Hoʻohui ʻia ʻo 1–5wt%few-layergraphene aorgano-modifiednano-montmorillonite, kahi i hoʻonohonoho ʻia i ka hoʻonohonoho ʻana i ka hoʻonohonoho ʻana ma o ka hoʻoheheʻe ʻana i ka ʻohi ʻana i ka wā o ka uhi ʻana, e like me ka 'mazeeffect'paralleltothe tapep ala, hoʻonui nui i ke kūʻē ʻana i ke kaulahao molekula ma ke kuhikuhi ʻana.
Ua mālama mua ʻia ka PTFE ʻili me ka sodium–naphthalene–THFsolution a i ʻole ka haʻahaʻa-pressureargon/oxygenplasmatogenerate anactivated layering carboxylandhydroxylgroups. Hoʻokahi ka hopena o ka mea mua me–OH/–COOH ma ka PTFE ʻili, aʻo kekahi e komo i loko o ka hydrosilylation a i ʻole condensation e hoʻopili ʻia me ka siliconeadhesive, hoʻokumu i ka pilina paʻa kiʻekiʻe.
2.RampedCuringandPost-TreatmenttoEliminateDefects
Hoʻohana ʻia ka ʻaoʻao Arampedcuring: ʻo ka mua, ʻaʻole i hoʻokuʻu ʻia nā mea hoʻoheheʻe a me nā ʻāpana hoʻopili i pae ʻia ma 80–100°C; a laila hoʻopau ʻia ka hydrosilylation a me ka hoʻopaʻa paʻa ʻana o MQresina ma 150–170°C; hope, hoʻopau - hoʻomaʻamaʻa ʻia ma 200–220°C no kekahi mau hola e hoʻopau i ka pilikia o loko a hoʻopaʻa i nā wahi hoʻopili kino.
Inā makemake ʻoe e loaʻa i ka ʻike hohonu o ka laulā piha o nā huahana–me ka lole Teflon-kiʻekiʻe, Teflon kiʻekiʻe ka wela wela, Teflon kiʻekiʻe-meshbelt, nā kāʻei hoʻolele maʻemaʻe no nā mīkini paʻa, ʻaoʻao hoʻokahi PTFE lole, nā kāʻei kūʻokoʻa wela, nā lole fiberglass kūpaʻa kiʻekiʻe, a me nā mea ʻē aʻe-me nā kikoʻī kikoʻī, nā hiʻohiʻona noiʻi, a me nā hoʻoponopono hoʻoponopono, e ʻoluʻolu e hoʻokaʻaʻike ma o nā ala e hiki mai ana:
Hoʻomau mākou i ka ʻoihana ʻoihana a me ka hoʻopono-hoʻoikaika ʻia i ka manaʻo lawelawe, ua hoʻolaʻa ʻia e hāʻawi iā ʻoe me ka hoʻonā hoʻokahi a me ka lawelawe mālama!
